Excellent Thermal Properties Research Articles

High thermally conductive polyimide film designed with heterostructural Cring-C3N4 filler and multilayer strategy

With the emerging of advanced flexible electronic, the PI film with excellent thermally conductive, flexible, lightweight, electrically insulating qualities is in high demand as a potential substrate and encapsulation material. Conventional thermally conductive fillers such as ceramic, metal and carbon material with high hardness, high density or electrical conductivity are unsuitable to prepare the advanced PI film. Furthermore, the confined loading of thermally conductive filler in PI matrix limited by its film-forming property is another obstacle to optimizing the thermal conductivity of PI film. In this work, the development of novel filler (carbon nitride in-plane grafted by two-dimensional carbon material, Cring-C3N4) with intrinsic thermal conductivity and a design of three-layer structure for the introduction of high filler loading have dramatically improved the thermal conductivity of PI film. Benefitting by the planar heterostructure construction of g-C3N4 and Cring, the existence of Cring increases the phonon transfer rate in g-C3N4, and the presence of g-C3N4 prevents the electron movement in the facet of Cring-C3N4 endowing its excellent electrical insulation property. The design of three-layer structure in which the first and third layers served as mechanical support layers with a fixed filler content (20 wt%). The second layer has the higher filler content to enhance the quantity of thermally conductive filler in PI film. Resultantly, the maximum out-of-plane thermal conductivity of the PI/Cring-C3N4 composite film is 1.35 Wm−1K−1, which is 10 times higher than the pure PI film. In addition, the PI/Cring-C3N4 composite film exhibit excellent photothermal conversion ability in which the saturation temperature of PI/Cring-C3N4 can reach 283.6 °C under 0.75 W/cm2 laser radiation being 6 times higher than that of the corresponding PI film. After the incorporation of Cring-C3N4, the PI composite film still has excellent thermal stability, low CTE, electrical insulation and mechanical properties. This work provides a novel idea for the preparation of advanced high thermal conductivity PI film.

Precipitation and tensile behaviors of Allvac 718Plus superalloy during long-term thermal exposure

Allvac 718Plus alloy is a promising Ni-based superalloy with excellent thermal stability and mechanical properties up to 704 °C. The γ′ coarsening, σ precipitation and the resulting degraded tensile properties at room and elevated (704 °C) temperatures during long-term thermal exposure at 704 and 760 °C are systematically investigated in this work. The results showed that a higher exposure temperature and a longer exposure time significantly accelerate the γ′ coarsening and σ precipitation. The σ particles were detrimental to the alloy by acting as the preferential nucleation sites for cracks, and the reduction in tensile strengths was mainly caused by the increasing size of γ′ precipitates during thermal exposure. Furthermore, there were significant differences between the deformation mechanisms of room-temperature and elevated-temperature (760 °C) tensile tests. Concerning the deformation mechanism of γ-matrix, planar slipping dominates during tensile testing at room temperature, while the formation of stacking faults and microtwinning are primary during tensile testing at elevated temperature (760 °C). The dominant precipitation strengthening mechanism depended on the γ′ characteristics of different thermal exposure conditions and the tensile temperature. The 704 °C/100 h exposure sample shows a dislocation shearing mechanism when tested at room or elevated (760 °C) temperature. Notably, the 760 °C/1000 h exposure sample exhibits a mixed precipitation strengthening mechanism of Orowan bypassing and superlattice stacking faults shearing when tensile tested at room temperature while showing a dislocation and superlattice stacking faults shearing mechanism when tensile tested at elevated (760 °C) temperature.

Micro-fabrication of glassy carbon with low shrinkage and high char yield using high-performance photocurable phthalonitrile (PN) resins

