Various mechanical behaviors of ultrafine-grained (UFG) materials produced by equal channel angular pressing (ECAP) generally exhibit distinctive characteristics from those of conventional grained materials, so that the relevant studies have received sustained attention in recent years. Apparently, the understanding of the fatigue properties (among various mechanical properties) of such UFG materials is of particular importance for their practical engineering applications, many investigators have thus been attempting to explore the fatigue deformation mechanisms of UFG materials, especially of UFG copper, with different emphases. It is now commonly recognized that the low-cycle fatigue damage in UFG materials primarily results from the formation of shear bands (SBs), which can extend over far larger scales than the initial grain size, and that the cyclic softening phenomenon as well as the deterioration in fatigue life under strain-amplitude-controlled tests in the low-cycle fatigue (LCF) regime is attributed to grain coarsening due to instabilities of the ECAPed structures during cycling. On the contrary, the fatigue life of UFG materials obtained under stress-controlled tests in the highcycle fatigue (HCF) regime is normally enhanced greatly as compared to their conventional counterparts. However, the details about cyclic deformation microstructures and shear band features in LCF and HCF regimes, respectively, are less understood so far. To further understand the possibly different fatigue deformation mechanisms of UFG copper in LCF and HCF regimes, the present contribution is to report the effect of the applied stress amplitude on the cyclic stress response behavior, surface damage features as well as relevant microstructural changes of such UFG copper materials. The applied stress amplitudes ranging from 100 MPa to 200 MPa are adopted to ensure that fatigue tests are carried out within both LCF and HCF regimes.