Excellent Electrical Insulation Properties Research Articles

Porous TiO2 microspheres containing MgO nanoparticles/epoxy composite with superior thermal conductivity, EMI shielding, and electrical insulation

With the continuous advancement of electronic devices, the amounts of heat as well as electromagnetic (EM) waves generated have increased. Materials with high thermal conductivity and excellent EM interference shielding effectiveness (EMI SE) can be utilized to address this issue. In this work, we synthesized hollow anatase TiO2 microspheres. Through a reaction, MgO nanoparticles were incorporated into the interior of TiO2 microspheres. (H-TiO2/MgO). The heterostructure of the fillers contributed to performance enhancement. TiO2 and MgO particles formed a dual thermal-conduction pathway. H-TiO2/MgO effectively weakened the energy of EM waves upon contact. Additionally, TiO2, MgO, and epoxy all exhibited hydrophilicity. Consequently, the interfacial compatibility between H-TiO2/MgO and epoxy was excellent. They formed strong interfacial interactions by hydrogen bonding. Because of the excellent electrical insulation properties of H-TiO2 and MgO, the composites exhibited superior insulation performance (over 1010 Ω·cm). Our H-TiO2/MgO/Epoxy composites exhibited a maximum thermal conductivity of 7.52 W/m·K, an EMI SE of 64.92 dB, and a tensile strength of 79.10 MPa. Our composites are expected to effectively manage heat and EM waves generated by electronic devices

An optimal design of battery thermal management system with advanced heating and cooling control mechanism for lithium-ion storage packs in electric vehicles

Battery thermal management is crucial for the efficiency and longevity of energy storage systems. Thermoelectric coolers (TECs) offer a compact, reliable, and precise solution for this challenge. This study proposes a system that leverages TECs to actively regulate temperature and dissipate heat using transformer oil, known for its excellent thermal conductivity and electrical insulation properties. A thermal management system utilizing liquid immersion cooling was developed, providing both cooling and heating functionalities. The system was tested on a 48 V 26 Ah NMC Li-ion battery pack at charging rates of 0.5C and discharging rates of 0.5C and 1C. Maximum temperatures recorded were: natural convection (NC) at 42.8 °C and 54.9 °C, forced convection (FC) at 33.2 °C and 45.2 °C, and liquid immersion cooling (LIC) at 29.3 °C and 37.7 °C. LIC significantly lowered temperatures compared to NC and FC, while maintaining acceptable misbalance and capacity levels. Additionally, the liquid immersion heating setup effectively heated the battery from −25 °C to 0 °C before charging, demonstrating the system's capability to maintain optimal battery performance.

Development of copper-boron nitride core-shell structured fillers and surface treatment for thermally conductive composites

Core-shell structured copper-boron nitride (Cu@BN) spherical fillers were synthesized to fabricate thermally conductive composites. To enhance the interaction between the fillers and the matrix, polysilazane (PSZ) was coated on the surface of the filler. The resultant composite exhibited remarkable characteristics, including a substantial tensile strength of 32.36 MPa, excellent electrical insulation properties, and impressive thermal conductivity of 3.47 W/mK. When applied in a light-emitting diode (LED) application, the composite effectively managed heat, reducing the operating temperature by 34 °C. The epoxy/PSZ-Cu@BN composites hold great promise for improving thermal management in electronic devices.

Enhanced electrical insulation properties of 2-isopropenyl-2-oxazoline grafted polypropylene for high voltage direct current power cables

Polymers have been extensively used for high voltage direct current transmission systems as insulation power cables. Space charge accumulation consistently remains the primary factor contributing to the degradation of the electrical insulation properties of polymers. Grafting modification is a valid approach for suppressing the injection of space charges and free electrons by inducing deep traps. In this paper, the modified polypropylene grafted the group with low ionization energy is reported. The deep traps are revealed by the thermally stimulated depolarization current experiment and the band structure as well as the electrostatic potential by density functional theory simulation. The method with the innovative hybrid functional and basis set is adopted to establish the average local ionization distribution of the grafting group, thus confirming its strong electrophilicity. Furthermore, the modified polypropylene has been proved to obtain higher breakdown strength and operational stability by experiments. This work can provide insights for the design and selection of power cables with excellent electrical insulation properties.

Study of the Dielectric and Corona Resistance Properties of PI Films Modified with Fluorene Moiety/Aluminum Sec-Butoxide.