Glassy carbons (GCs) are a significant class of materials that have attracted considerable attention in many scientific and technical fields due to their great thermal and chemical stability, excellent biocompatibility, and remarkable thermal and electrical conductivity. However, the thermal resistance and brittle nature of GCs pose limitations on their processing using conventional techniques such as melting extrusion or sintering. 3D printing as a rapidly developing technology advances product fabrication in prototyping and tooling provides a revolutionizing alternative of material processing with the advantage of accurately producing complex structures/shapes. This study demonstrates the micro-fabrication of GC objects based on novel photocurable high-performance phthalonitrile (PN) resins with a vat photopolymerization printing technology named as projection micro stereolithography (PμSL). In initial, soluble acrylate PN monomers are successfully developed and subsequently formulated into photopolymerizable resins. The resultant resins show excellent thermal and mechanical properties with Tg around 300 °C and flexural strength of 150 MPa after post thermal treatment. Being fabricated into 3D structures via PμSL printing, the obtained PN based objects are converted to GC products through pyrolysis in inert atmosphere with high char yield and low shrinkage. As a result, diverse microscale 3D GC objects are achievable and exhibit excellent structural integrity and fidelity. Our approach develops the micro-fabrication of dense and complex structured GC for the first time, providing a versatile functional platform for advancing next generation applications in medical tools, electrochemistry and precision micro-moulding as well as in energy and aerospace technologies.

Preparation and Properties of Graphene Flexible Membrane

Graphene material has excellent electrical, thermal and mechanical properties, and the flexible film prepared by it can be widely used in intelligent wearables, industrial temperature control, biomedicine, home heating and other fields. In this paper, graphene paste was used to prepare textile substrate and non-substrate graphene flexible film, and its tensile strength, elongation at break, resistivity, hardness, modulus and other parameters were tested. The results show that the graphene flexible film has smooth appearance, good electrical conductivity and good mechanical strength, and is a good choice for smart wear and industrial parts gasket applications.

Preparation and Properties of Soft-/Hard-Switchable Transparent Wood with 0 °C as a Boundary

Transparent wood has excellent optical and thermal properties and has great potential utilization value in energy-saving building materials, optoelectronic devices, and decorative materials. In this work, transparent wood with soft-/hard-switchable and shape recovery capabilities was prepared by introducing an epoxy-based polymer with a glass transition temperature of about 0 °C into the delignified wood template. The epoxy resin was well filled in the pore structure of the delignified wood, and the as-prepared wood exhibited excellent transparency; the optical transmittance and haze of the transparent wood with a thickness of 2.0 mm were approximately 70% and 95%, respectively. Because the glass transition temperature of the epoxy-based polymer was about 0 °C, the prepared transparent wood was rigid below 0 °C and flexible above °C; meanwhile, the transparent wood exhibited shape change and shape recovery properties. Incorporating optical transparency and soft-/hard-switchable ability into the transparent wood opens a new avenue for developing advanced functional wood-based materials.

Emerging Trends in Sustainable Materials for Green Building Constructions

The national decision on the neutrality of global carbon emission as well as decarbonization focus drives the need for the transformation of the building and construction sector of the economy. Thus, green building materials and its production is a better means of achieving depletion in carbon emission. More so, to achieve excellent green development in the construction industry as well as the goal of decarbonization, there is a need to investigate the emerging trends in the sustainable materials for green buildings. Hence, this study focused on the review of some of the existing green materials and its effect on the building construction. Findings from literature studies revealed six different green building materials which include bamboo, cork, straw bale, reclaimed wood, sheep’s wool and hempcrete. It was reported that each of the green material have excellent thermal insulation property, low emission of CO2 and has the ability to be recycled, thus, bringing sustainability in the circular economy as well as eco-friendliness of the material. These findings expand the scope of green materials application and can inform the government to formulate policies that will encourage sustainable green buildings. Keyword: Sustainability, Development, Green Buildings, Green Materials, Emissions

Fabrication of Sr-feldspar/cordierite and Sr-feldspar/Sr-osumilite composites through sintering of Mg–Sr-cordierite and borosilicate glass for electronic applications

The main objective of this study is to fabricate composite materials having excellent thermal, mechanical and electrical properties for thermal and electronic applications. In this work, strontium feldspar-containing composites (Sr-feldspar/cordierite and Sr-feldspar/Sr-osumilite) were prepared by solid-state sintering of SrO-containing cordierite (MgSrAl4Si5O18)/borosilicate glass powder mixtures. The phase composition, physical properties and microstructure of sintered composites were investigated by X-ray diffraction technique, water displacement method and scanning electron microscope, respectively. Moreover, the thermal expansion coefficient, hardness, and electrical properties were also measured. The results of X-ray patterns revealed the crystallization of Sr-feldspar and cordierite in the composites that contain up to 20% borosilicate glass. On the other hand, the composites that include more than 20% glass, displayed the crystallization of Sr-feldspar and Sr-osumilite with little amount of cristobalite. The bulk density values of sintered composites were decreased from 2.41 to 1.84 g/cm3 with increasing the amount of added glass. The microhardness values were increased from 519 to 710 kg/mm2 with increasing the glass content. Low thermal expansion coefficient (2.65 × 10−6, 2.22 × 10−6, 3.45 × 10−6 and 4.26 × 10−6 K-1 for C0, CG91, CG73, CG55, respectively) and low dialectic constant (7–8.5) were obtained for the prepared composites.

