Void Evolution Research Articles

Dynamics of non-Newtonian fluid–fiber interactions and void formation mechanism based on fused filament fabrication

Due to the presence of internal defects such as voids in the composites manufactured by material extrusion additive manufacturing (MEX AM), the mechanical properties of the composites are significantly below the theoretical optimum. Under this circumstance, this paper is intended to investigate the effects of nozzle feeding angles and to analyze the void formation and evolution of multiphase flow, in which systematic computational fluid dynamics numerical simulations are conducted. The volume of fluid model and overset grid method are used to simulate the extrusion deposition process of carbon fiber-reinforced polymer composites, and the Carreau model is used to represent the shear-thinning behavior of molten polymer. The numerical method is validated against previously experimental and numerical simulation data. The numerical results show that the key factor leading to void formation is the vortices caused by fiber oscillation. The intense vortex at the front end of the fibers disrupts the interface between molten polymer and air, creating a beneficial condition for air to enter. Nozzle tilting can effectively reduce the probability of void formation by decreasing the fiber oscillation velocity. The results of the present study provide insights into the development and optimization of printer nozzles to enable the printing of longer fibers with less probability of potential void formation.

Dynamics of localized accelerated corrosion in reinforced concrete: Voids, corrosion products, and crack formation

A comprehensive 3D imaging analysis was conducted to investigate the corrosion process in reinforced concrete (RC) samples at various stages of the accelerated galvanostatic corrosion process. A state-of-the-art X-ray computed tomography (CT) scan technology was utilized to collect high-resolution 3D images of the specimen. The CT imaging was complemented and validated using a multi-faceted approach utilizing Scanning electron microscopy (SEM) and Raman spectrometry techniques. The distribution and evolution of voids, corrosion products, and cracks were investigated. A localized corrosion was observed that has some similarity to pitted corrosion but not as wide spread along the bar. The micro-scale imaging investigations revealed a gradual increase in the diameter of voids as the time of corrosion increased, especially after 8 days of accelerated corrosion process at which a significant decrease in small-sized voids (≤0.11 mm) accompanied by an increase in other void sizes was observed. At 10 and 12 days of accelerated corrosion process, the volume of larger-sized voids (≥0.35 mm) continued to increase, indicating a rapid corrosion progress and the formation of corrosion-induced cracks. In addition, a thorough X-ray CT analysis allowed us to differentiate between various categories of corrosion products. Notably, iron oxides and iron hydroxides were found to dominate the corrosion products. Understanding the composition and distribution of these corrosion products is essential as they play a significant role in the degradation and deterioration of the concrete structure. The coexistence of iron oxides and iron hydroxides in the region of corrosion products were confirmed using Raman spectroscopy analysis. The CT scan images captured the evolution of cracks at different time intervals, revealing a strong correlation between the initiation of cracks and the presence of corrosion products. Subsequently, during the cracking in the matrix, while the propagation of corrosion products within the matrix contributed to the expansion of cracks. SEM images and elemental analysis confirmed that these cracks were filled with corrosion products.

Evolution of interface voids and columnar grains of the FeCrAl/RAFMs HIP bonding joint

Hot Isostatic Pressing (HIP) diffusion bonding of FeCrAl and reduced-activation ferritic/martensitic steels (RAFMs) is a novel method for preparing the tritium permeation barrier (TPB) in nuclear fusion reactors. This study primarily investigates the formation mechanisms and evolution of interfacial voids and columnar grains under different bonding temperatures and post-welding heat treatment (PWHT) conditions. It is found that increasing bonding temperature facilitates element diffusion, leading to the closure of interfacial voids. Decarbonization of RAFMs and the increase in Cr content facilitates the formation of interfacial columnar grains, with C playing a crucial role in this process due to its lower diffusion activation energy than Cr. Although appropriate PWHT can reduce the size of interfacial columnar grains, it cannot entirely diminish them. The FeCrAl/IPFs joint effectively prevents the formation of brittle (Cr, C) compounds and interfacial AlN defects. After HIP (1050 °C) + PWHT (750 °C), the joint achieves high tensile strength and ductility both at room temperature and 300 °C. The enhancement in ductility is primarily attributed to the high Schmid factor of interfacial columnar grains, which facilitated the activation of the primary slip system under tensile load, resulting in a high elongation of joints.