With the policy tilt and increased investment in research and development in the world, new energy vehicle technology continues to progress and the drive motor power density continues to improve, which puts forward higher requirements for the comprehensive performance of the core insulating material enameled wire enamel for drive motors. Polyimide (PI) has excellent electrical insulation properties, and heat resistance is often used to drive the motor winding insulation. To further improve the corona resistance and insulating properties of PI wire enamel varnish, in this paper, firstly, fluorene groups with a rigid conjugated structure were introduced into the molecular chain of the PI film by molecular structure modulation, and then uniformly dispersed alumina nanoclusters (AOCs) were introduced into the PI matrix by using an in situ growth process to inhibit the migration of high-energy electrons. The quantum size effect of the alumina nanoclusters was exploited to synergistically enhance the suppression and scattering of energetic moving electrons by PI-based composite films. The results show that the breakdown field strength of the PI-based composite film (MPI/1.0 vol% AOC) reaches 672.2 kV/mm, and the corona resistance life reaches 7.9 min, which are, respectively, 1.55 and 2.19 times higher than those of the initial PI film. A PI-based composite film with excellent insulating and corona resistance properties was obtained.

Thermally conductive h-BN/EP composites oriented by AC electric field induction

The excellent electrical insulation properties and mechanical properties of epoxy resin (EP) have led to its rapid development in the field of microelectronic packaging. However, the poor thermal conductivity of epoxy resins (thermal conductivity of only 0.14 W/(m·K)) limits the development of components for high power. Adding h-BN to epoxy resin to prepare composites can effectively improve the thermal conductivity of epoxy resin. In this paper, h-BN/EP high thermal conductivity composites were prepared by means of AC electric field induction with the goal of making the composites low loading and high thermal conductivity (loading of 10 wt%). It was shown that the h-BN/EP composite had the highest thermal conductivity of 0.310 W/(m·K) when applied to an AC electric field of 120 V/mm and 50 Hz for 1 h. It was 2.214 times higher than that of EP and 1.325 times higher than that of the same-loaded h-BN/EP composite (0.234 W/(m·K)). A thermal conductivity model that can predict the thermal conductivity of composites prepared using the same type of method is also developed, which extends the applicability of the thermal conductivity model. The prepared composites have good thermal management capability. The method is easy to be engineered and has great potential for use in electronic packaging and even other high thermal conductivity applications.

Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption

AbstractThe development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application of 5G communication technology in military fields. This work uses aramid nanofibers (ANF) as the matrix, hetero‐structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by in situ growth as fillers, which are combined to fabricate sandwich structured thermally conductive and electrically insulating (BNNS/ANF)‐(AgNWs@BNNS)‐(BNNS/ANF) (denoted as BAB) composite films by “filtration self‐assembly, air spraying, and hot‐pressing” method. When the mass ratio of AgNWs@BNNS to BNNS is 1 : 1 and the total mass fraction is 50 wt %, BAB composite film has the maximum in‐plane thermal conductivity coefficient (λ∥ of 10.36 W/(m ⋅ K)), excellent electrical insulation (breakdown strength and volume resistivity of 41.5 kV/mm and 1.21×1015 Ω ⋅ cm, respectively) and mechanical properties (tensile strength of 170.9 MPa). 50 wt % BAB composite film could efficiently reduce the equilibrium temperature of the central processing unit (CPU) working at full power, resulting in 7.0 °C lower than that of the CPU solely integrated with ANF directly. In addition, BAB composite film boasts adaptive visible light/infrared dual camouflage properties on cement roads and jungle environments, as well as the function of fast encryption of QR code information within 24 seconds.

Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption.

The development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application of 5G communication technology in military fields. This work uses aramid nanofibers (ANF) as the matrix, hetero-structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by in situ growth as fillers, which are combined to fabricate sandwich structured thermally conductive and electrically insulating (BNNS/ANF)-(AgNWs@BNNS)-(BNNS/ANF) (denoted as BAB) composite films by "filtration self-assembly, air spraying, and hot-pressing" method. When the mass ratio of AgNWs@BNNS to BNNS is 1 : 1 and the total mass fraction is 50 wt %, BAB composite film has the maximum in-plane thermal conductivity coefficient (λ∥ of 10.36 W/(m ⋅ K)), excellent electrical insulation (breakdown strength and volume resistivity of 41.5 kV/mm and 1.21×1015 Ω ⋅ cm, respectively) and mechanical properties (tensile strength of 170.9 MPa). 50 wt % BAB composite film could efficiently reduce the equilibrium temperature of the central processing unit (CPU) working at full power, resulting in 7.0 °C lower than that of the CPU solely integrated with ANF directly. In addition, BAB composite film boasts adaptive visible light/infrared dual camouflage properties on cement roads and jungle environments, as well as the function of fast encryption of QR code information within 24 seconds.