Investigation on enhancement of filler dispersion and prediction of mechanical behavior of hexagonal boron nitride/epoxy nanocomposites through machine learning and deep learning models

AbstractTwo‐dimensional hexagonal boron nitride (hBN) based nanocomposites exhibit excellent mechanical and thermal properties for various electronics, automotive, and aerospace applications. The present work gives a novel approach to fabricating hexagonal boron nitride/epoxy nanocomposites using isopropanol and dimethyl ketone as dispersants in two different routes and to predict mechanical characteristics employing deep learning and machine learning models. Nanocomposites were fabricated by employing casting techniques with varying concentrations of hBN, spanning from 0.25 to 1 wt%, utilizing dispersing solvents. The nanocomposites were analyzed for mechanical behavior, highlighting a notable improvement in the mechanical properties at 0.5 wt% isopropanol dispersed hBN. It showcased 61% improvement in tensile strength, 38.41% increase in flexural strength, and 35.80% increase in flexural modulus respectively as compared to the pristine epoxy. The Halpin Tsai analytical model showed agreement with the elastic modulus calculated experimentally. The fractured SEM micrograph supported the improved dispersion of the hBN nanocomposite. Thermal stability of 0.5 wt% isopropanol dispersed hBN/epoxy nanocomposite revealed an improvement by 8°C at 50% degradation as compared to the pristine epoxy. Linear regression, random forest regression, support vector regression, and deep neural network (DNN) were employed to predict values. DNN proved better results by showcasing low prediction loss and high R2 values (0.99468–0.99966).Highlights hBN/epoxy nanocomposite with isopropanol and dimethyl ketone as dispersants. 0.5% hBN loading in isopropanol exhibited improved mechanical characteristics. The Halpin Tsai model was employed for evaluating theoretical elastic modulus. Improved thermal stability and filler dispersion by optimized hBN/epoxy combination. Deep neural network showed higher R2 value and lower prediction loss.

Laser Ablation‐Induced Boron Nitride Aerogels with Intrinsic Photoluminescence for Efficient Information Encryption

AbstractBoron nitride (BN) aerogels, dual interconnecting network of BN nanoscale building blocks, and plenty of air within these nanoscale building blocks, have great potential in many emerging fields. However, fast synthesis and emerging applications, e.g., information encryption, are still challenging for advancing BN aerogels. Herein, intrinsic photoluminescent BN aerogels with programmable patterns are developed via laser ablating of melamine diborate (M2B) aerogel. The obtained BN aerogel exhibited typical hollow‐microsphere structures and blue fluorescence phenomenon, which are totally different from BN aerogels reported elsewhere. This BN aerogel exhibited excellent thermal insulation properties (0.027 W mK−1), transient fluorescence feature (3 ns average radiative lifetime), high quantum yield (18.45%), and excellent weather ability (e.g., resistance to high temperature, solar irradiation, and humidness). By programming the laser moving path, different fluorescent patterns (e.g., various security labels, secret matching keys, quick response codes) of BN aerogels can be processed, which promises excellent information encryption in the field of Internet of Things, etc. The results may inspire researchers to fabricate more aerogels with this fast laser‐ablation strategy and the resulting intrinsic fluorescent BN aerogels may find significant applications in some emerging fields.