Influence of thermal history and consolidation force on wedge peel strength of CF/PEEK laminates manufactured by laser‐radiated in‐situ consolidation

AbstractProcessing parameters during the laser‐radiated in‐situ manufacturing process change the thermal history of the thermoplastic composite, which affects porosity and fiber‐resin interfacial bonding quality, and hence the wedge peel strength of the laminate. The effect of different laser powers and consolidation forces on the wedge peel strength of the specimens was investigated. Due to the fiber‐rich area on the tape surface during the laser heating phase as well as the insufficient consolidation force and consolidation length during the consolidation phase, the wedge peel strength decreased due to increased porosity and weak fiber‐resin bonding at the interlayer bonding interface. A conformable consolidation roller of lower hardness was used to improve the wedge peel strength of the laminates, which reduced the initial temperature of the cooling phase, thus inhibiting the void rebound and increasing the bonding strength at the fiber‐resin interface. The cross‐section and peeling surface were characterized by optical microscope and scanning electron microscope. The wedge peel strength of the laminates, with reduced voids and increased interfacial bonding strength between the fibers and the resin, is improved.Highlights Mechanism of void formation and evolution in different phases of laser‐radiated in‐situ consolidated laminate. Effect of consolidation roller hardness and deformation on wedge peel strength.

Modeling plasticity-mediated void growth at the single crystal scale: A physics-informed machine learning approach

Modeling the evolution of voids during plastic flow as well as their effects on plastic dissipation is critical for both component manufacturing and lifetime estimation purposes. To this end, we propose a rate-dependent constitutive model to homogenize the effects of semi-randomly distributed voids on single crystal plasticity whilst capturing void interaction and plastic anisotropy. The present work focuses on the case of face centered cubic crystals to introduce an anisotropic gauge function applicable within the crystal plasticity formalism. The approach combines analytical methods to describe the micromechanics of the system in combination with symbolic regression to capture analytically intractable mechanisms from data. The hybrid framework uses a physics-informed genetic programming-based symbolic regression algorithm to solve a multiform optimization problem simultaneously producing a new gauge function and a new strain rate equation. This is also a multi-objective optimization problem with many competing objectives. A new search and selection step is introduced to the genetic algorithm that promotes convergence toward a global solution that better satisfies all the objectives. Overall, the symbolic equations produced leverage data-driven methods to achieve greater accuracy than comparable alternatives on an analytically intractable problem while maintaining model transparency.

A crystal plasticity-based creep model considering the concurrent evolution of point defect, dislocation, grain boundary, and void

Creep poses a significant threat to the integrity and longevity of structural components at high-temperature. The most current understanding of creep mainly focuses on the coupled dynamics of point defects and dislocation, which may well describe the first and second stage of creep. However, the behavior of the three stages of creep is jointly controlled by point defect (vacancy) diffusion, dislocation glide, dislocation climb, grain boundary (GB) sliding, and void evolution. A critical knowledge gap still exists regarding how these different creep mechanisms are simultaneously coupled during the three stages of creep. In this work, a multi-physical mechanisms-based crystal plasticity model is proposed to consider the concurrent evolution of point defect, dislocation, GB, and void based on a unified thermodynamic framework. In-situ scanning electron microscope creep experiments and macroscopic creep experiments of Ti-6Al-4V were conducted to validate our model. The in-situ creep experiment directly revealed the GB sliding creep failure behavior of Ti-6Al-4V for the first time. The proposed model well predicts both the microscopic and macroscopic experimental behavior of creep. The contribution of different microstructure evolutions is discussed, and a phase diagram of the dominated creep mechanism is obtained. An in-depth analysis was conducted on the coupling effects and microstructure characteristics of different creep mechanisms. This work not only deepens our understanding of the micro creep mechanism but also offers valuable insights for designing materials with specific microstructures to enhance their creep resistance.