High thermally conductive polyimide film designed with heterostructural Cring-C3N4 filler and multilayer strategy

With the emerging of advanced flexible electronic, the PI film with excellent thermally conductive, flexible, lightweight, electrically insulating qualities is in high demand as a potential substrate and encapsulation material. Conventional thermally conductive fillers such as ceramic, metal and carbon material with high hardness, high density or electrical conductivity are unsuitable to prepare the advanced PI film. Furthermore, the confined loading of thermally conductive filler in PI matrix limited by its film-forming property is another obstacle to optimizing the thermal conductivity of PI film. In this work, the development of novel filler (carbon nitride in-plane grafted by two-dimensional carbon material, Cring-C3N4) with intrinsic thermal conductivity and a design of three-layer structure for the introduction of high filler loading have dramatically improved the thermal conductivity of PI film. Benefitting by the planar heterostructure construction of g-C3N4 and Cring, the existence of Cring increases the phonon transfer rate in g-C3N4, and the presence of g-C3N4 prevents the electron movement in the facet of Cring-C3N4 endowing its excellent electrical insulation property. The design of three-layer structure in which the first and third layers served as mechanical support layers with a fixed filler content (20 wt%). The second layer has the higher filler content to enhance the quantity of thermally conductive filler in PI film. Resultantly, the maximum out-of-plane thermal conductivity of the PI/Cring-C3N4 composite film is 1.35 Wm−1K−1, which is 10 times higher than the pure PI film. In addition, the PI/Cring-C3N4 composite film exhibit excellent photothermal conversion ability in which the saturation temperature of PI/Cring-C3N4 can reach 283.6 °C under 0.75 W/cm2 laser radiation being 6 times higher than that of the corresponding PI film. After the incorporation of Cring-C3N4, the PI composite film still has excellent thermal stability, low CTE, electrical insulation and mechanical properties. This work provides a novel idea for the preparation of advanced high thermal conductivity PI film.

Preparation of MoS2@PDA-Modified Polyimide Films with High Mechanical Performance and Improved Electrical Insulation.

Polyimide (PI) has been widely used in cable insulation, thermal insulation, wind power protection, and other fields due to its high chemical stability and excellent electrical insulation and mechanical properties. In this research, a modified PI composite film (MoS2@PDA/PI) was obtained by using polydopamine (PDA)-coated molybdenum disulfide (MoS2) as a filler. The low interlayer friction characteristics and high elastic modulus of MoS2 provide a theoretical basis for enhancing the flexible mechanical properties of the PI matrix. The formation of a cross-linking structure between a large number of active sites on the surface of the PDA and the PI molecular chain can effectively enhance the breakdown field strength of the film. Consequently, the tensile strength of the final sample MoS2@PDA/PI film increased by 44.7% in comparison with pure PI film, and the breakdown voltage strength reached 1.23 times that of the original film. It can be seen that the strategy of utilizing two-dimensional (2D) MoS2@PDA nanosheets filled with PI provides a new modification idea to enhance the mechanical and electrical insulation properties of PI films.

Thermal conductivity and dielectric properties of EP composites filled by one-dimensional core-shell structured h-BN@SiO2 fibers

With the miniaturization and integration of modern high-power electronic devices, heat accumulation has become a key issue affecting their performance and reliability, which puts forward higher requirements for the thermal conductivity of polymer materials. In this study, boron nitride (h-BN) was dispersed into silica sol, and high aspect ratio core-shell fillers (h-BN@SiO2) were prepared by electrospinning. Then h-BN@SiO2/epoxy resin (EP) composites were prepared by hot pressing. Owing to the macroscopic and microscopic “double network” conduction paths constructed by h-BN@SiO2 fillers, the in-plane thermal conductivity (λ||) of h-BN@SiO2-Ⅲ/EP composites is 6.719 Wm−1K−1, which is 27 times that of EP, and the out-of-plane thermal conductivity (λ⊥) is 0.698 Wm−1K−1, which is 4 times that of EP. The simulation and the classical thermal conductivity model verify that the new designed filler in this paper has advantages over the traditional filler in terms of heat transfer. More importantly, the prepared composites also maintain excellent electrical insulation and dielectric properties, which provides a new idea for the preparation of high thermal conductivity electrical insulation composites.