Synthesis and comparative study of high Tg and colorless polyamide‐imides with different amide‐to‐imide ratio

AbstractColorless polyimide (CPI), a heat‐resistant polymer being widely used in optoelectrical devices, has attracted worldwide attention. Polyamide‐imides due to the incorporation of amide groups into the CPI chains enhance the polymer performance by improving the thermal dimensional stability and excellent mechanical properties without sacrificing the optical transparency. In this article, CPI films PI‐(1‐3) are synthesized from one‐step polymerization of 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and cyclopentanone bis‐spironorbornane tetracarboxylic dianhydride (CpODA) with amide‐containing diamine N,N′‐(2,2′‐bis(trifluoromethyl)‐[1,1′‐biphenyl]‐4,4′‐diyl)bis(4‐aminobenzamide) (AB‐TFDB) and bis(trifluoromethyl)benzidine (TFDB). In comparison, by adjusting the ratio of imide and amide groups in the repeating unit, PI‐(4‐5) are prepared from copolymerization of terephthaloyl chloride (TPC), 6FDA, and CpODA with TFDB diamine. PI‐(1‐5) with 90% transmittance in the visible region tailored the excellent thermal and mechanical properties. Particularly, PI‐3 exhibited a high glass transition temperature of 412°C, a coefficient of thermal expansion of 20.8 ppm/K, a tensile strength of 128 MPa, and an elastic modulus of 5.4 GPa. The results also concluded that irrespective of the polyamide‐imide synthesis strategy, CPI films with similar amide‐to‐imide ratio in polymer chain demonstrated comparable optical, thermal, and mechanical properties.

Strain-Driven High Thermal Conductivity in Hexagonal Boron Phosphide Monolayer.

Two-dimensional graphenelike material, hexagonal boron phosphide (h-BP), is a promising candidate for electronic and optoelectronic devices because of its suitable band gap and high carrier mobility. Especially from the ultrahigh lattice thermal conductivity (κl), it exhibits great potential to solve the challenges of future thermal management applications. Here, the excellent lattice thermal transport properties of the h-BP monolayer are systematically analyzed at the atomic level based on the first-principles method. The results show that the ultrahigh κl value of the h-BP monolayer is attributed to its high phonon group velocity and long phonon lifetime and the strong phonon hydrodynamic effect. We further explore the influence of the tensile strain on the thermal transport properties of the h-BP monolayer. As the strain increases from 0 to 8%, the κl value shows a trend of first increasing and then decreasing due to the coeffect of strain-driven changes for phonon harmonicity and anharmonicity. Under a strain of 6%, the κl value of the h-BP monolayer is as high as 795 W/mK at 300 K, which is about 2.22 times larger than that of 357 W/mK without strain. Such a significant increase in the κl value is mainly due to the increased phonon group velocity and decreased Grüneisen parameter caused by strain. This work is helpful to understand the critical role of tensile strain in lattice thermal transport of two-dimensional graphenelike materials. It is conducive to promoting the thermal management application of the h-BP monolayer.

Preparation and properties of high-temperature resistant bisphthalonitrile resins containing trifluoromethyl groups reinforced by poly (aryl ether nitrile) capped by phthalonitrile and their composites

A new series of high-temperature resistant bisphthalonitrile resins containing trifluoromethyl groups were prepared based on 4,4’-(hexafluoroisopropylidene) bisphthalonitrile (BFPh), which was toughened by hexafluoroisopropylidene-containing poly (aryl ether nitrile) oligomer capped by phthalonitrile (FPEN-Ph) in the different content. In addition, glass fiber reinforced composites were prepared by hot pressing process. The structure of the oligomer was characterized by FTIR and 1HNMR. The curing behavior of the blends was studied by DSC. Thermal stability and mechanical properties were also studied. The results showed that the introduction of appropriate content of FPEN-Ph could improve the reactivity of the curing reaction. TGA and DMA results showed that the cured polymers and composites had excellent thermal properties. The residual mass of FPEN-Ph content of 10% at 800°C was 72.4%, and the 5% thermal degradation temperature (T5%) under inert atmosphere was 530°C. The flexural strength of glass fiber reinforced composites was about 592.7 MPa, and the shear strength was about 61.6 MPa, showing excellent mechanical properties. The high-tech thermosetting resin was toughened and enhanced at the same time without reducing heat resistance.

