Cured Epoxy Resin Research Articles

Study curing of epoxy resin by Isophoronediamine/ Triethylenetetramine and reinforced with montmorillonite and effect on compressive strength

Epoxy is a widely used thermosetting resin recognized for its exceptional performance in adhesives, coatings, and various other applications, attributed to its high tensile strength, stiffness, electrical performance, and chemical resistance. Epoxy-clay nanocomposites are extensively employed across diverse industries. The physical and chemical properties of these nanocomposites are influenced by the processing methods, clay modifiers, and curing agents used during their preparation. In this study, epoxy/nanoclay composites based on Diglycidyl Ether Bisphenol-A (DGEBA) will be cross-linked using Isophorone Diamine (IPD), a cycloaliphatic amine, and Triethylenetetramine (TETA), a linear aliphatic amine. The initial phase of the research will assess the impact of different types of cross-linkers, both individually and in combination at various molar ratios (such as Isophorone Diamine: Triethylenetetramine (IPA: TETA) / 25:75 and 75:25), on the compressive strength of the epoxy mortar. In the subsequent phase, the epoxy formulation with an Isophorone Diamine: Triethylenetetramine (IPD: TETA / 75:25), which demonstrates the highest compressive strength, will be selected for further investigation. This formulation will be used to evaluate the effects of different weight percentages (3%, 5%, and 7%) of organically modified montmorillonite (OMMT). The prepared epoxy composites will be characterized using a range of techniques, including Fourier Transform Infrared Spectroscopy (FT-IR), Transmission Electron Microscopy (TEM), and Scanning Electron Microscopy (SEM). The epoxy/nanoclay composite with an IPD: TETA / 75:25 and 3 wt % OMMT is expected to show the highest compressive strength, which is 94 MPa.

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

The 2.5D packaging technology is a high–performance method for electronic packaging. This study addresses the reliability issues of 2.5D packaging during the manufacturing process. A multi–physics field coupling Finite Element Method (FEM) has been developed, combined with sub–modeling techniques, to investigate the curing of underfill adhesive, the curing of Epoxy Molding Compound (EMC), and the reflow soldering between the interposer and substrate in a 2.5D packaging entity during various manufacturing procedures. The focus is on the thermo–mechanical–chemical behavior of viscoelastic components within the packaging structure, as well as the viscoplastic characteristics of the micro solder balls and microbumps. A systematic analysis is conducted on the warpage deformation and stress distribution of the 2.5D packaging at crucial time points. The results demonstrate that after curing, the overall warpage of the packaging exhibits a ‘concave’ warpage profile. Additionally, as the thickness of the EMC above the chip increases, the warpage value of the packaging also increases. The warpage value defined by linear elasticity is larger than that defined by viscoelasticity. The maximum Von Mises stress value in the key areas of the submodel is greater than the maximum Von Mises stress value in the corresponding key areas of the global model. After reflow soldering, the stress concentration in the micro solder balls occurs at the edge of the micro solder ball array. The maximum stress values for each component of the packaging are observed in the interface areas between the components. Packaging components that undergo the curing process have notably higher warpage and Von Mises stress values than those that do not undergo the curing process. The simulation method established in this study can accurately predict the warpage deformation and stress distribution state of 2.5D packaging, providing significant engineering application value for process optimization and reliability enhancement of 2.5D packaging in the production process.

Enhancing epoxy resin curing: Investigating the catalytic role of water as a trace impurity in dense crosslinked network formation using an advanced cat-GRRM/MC/MD Method1

The catalytic effect of water, a trace impurity in resins, facilitates efficient curing, affording a dense crosslinked network structure. Crosslinked networks are crucial for polymer properties. Water considerably influences the reaction pathways and kinetics and the final network structure and material properties. This study advances the cat-GRRM/MC/MD method to explore the specific role of water molecules as catalysts, though an impurity, in the curing of epoxy resins. Global reaction route mapping was used to compute the chemical reaction pathways and the corresponding energies. The resin properties were predicted via molecular dynamics simulations, complemented by the Monte Carlo method to simulate reaction kinetics and bond formation processes. Water molecules act as unique catalysts in the curing of epoxy resins, altering the reaction pathways and reducing the activation energies. The study revealed significant improvements in the physical properties of the resulting epoxy resins, aligning them more closely with the experimental material characteristics.

Catalyst‐free epoxy resins with high‐performance and excellent healing efficiency via interpenetrating networks

AbstractThe difficult recycling and degradation in cured epoxy resins can be solved by introducing dynamic covalent bonds. However, the introduction of dynamic bonds degrades the properties of epoxy resins. In this paper, the dual‐cured epoxy resin with high mechanical properties and high healing efficiency were obtained by constructing interpenetrating networks (IPNs). The effect of IPNs on the recyclability of epoxy resins was investigated. The performance is as follows, the flexural and tensile strengths is 89 and 54.2 MPa, respectively, and the breakdown strength is 32.5 kV/mm. In addition, the recyclability and high healing efficiency of the dual‐cured epoxy resin were verified, and the effect of the hot‐pressing temperature and time on the properties of the recycled samples were investigated. Under certain hot‐pressing conditions, the flexural and tensile strengths of the recycled samples were recovered to 95.06% and 85.28%, respectively, and the breakdown strength was recovered to 83.6%.