Hollow waveguide CO2 laser sensing system for rapid detection of trace sulfur hexafluoride (SF6) gas

Sulfur hexafluoride (SF6) has been widely applied in electrical facilities due to its excellent electrical insulation and high-voltage arc extinguishing properties, although it is a potent greenhouse gas. Rapid detection of trace SF6 gas is significant for monitoring the operation safety of high-voltage power grid facilities and greenhouse gas emissions. In this work, a SF6 gas sensing system was proposed and built using a CO2 laser as the light source and a 700 μm bore Ag/AgI hollow glass waveguide (HGW) as the gas chamber and laser transmission channel. Sensing performances of the SF6 gas HGW sensors with different lengths were investigated. The gas sensing sensitivity and standard deviation (SD) of blank increase as the waveguide length increases. The limit of detection (LOD) decreases with waveguide length increase but the decline becomes less pronounced after the length exceeds 120 cm. The HGW length exhibits minor effect on the response and recovery time of the sensor system. The sensor sensitivity undergoes a slight reduction as the HGW is bent. Optimization of the sensing performance was achieved based on the straight 120 cm-length HGW SF6 gas sensor system. Its sensitivity reaches 0.384 dB/ppm and the LOD is 148 ppb with good cyclic response characteristics (response and recovery time 2–3 s). The present work provides a feasible idea for building up a trace SF6 gas sensing system with simple structure, easy operation and high performances.

Nacre-inspired composite paper of PVA crosslinked basalt scale and nanocellulose with enhanced mechanical, electrical insulating and ultraviolet-resistant aging performance

Silicate scales are commonly incorporated into cellulose nanofiber (CNF) as functional fillers to enhance electrical insulation and UV-shielding properties. Nevertheless, the addition of substantial quantities of silicate scales in the quest for enhanced functional properties results in reduced interface bonding capability and compromised mechanical properties, thereby restricting their application. Here, inspired from nacre, layered composite paper with excellent mechanical strength, electrical insulation and UV-resistance properties was fabricated through vacuum assisted self-assembly using CNF, PVA and basalt scales (BS). Unlike the conventional blending strategy, the pre-mixed PVA and BS suspension facilitates the formation of Al-O-C bond, thereby enhancing the interfacial bonding between BS and CNF. Consequently, the composite paper (BS@PVA/PVA/CNF) containing 60 wt% BS demonstrates higher mechanical strength—approximately 140 % higher than that of BS/CNF composite paper, achieving a strength of 33.5 MPa. Additionally, it demonstrates enhanced dielectric properties, surpassing those of CNF paper by up to 107 %. Moreover, it exhibits robust ultraviolet-resistant aging performance, retaining ~87 % of its tensile strength after undergoing a simulated two-year aging period. As a result, this work presents a simple and innovative design strategy for enhancing interfacial bonding and optimizing layer structure, providing essential guidelines for large-scale production of high-performance insulation and aging-resistant composite paper.

The Enhancement of the Thermal Conductivity of Epoxy Resin Reinforced by Bromo-Oxybismuth.

With the gradual miniaturization of electronic devices, the thermal conductivity of electronic components is increasingly required. Epoxy (EP) resins are easy to process, exhibit excellent electrical insulation properties, and are light in weight and low in cost, making them the preferred material for thermal management applications. In order to endow EPs with better dielectric and thermal conductivity properties, bromo-oxygen-bismuth (BiOBr) prepared using the hydrothermal method was used as a filler to obtain BiOBr/EP composites, and the effect of BiOBr addition on the properties of the BiOBr/EP composites was also studied. The results showed that the addition of a small amount of BiOBr could greatly optimize the dielectric properties and thermal conductivity of EP resin, and when the content of BiOBr was 0.75 wt% and 1.00 wt%, the dielectric properties and thermal conductivity of the composite could reach the optimum, respectively. The high dielectric constant and excellent thermal conductivity of BiOBr/EP composites are mainly due to the good layered structure of BiOBr, which can provide good interfacial polarization and thermal conductivity.