Bending performance and failure modes of sinusoidal corrugated sandwich panels fabricated using stereolithography technology: Effects of geometric parameters

The sinusoidal wave corrugated sandwich panel is an exceptional component with outstanding performance, making it highly suitable for both military and civilian applications. Its strength, rigidity, lightweight nature, low density, simple structure, cost-effectiveness, high load-carrying efficiency, remarkable load-bearing capacity, as well as excellent sound insulation and thermal insulation properties, have positioned the sinusoidal wave corrugated sandwich panel as an ideal choice for energy absorption devices. To evaluate the bending performance of the sinusoidal wave corrugated sandwich panel, this study fabricated single-layer and double-layer sinusoidal wave core sandwich panels using the light-curing molding process described in this research. The research analyzed the impact of various geometric parameters, including skin thickness, core layer thickness, core height, and corrugation wavelength, on the bending performance and failure modes of the single-layer sinusoidal wave core sandwich panels through three-point bending loading tests. The failure modes of the sinusoidal wave corrugated sandwich panel were validated using finite element simulation. Additionally, the study examined the bending performance of the sandwich panels with double-layer sinusoidal wave cores and investigated the influence of wavelength distribution in the upper and lower core layers on the force–displacement curve and energy absorption capacity of the double-layer sinusoidal wave core sandwich panel. These findings provide valuable theoretical support for the design of lightweight and high-strength sandwich panels.

Lightweight Cf/SiC Composites with High Fiber Content Fabricated by Binder Jetting Additive Manufacturing and Liquid Silicon Infiltration

In this study, Cf/SiC composites with excellent mechanical and thermal properties were prepared by combining binder jetting (BJ) additive manufacturing with liquid silicon infiltration (LSI) process. The introduction of Cf into the Cf/SiC mixed powder reduced its spreading ability, which reduced the density, strength, and precision of the Cf/SiC green parts. However, phenolic resin infiltration and pyrolysis (PRIP) treatment compensated for the decrease in the density of the green parts resulting from the introduction of Cf. By optimizing the number of PRIP cycles to increase the pyrolytic carbon (PyC) content in the carbonized parts, the Cf in the green parts successfully prevented the reaction with molten Si in the LSI and played an important role in strengthening and toughening the composites. The flexural strength, fracture toughness, and thermal conductivity of the Cf/SiC composites reached the maximum values of 316 ± 16 MPa, 4.81 ± 0.12 MPa·m1/2, and 140 W/m·K, respectively. This study presents future opportunities for the cost-effective and efficient industrial manufacturing of Cf/SiC complex structures.

Research on the heat resistance and electrical properties of fluorinated polyimide/nano-Al2O3/nano-Si3N4 composite materials

Polyimide (PI) refers to a polymer containing an imide ring characteristic structure on the main chain. It has excellent thermal stability, insulation properties and other characteristics. The Tesla transformer is the core component of the primary pulse source of the high-current electron beam accelerator. It is also an essential component of the energy storage pulse power supply. Therefore, it has broad application prospects in the fields of national defense and civil industry. If the insulation performance of the turn-to-turn coils of the Tesla transformer does not meet the standards, it will break down during high-voltage corona discharge, causing transformer failure. Therefore, it is crucial to improve the insulation performance of Tesla transformer inter-turn wrapping materials. The incorporation of fluorine-containing groups has proven to be a transformative strategy that significantly enhances the physical, chemical, optical, and electrical properties of PI films. In addition, numerous studies have demonstrated that introducing inorganic fillers into the polyimide matrix can substantially enhance the insulating properties of polyimide films. This paper specifically concentrates on elevating the insulating and thermal attributes of polyimide. Initially, a range of polyimide films was synthesized for performance assessment by employing various fluorinated dianhydride and diamine components, utilizing them as substrates. Then, we used nano-silicon nitride (nano-Si3N4) and nano-alumina (nano-Al2O3) as doping phases to prepare PI composite films, which reduced the dielectric constant and increased the breakdown strength.

Performance analysis of thermally and non-conductive cement mortar prepared from waste iron scraps and magnetite sand

ABSTRACT The existing thermal conductive pavement exploits heating cables as the heat source commonly. However, the poor thermal conductivity of the upper layer in the pavement structure results in a low energy utilisation efficiency. In order to ensure energy transfer efficiency and reduce energy consumption, this paper investigates the application of waste iron scraps and magnetite sand in cement-based materials. The mechanical properties, electrical conductivity and thermal conductivity of cement mortar were tested by ISO method, two-electrode method and plate steady-state method, and the drying shrinkage condition of the specimens was studied by drying shrinkage test. The results showed that there was a critical value of mechanical property enhancement of mortar by waste iron scraps and magnetite sand, while the electrical and thermal conductivity were positively correlated with their admixtures. The study obtained the optimal ratio of waste iron scraps and magnetite sand in the system that would exhibit excellent thermal and mechanical properties while having low electrical conductivity. It can be concluded that this study provides suggestions for solving the problems of low exploitation rate of solid waste and low heat transfer efficiency of thermal conductive pavement.

