This study focuses on the corrosion of immersion silver (ImAg)-finished copper land patterns on printed circuit boards (PCBs) under H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S exposure. Eight test conditions were examined with varying levels of H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S, temperature, relative humidity, and exposure time. The results indicated both direct chemical-reaction corrosion and electrode-reaction corrosion, particularly galvanic corrosion. H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S gas was a stronger driving force for corrosion on ImAg-finished PCBs than SO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> gas. Temperature had a significant influence on ImAg-finished surface PCBs. Tests found extensive corrosion on ImAg-finished PCBs at 40°C, even in very low humidity. On ImAg-finished surfaces, the corrosion was nonuniform during the early period of exposure, with the corrosion modes being mainly pitting, open mouth, and particles. The corrosion products at this early stage mainly included Cu <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O and Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S. As time progressed, the corrosion products mainly included Ag <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S, Cu <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S, CuS, and CuO. These formed a passive film on the surface. ImAg-finished PCBs are vulnerable to H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S gas; nonuniform severe corrosion was found to occur at defects on the ImAg surfaces. The mixed-flow gas test produced creep corrosion on ImAg-finished PCBs using only H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S gas. Dendrite corrosion products growing from an edge with a solder mask were generally longer than those growing from an edge without a solder mask. The corrosion products of these dendrites mainly included Cu <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S or CuS.
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