Hexaphenoxy cyclotriphosphazene/boron nitride high-efficiency charring system enhancing the flame retardancy and thermal conductivity of polycarbonate

Polycarbonate (PC), as an engineering plastic, has excellent mechanical properties and electrical insulation properties. Nevertheless, with the rapid spread of 5 G applications, there is an increasing demand for functional PC materials with both thermal conductivity and flame retardant properties. In this study, the flame retardant thermal conductivity composite system of boron nitride (BN) and hexaphenoxy cyclotriphosphazene (HPCP) was constructed to study the simultaneous improvement of the flame retardant and thermal conductivity of PC. The results reveal that the inclusion of HPCP and BN in PC can significantly enhance its flame retardancy. This enhancement is evidenced by prolonged ignition time, reduced heat release rate and decreased total smoke production. In particular, 20BN/3HPCP/PC composite shows the best flame retardant effect. Through the investigation of flame retardant mechanisms, it has been found that the network structure formed by the BN sheets with phosphorus-containing products of HPCP decomposition can effectively filter and adsorb pyrolysis debris and increase the residence time of burning fragments in the pyrolysis zone promoting the pyrolysis products further fully burned to reduce the smoke caused by incomplete combustion. The phosphoric acid substances after the decomposing of HPCP can promote PC matrix to dehydration and carbonization to form the phosphorus-containing residues, which adheres on the BN network structure to form hardness char layers in the condensed phase to play an excellent role in blocking heat and combustible flue gas, which has a positive effect on reducing heat release rate and improving flame suppression. In terms of improving thermal conductivity, the infrared thermal imaging experiment further confirmed that BN sheets can increase the thermal conductivity of PC composites by more than 4 times, and the layer and layer stacks structure of BN sheets can endow an efficient thermal conductivity path for PC matrix to improve the thermal conductivity. Therefore, this study is meaningful practical exploration for developing the PC composites with excellent thermal conductivity and flame retardancy.

Dielectric polyimide composites with enhanced thermal conductivity and excellent electrical insulation properties by constructing 3D oriented heat transfer network

With the continuous development of electronic technology, polymer-based thermal management materials (TMMs) with insulation, high thermal conductivity (TC), and low dielectric performance are urgently needed for electronic devices. Nevertheless, balancing above expected properties is still a daunting challenge because of phonon scattering and interfacial polarization. Here we put forward a simple and useful method for preparing polyimide (PI) composites. First, the alignment of modified boron nitride nanosheet (MBN) along the fiber was controlled by electrospinning, while silver nanowire (AgNW) was utilized for electrostatic spraying to overlap the AgNW with MBN. Finally, a hybrid network oriented along the horizontal direction was formed by hot-pressing. The in-plane TC of the PI composites was up to 8.38 W/mK due to the formation of thermal conduction pathways along the hybrid network. The PI composites also had a series of merits, such as electrical insulation of over 2.40 × 1014 Ω cm, low dielectric constant (3.84), low dielectric loss (<0.01) at 106 Hz, excellent thermal stability (THRI = 299.3 °C), and heat dissipation capability. These PI composites with satisfactory comprehensive properties have great application potential in electronic devices, particularly in flexible electronic devices or circuits that demand electrical insulation and high TC.

Preparation and Performance of Silicone Rubber Composites Modified by Polyurethane.

Silicone rubber composites with good comprehensive properties modified with polyurethane were obtained through mixing and vulcanizing methods. Firstly, the polyurethane prepolymer with double bonds was prepared by polytetrahydrofuran glycol (PTMG, Mn = 1000), isophorone diisocyanate (IPDI), and 2-hydroxyethyl methacrylate (HEMA). The prepolymer was then added to the silicone rubber compounds to prepare silicone rubber composites, combining the excellent properties of polyurethane with the silicone rubber materials. The effects of polyurethane content on the mechanical properties, insulation, hydrophobicity, thermal stability, and flame retardancy of composites were studied in detail. The results showed that the silicone rubber composites not only have good hydrophobicity, thermal stability and flame retardant properties, but the addition of polyurethane significantly improves the tensile strength at room and low temperatures and the volume resistivity of the materials. The tensile strength increased by 32.5%, and the volume resistivity nearly doubled. The excellent electrical insulation, high hydrophobicity and good mechanical properties make the silicone rubber composites appropriate for use in the field of polymeric house arresters.