An efficient fabrication method of lightweight aramid nanofibrous aerogels for high-efficient sound absorption and thermal properties

The aramid nanofibrous aerogels (ANFs) have various application prospects due to their ultra-light, high porosity and excellent properties of aramid fibers. However, the preparation of ANFs requires long preparation time and their ultra-dense pore structure leads to poor sound penetration and high sound energy reflectivity, which ultimately makes the overall sound absorption performance of ANFs poor. Therefore, a strategy for synthesis of ANFs is designed to achieve light weight, excellent thermal insulation performance and significantly improve sound absorption properties. This strategy combines cell pulverizing, pump-filtration molding, and directional freezing to ensure structural strength of the aerogel without the addition of cross-linking agents, and this process enables the ANFs to introduce in macro-pores while keeping nano-pores. The structure of multi-layered pores effectively reduces the reflectivity of incident acoustic energy and improves the sound absorption coefficient. The interconnected macro-pores and interlaced small pores of ANFs provide good sound absorption performance (sound absorption average (SAA) = 0.338), excellent flame retardant and thermal insulation properties (thermal conductivity = 0.0635 W (m*K)−1) with ultralight (density = 40.5 mg cm−3) in a thinner thickness (15 mm), which extend the potential of ANFs in areas of noise control and thermal insulation. In addition, the structure of multi-scaled pores can also be formed inside other aerogels by using the method of cell pulverization and filtration preparation, which can be helpful for improving their properties of thermal insulation and sound absorption.

Effect of sintering temperature on microstructure and tribological properties of copper/graphite composites doped with Ti3AlC2 particles

Copper/graphite composites have received much attention in engineering applications due to their excellent thermal, electrical and self-lubricating properties. However, their mechanical and wear resistance properties are usually limited by the brittleness of graphite and the poor interfacial bond between graphite and copper. Harder particles can be used to reinforce composites to increase their mechanical properties and wear resistance. In this paper, copper/graphite composites added with Ti3AlC2 particles were prepared by rapid hot press sintering. Studies were conducted to find out how the sintering temperature affected the composites' phase composition, morphology, hardness, relative density, and friction properties. The results showed that the relative density and hardness of the composites increased and then decreased with increasing sintering temperature. Besides, the findings indicated that Al atoms started to diffuse out of Ti3AlC2 and into the Cu matrix around 800 °C, leading to the in-situ formation of TiCx and Cu(Al) alloys. When the sintering temperature exceeded 850 °C, Ti3AlC2 decomposed essentially completely. In comparison to other similar prior findings (the wear rate was ∼1 ×10−4 mm3·N−1·m−1), the copper/graphite composites prepared in this work shown improved wear resistance. Among them, the lowest wear rate (1.942 × 10−5 mm3·N−1·m−1) was obtained at a sintering temperature of 900 °C, with a relative density of 98.41%, a hardness of 75.67 HV and an average coefficient of friction of 0.15. This will help to further broaden the application areas of copper/graphite composites.

Enhancing thermal conductivity and dielectric properties of Al2O3@Si/polyphenylene oxide composites by surface functionalization

Recently, soaring developments in 5 G technology have raised an intensive challenge in developing polymer composites with excellent thermal conductivity and dielectric properties. Herein, Al2O3 @Si/MPPO composites were developed through synergistic modification and solution mixing methods. The double bond reaction between Al2O3 @Si and MPPO enhanced the interfacial force and greatly reduced the interfacial thermal resistance and interfacial polarization, leading to highly thermally conductive composites with excellent dielectric properties. The resultant polymer composites exhibited high thermal stability, excellent dynamic mechanical properties, a low dielectric loss of 0.00292, and a high thermal conductivity (TC) of 1.49 W/(m·K), which was 5.21 times higher than that of the pure MPPO resin, making it an ideal thermal management material for electronic devices.

Review of: "Dielectrics and new materials that are well understood for use with this technology. Nano supercapacitors developed with multi-layer nanostructure technology are inherently solid and show excellent mechanical and thermal properties"

Review of: "Dielectrics and new materials that are well understood for use with this technology. Nano supercapacitors developed with multi-layer nanostructure technology are inherently solid and show excellent mechanical and thermal properties"