Study of the dynamic impact spalling of ductile materials based on Gurson-type phase-field model

The formation of void damage and spalling failure in ductile metallic materials under strong impact is a well-established phenomenon. In aerospace and defense technology engineering design, understanding the spalling failure process and related mechanisms is of utmost importance. This paper develops an explicit Gurson-type phase-field model that can simulate the void evolution and spalling damage of three-dimensional ductile metallic materials under high-velocity impacts based on the study of Aldakheel et al.. The model incorporates the Gurson-type void evolution equation and the phase-field approach while taking into account the pressure-dependent bulk modulus and inertia effects. This model is used to study the main processes and mechanisms of impacted layer cracking of metals in different dimensions. Meanwhile based on the study of complex spallation cracking processes in metals in two and three dimensions, observing and proposing the formation mechanism of complex spallation cracking modes in materials due to lateral and edge (base angle) rarefied effects.

Investigation on dynamic response of thin spherical shells impacted by flat-nose projectile based on a novel damage model

Thin-shell structures are widely used in various engineering applications. It is essential to investigate the impact resistance of thin-shell structures, to provide theoretical support for engineering applications. Numerous impact tests have been conducted on thin spherical shells using ballistic guns. The effects of the impact velocity and shell thickness on the deformation and fracture of thin spherical shells are summarized. Moreover, a novel damage model based on statistic damage mechanics is proposed to better predict dynamic responses of thin shells impacted by projectiles. Considering that fracture surfaces are formed by void evolution and are affected by the stress states, the damage level is defined as the ratio of the statistical cross-sectional area of the voids to the cross-sectional area of the representative elements. Utilizing statistical methods, the incorporation of continuous void nucleation, ellipsoidal void growth, and the acceleration of dynamic void evolution are introduced into the novel damage model. Subsequently, numerical investigations of the dynamic response of spherical shells under impact are conducted based on the proposed damage model. The numerical results are consistent with the experimental results in terms of the depression deformations and strain signals. The effects of shell thickness and double-layer structures on the dynamic response of spherical shells are investigated via numerical simulations considering the novel damage model in detail. The results demonstrate that the proposed model can accurately predict the dynamic response of spherical shells impacted by flat-nose projectiles, thus serving as a valuable reference for engineering design.

Effect of βSn grain orientations on the electromigration-induced evolution of voids in SAC305 BGA solder joints

The electromigration (EM) failure of solder joints is closely related to the development of voids during EM. In this paper, an integrated approach combining experimentation and finite element simulation was employed to reveal the evolution of voids in solder joints under current stress. The results indicate that the quantity and volume of voids near the cathode consistently increase, while those close to the anode decrease. These asymmetric evolutions of voids are mainly due to the Sn flux, which is controlled by both current density and βSn grain orientation. The magnitude of Sn flux increases with higher current densities and larger angles γ between the c-axis of βSn and the current direction. The direction of Sn flux is more significantly influenced by the current direction rather than the βSn orientation, due to the weak anisotropic self-diffusion of Sn. Voids near the anode tend to shrink while those close to the cathode expand, parallel to the substrate, due to higher Sn flux distributions at the waists of voids, where current crowding is seen. Void splitting related to rapid Cu diffusion has been observed, leading to an abnormal increase in the number of voids near the cathode. This study enhances the understanding of the electromigration failure mechanisms involving void evolution in solder joints.