Effect of Cooling Temperature on Crystalline Behavior of Polyphenylene Sulfide/Glass Fiber Composites.

Poly (phenylene sulfide) (PPS) is a super engineering plastic that has not only excellent rigidity and high chemical resistance but also excellent electrical insulation properties; therefore, it can be applied as an electronic cover or an overheating prevention component. This plastic has been extensively applied in the manufacture of capacitor housing as, in addition to being a functional and lightweight material, it has a safety feature that can block the electrical connection between the electrolyte inside and outside the capacitor. Moreover, the fabrication of PPS composites with high glass fiber (GF) content facilitates the development of lightweight and excellent future materials, which widens the scope of the application of this polymer. However, the crystallinity and mechanical properties of PPS/GF composites have been found to vary depending on the cooling temperature. Although extensive studies have been conducted on the influence of cooling temperature on the crystalline behavior of PPS-based composites, there has been limited research focused particularly on PPS/GF composites for capacitor housing applications. In this study, to apply PPS/GF composites as film capacitor housings, specimens were prepared via injection molding at different cooling temperatures to investigate the composites' tensile, flexural, and impact energy absorption properties resulting in increases in mechanical properties at high cooling mold temperature. Fracture surface analysis was also performed on the fractured specimens after the impact test to confirm the orientation of the GF and the shape of the micropores. Finally, the crystallinity of the composites increased with higher cooling temperatures due to the extended crystallization time.

A vertically aligned anisotropic boron nitride nanosheet (BNNSs)/polyvinyl alcohol (PVA) composite aerogel with ultra-low thermal conductivity prepared by the prefreeze-freeze-drying method for efficient thermal management

Thermal management plays a critical role in contemporary engineering and materials science, finding applications in diverse fields such as electronics and aerospace. Three-dimensional (3D) aerogels have gained popularity as a promising alternative to traditional insulation materials due to their high porosity and remarkably low thermal conductivity. In this study, we propose a novel method for fabricating a composite aerogel comprising vertically aligned anisotropic boron nitride nanosheets (BNNSs) and polyvinyl alcohol (PVA) using the prefreeze-freeze-drying technique. The resulting composite aerogel exhibits exceptional thermal insulation properties, characterized by an ultra-low thermal conductivity of 22 mW/mK (transverse) and 71 mW/mK (axial). These values are significantly lower than those of conventional aerogels and most other polymer composites. The anisotropic thermal behavior of the composite aerogel can be attributed to the vertically aligned BNNSs. Additionally, the composite aerogel demonstrates remarkable thermal stability and favorable mechanical properties. It also exhibits excellent electrical insulation and flame retardant properties, along with a unique capacity for heat storage and utilization. Furthermore, outdoor testing reveals that the composite aerogel exhibits a maximum heat storage temperature of 3.8 °C higher than the ambient temperature, thereby showcasing its exceptional thermal insulation performance and distinct capability for heat storage and utilization.

고령토 광물을 활용한 저 열팽창 코디어라이트 세라믹스 합성에 관한 연구

Cordierite (2MgO·2Al2O3·5SiO2) in the MgO·Al2O3·SiO2 system exhibits a low thermal expansion coefficient, high thermal shock resistance, low dielectric constant, and excellent electrical insulation properties. However, the material has a narrow sintering-temperature range. If the sintering temperature is too low, the crystal structure of cordierite does not form sufficiently; conversely, if it is slightly higher than ideal, the material decomposes into postelite, spinel, and mullite, leading to a significant increase in its thermal expansion coefficient. To overcome this problem, we adjusted the composition of cordierite by mixing it with predetermined amounts of kaolin minerals. After sintering at 1340℃, the resulting ceramic showed satisfactory physical properties, such as bulk density, absorption rate, and porosity. The optimal mixing conditions included a MgO/Al2O3 molar ratio of 1.006 and SiO2/Al2O3 molar ratio of 2.4277. Given its low thermal expansion coefficient(2.20 × 10−6/℃ at 800℃ and 2.57 × 10−6/℃ at 1000℃) and favorable physical and shrinkage properties, the cordierite prepared in this work may have potential applications in the development of kiln furniture materials for sintering next-generation secondary battery cathode materials.