Modeling the electro-chemo-mechanical failure at the lithium-solid electrolyte interface: Void evolution and lithium penetration

The solid-solid contact interface is crucial for the reliability of solid-state energy storage systems. The contact condition becomes more complicated when lithium (Li) metal is used as the anode. The contact between solid electrolyte (SE) and Li metal is inferior compared to the liquid/solid interface in conventional Li-ion batteries. Experimental evidence has shown that improper operating conditions of solid-state batteries can lead to electro-chemo-mechanical failures at the Li/SE interface, including the formation of voids and the penetration of Li. In this study, a unified phase-field model is developed to investigate these two mechanisms. The model considers the coupled electro-chemo-mechanical processes including void diffusion, lattice annihilation, stripping and plating reactions, and plastic deformation of Li metal. The study begins with a revisit of the deformation-mechanism map for Li metal under a wide range of temperatures, stress, and deformation rates. This map serves as the basis for the mechanical characterization in the phase-field model. The large inelastic deformation of Li is considered by introducing an advection term into the Allen-Cahn equation, which is used to describe the dynamic evolution of the Li and void phases. The effects of current density and stack pressure on void evolution and Li penetration are studied based on the model predictions. By combining the simulation results with the experimental data from publications, we obtain the stable operation zone of stack pressure and applied current density. In this zone, the Li/SE interface can enable stable stripping and plating of Li metal. The same phase-field modeling framework is transferred to investigate the Li-Mg alloy/SE interface considering Li-Mg alloy is also used as the anode. The fundamental difference between Li/SE and Li-Mg/SE is analyzed accordingly. This study provides a useful tool for the design, manufacturing, and management of next-generation batteries by providing important scientific insights into the electro-chemo-mechanical processes of different anode materials under various operational conditions.

Effect of Temperature and Grain Boundary on Void Evolution in Irradiated Copper: A Phase-Field Study

Effect of Temperature and Grain Boundary on Void Evolution in Irradiated Copper: A Phase-Field Study

Orientation-dependent multi-spall performance of monocrystalline NiTi alloys under shock compression

The primary objective of this work was committed to large-scale non-equilibrium molecular dynamics modeling for the investigation on multiple spall performance, microstructural evolutions, and melting state of NiTi alloys along three typical crystal orientations. We discovered that there was a single-wave structure present in the [100] orientation, whereas elastic-plastic two-wave structures were found in [110] and [111], exhibiting a significant anisotropy in elastic-plastic wave velocity. Compared to [110] and [111] orientations, multi-spallation was more likely to be generated in the [100] direction. During accumulative dynamic damage, there was also a strong sensitivity of void evolution to orientation. For [100], voids tended to be densely distributed in the material and exhibited a strip-shaped manner. In contrast, a more scattered void distribution was observed for the other two orientations, showing a flaky pattern. Interestingly, dislocations in the spall region were almost annihilated before approaching void nucleation. According to void statistics, the peak number of voids, void nucleation rate, and spall region size were identified to be in a good uniformity along [110], [100], and [111]. For all the cases, the samples experienced partial melting in the released state and were followed by a recovery of structural order degree. However, there was an insignificant anisotropy in the melting state for each crystal orientation during multi-spallation.

Kinetics of voids evolution during diffusion bonding of dissimilar metals on consideration of the realistic surface morphology: Modeling and experiments

A comprehensive model for analyzing the kinetics of void evolution and shrinkage during dissimilar diffusion bonding is proposed based on the sinusoidal profile. The model incorporates atom accumulation at void tip to determine the curvature radius of void neck, and integrates the local effect of surface diffusion to quantify the contribution of surface diffusion, thus avoiding the unrealistic void evolution observed in previous models. Furthermore, the model utilizes a combined diffusion coefficient for multicomponent alloys under the effect of stress and concentration gradients, to determine the interfacial diffusion coefficient for dissimilar joints. In contrast to previous models, the current model demonstrates significant improvements in predicted accuracy, efficiently depicting the realistic void evolution and interpreting the formation of various interfacial voids, which can be applied in various bonding cases, including for the dissimilar base metals with different surface conditions. Simulation results from bonding between austenitic steel and ferritic steel with different surface roughness reveal that interfacial voids predominantly form on the side of the base metal with the rougher bonding surface. Additionally, as surface roughness decreases, the prevailing surface source diffusion and interface source diffusion mechanisms promote void evolution and shrinkage, resulting in a significant reduction of the final bonding time. To achieve a high-quality bonding joint, it's suggested to place the smoother bonding surface on the higher creep-resistant base metal, which can accelerate the void closure process.

Study on the influence of void evolution of porous asphalt concrete on acoustic absorption performance under high-temperature loading

This paper investigated the void evolution in porous asphalt concrete (PAC) under high-temperature loading and the resulting decay in acoustic absorption performance. The specimen of PAC-13 with a void content of 20.2 % was designed and loaded with MMLS3 for 0–100,000 cycles at 60℃. Computed tomography techniques were employed to extract the distribution characteristics and structural parameters of voids. Subsequently, the acoustic absorption coefficients were measured at different loading stages. The results indicate that PAC experienced both rapid and gradual reduction phases in air void content under high-temperature loading. After 100,000 cycles of loading, the air void content decreased by 5.44 %, void connectivity decreased by 4.32 %, and the average number of voids in section reduced by 8.30 %. The distribution range of nearly 90 % of void sizes shifted from below 7 mm to below 6 mm after 100,000 cycles. At different loading stages, the void content, average number and average equivalent diameter of connected voids exhibited a positive correlation and similar trends with the absorption capacity of PAC for small vehicle noise. This study provides novel insights and perspectives into the acoustic performance degradation of PAC due to void evolution under high-temperature loading.

In situ growth and shrinkage of coated voids in aluminium

Voids can be detrimental to the mechanical and electrical properties of materials but may also find applications in catalysis and plasmonics. Key to the performance of materials containing voids are the sizes and morphologies of the voids, which can be tuned by heat treatment. The present work investigates the morphological evolution of voids, with solute segregation at their surfaces, in an aluminium‑copper‑tin alloy during in situ heating in a transmission electron microscope (TEM). These voids exhibited complex morphological changes that included growth or shrinkage, in contrast to voids in pure Al, which all shrank and disappeared (as reported in an earlier study). Without electron irradiation, the voids never grew. Nearly one fourth of the voids grew under certain heating and electron irradiation conditions, showing distinct growth stages. Growth and shrinkage of the voids both occurred primarily along the surface of the Sn particles to which they were attached. The voids exhibited faceting as they grew and gained morphological isotropy while they shrank. The growth and shrinkage fronts were both found to be primarily the curved surfaces and not the facets at the void surfaces. Growth followed by shrinkage led to a well-defined rounded triangular shape, in projection, with smooth boundaries. This work is, to the best of our knowledge, the first to characterise the growth of nanoscale voids in aluminium using in situ heating TEM. The dual effect of heating and electron irradiation could be utilised to switch the voids between growth and shrinkage to manipulate the void size and shape. This work provides useful insights into tuning void morphologies in the development of advanced materials such as for applications in engineering, catalysis and plasmonics.

Damage analysis of functionally graded materials: A finite element investigation utilizing the Gurson–Tvergaard–Needleman (GTN) model for notched plates

This study examines the mechanical behavior of notched materials under severe uniaxial monotonic loading until failure. Instead of focusing on the structural damages caused by notches, this study explores the complex loading experienced by notches. Finite element analysis of notched specimens is performed using ABAQUS-explicit. It is based on Von Mises’ flow theory and the Gurson–Tvergaard–Needleman damage model for void growth and coalescence. Functionally graded materials are strategically applied around the notches to enhance structural integrity. Concept-1 is proposed near the notch for maximum reinforcement, while Concept-2 is proposed in the central graded area for the optimal transition between the two concepts. A volumetric fraction index is an essential tool for enhancing gradation design robustness. As a result, the model can accurately predict ductile ruptures and void evolutions, proving that gradation concepts play a pivotal role in the behavior of structures. As a result of analyzing structures subjected to severe loads in real-world environments within industries such as aerospace, automotive, and construction, this groundbreaking work contributes to the fundamental understanding of the mechanical behavior of materials under extreme loading conditions.

Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging.

The thermal expansion behavior of Cu plays a critical role in the bonding mechanism of Cu/SiO2 hybrid joints. In this study, artificial voids, which were observed to evolve using a focused ion beam, were introduced at the bonded interfaces to investigate the influence of compressive stress on bonding quality and mechanisms at elevated temperatures of 250 °C and 300 °C. The evolution of interfacial voids serves as a key indicator for assessing bonding quality. We quantified the bonding fraction and void fraction to characterize the bonding interface and found a notable increase in the bonding fraction and a corresponding decrease in the void fraction with increasing compressive stress levels. This is primarily attributed to the Cu film exhibiting greater creep/elastic deformation under higher compressive stress conditions. Furthermore, these experimental findings are supported by the surface diffusion creep model. Therefore, our study confirms that compressive stress affects the Cu-Cu bonding interface, emphasizing the need to consider the depth of Cu joints during process design.

Direct FE2 multiscale modeling of hydrogen-induced cracking in reactor pressure vessels

Leveraging on a recently developed multiscale simulation method, we propose a pioneering strategy for the multiscale analysis of hydrogen-induced cracking in reactor pressure vessels that considers micro-voids, their influences on hydrogen diffusion as well as the operating pressure of the vessel. In the finite element analysis, the nodal lattice hydrogen concentration and displacements are exchanged bi-directionally between the macroscale and microscale within a monolithic solution procedure. During the analysis, the voids are shown to cause non-uniform lattice hydrogen diffusion and the trapping effect, resulting in inter-void hydrogen accumulation, is demonstrated. Based on the hydrogen concentration on the void surfaces, the void hydrogen pressure was calculated for the hydrogen-induced cracking analysis. It was found that both internal shearing and necking failure modes exhibited micro-structure dependence. The internal shearing mode caused oriented through-wall propagation of cracks in the vessel pressure while the internal necking mode promoted void nucleation in the reactor pressure vessel. As a result, during the early stages of void evolution, the oriented internal shearing of the dispersed small voids showed a high possibility to induce through-wall failure of the reactor pressure vessel.

Understanding Kirkendall effect in Ni(W) diffusion-induced recrystallization region

This study elucidates the formation of distinct phases, such as intermetallic compounds (IMCs), and the evolution of Kirkendall voids. We not only observed the emergence of polycrystalline IMC layers and distinct diffusion-induced recrystallization (DIR) regions using various experimental methods but also quantified the elusive Kirkendall vacancy fraction by an extended numerical model. Experiments revealed the formation of polycrystalline layers with Ni4W and a distinct DIR region. Irregularly shaped Kirkendall voids were found in the DIR region in the Ni matrix. The observed DIR region thickness exceeding W penetration depth indicated rapid alloying. Experimental data and insights from the Ni-W phase diagram showed exclusive Ni4W formation. EBSD analysis revealed smaller Ni4W grains and larger, irregularly shaped DIR region grains. Quantification of Kirkendall voids through Blob analysis linked numerical results to experiments. Noteworthy findings include the fraction of Kirkendall vacancy and the evolution of the possible vacancy region calculations, highlighting their dependence on the W diffusivity and grain boundary diffusion. Temporal evolution of the vacancy region showed the absence of vacancies near Ni4W/DIR, with the leading edge at DIR/Ni, providing insights into annealing-induced vacancy distribution. This integrated approach enhances understanding of thermodynamics and kinetics in the Ni-W diffusion couple, advancing knowledge crucial for high-temperature materials science applications.

Grain size-dependent delay of avalanches during void evolution in a nanocrystalline Ni

The effect of grain size on the underlying dynamics of void evolution in a nanocrystalline (NC) Ni was dissected. Multiscale characterizations reveal that, unlike the suppression of void nucleation by the compressive stress in coarse-grained Ni, dispersive nano- and micro-voids formed readily in NC Ni during compression. Acoustic emission measurements and molecular dynamic simulations demonstrate that the unique structural features and deformation mechanics implicitly occurring in NC metals play multifaceted roles during void evolution. Although the presence of excessive nucleation sites, such as grain boundaries and triple junctions, together with the activation of intergranular plasticity facilitate void nucleation, high interface population retards dislocation-driven void expansion, resulting in sluggish void growth and a corresponding delay of coalescence avalanches.