Design and Characterization of Epoxy Resin Systems Based on Mixtures of Imidazolium-Based Ionic Liquids with Docusate and Dicyanamide Anions

This study focuses on the synthesis, characterization, and application of four ionic liquids (ILs), three of which are being reported for the first time, with unique thermal properties and diverse anion-cation combinations, specifically in the context of epoxy resin polymerization. 1-3-Didodecylimidazolium dicyanamide (dDDIM DCA), 1-3-Didodecylimidazolium docusate (dDDIM DOSS), 1-ethyl-3-methylimidazolium dicyanamide (EMIM DCA), and 1-ethyl-3-methylimidazolium docusate (EMIM DOSS) were used to prepare six different mixtures with the same cation and with varying concentrations of DCA components, which is the main factor of an efficient polymerization, while the other component is intended to modify the properties of the cured resin. Mixtures based on EMIM cation demonstrated increased enthalpy and lower onset polymerization temperatures, indicating more efficient curing processes. The hardness of cured epoxy resins can be adjusted by altering the curing temperature and IL composition, with EMIM DCA and EMIM DOSS mixtures displaying high Shore A hardness, suitable for durable surface applications. In contrast, mixtures with higher dDDIM DCA proportions offered a balance between rigidity and flexibility, ideal for applications requiring both mechanical strength and elasticity.

Effects of mica modification with silane on the interface and corrosion resistance of ultraviolet curable epoxy acrylate/mica composite coatings

Effects of mica modification with silane on the interface and corrosion resistance of ultraviolet curable epoxy acrylate/mica composite coatings

Effect of nano silicon nitride integration on the curing performance of DGEBA epoxy matrix at ambient temperature

Epoxy curing requires substantial thermal energy input and is constrained by the specimen’s scale, shape, and design, especially with autoclave processing. This challenge is addressed in the present study by incorporating Silicon Nitride (SiN) nanoparticles into an epoxy matrix to enhance curing efficiency at room temperature. High-resolution transmission electron microscopy (HR-TEM) demonstrated a uniform dispersion of nanofillers within the epoxy, indicating improved mechanical and thermal stress transfer between the matrix and the filler. The interphase thickness, determined to be 1.16 nm using Lipatov’s theory and differential scanning calorimetry (DSC) thermograms, suggests excellent matrix-filler interaction and a significant increase in cross-link density. Thermogravimetric analysis (TGA) revealed an increase in activation energy by 63 %, 101 %, and 113 % at heating rates of 10, 20, and 30 °C/min, respectively, indicating enhanced thermal stability of the nanocomposite. Additionally, the char yield increased by 7 %, 18 %, and 22 % at the same heating rates, signifying the formation of effective crosslinks, leading to a higher proportion of solid remnants rather than volatiles during degradation.

Preparation of halogen-free flame retardant curing agent and its application in epoxy resin

9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide-N-Aminoethylpiperazine (DOPO-AEP), a phosphorus and nitrogen intumescent flame retardant curing agent was prepared by using acetonitrile as solvent using 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and N-aminoethylpiperazine (AEP) as raw materials. The structure of the flame retardant curing agent DOPO-AEP was analyzed Fourier Transform Infrared Spectrometer (FTIR), Nuclear Magnetic Resonance (NMR) and Electrospray Ionization Mass Spectrometry (ESI-MS), and the synthesis method of the target product was determined. In addition, the content of char residue was determined by thermogravimetric analyzer, and its thermal properties were comprehensively explored, and based on the obtained results, the curable epoxy resin was selected to prepare DOPO-AEP/EP flame retardant composites. According to the amount of DOPO-AEP added product, different proportions of DOPO-AEP/EP flame retardant composites were prepared, and the actual impact of flame retardant properties and mechanical properties of epoxy resin in different proportions was explored. When the content of DOPO-AEP is 35%, the limiting oxygen index of DOPO-AEP/EP reaches 29.9, which has a significant increase compared with the limiting oxygen index of pure epoxy resin of 19.8, but compared with the content of DOPO-AEP of 30%, the limiting oxygen index of DOPO-AEP/EP is 28.7, and there is no significant increase change. Comprehensive analysis shows that when the component content of DOPO-AEP is 30%, the flame retardant system has a tensile strength of 29.0 MPa, an impact strength of 4.5Kj/m2 and a flexural strength of 73.9 MPa, and its limiting oxygen index is as high as 28.7, and the comprehensive performance of the system is the best. By testing the surface morphology of the flame retardant composites after combustion by SEM, it was found that a dense char layer was formed on the surface of the epoxy resin cured char residue and foamed obviously, indicating that the flame retardant curing performance of DOPO-AEP was good.

Empirical model for the effect of air humidity during manufacturing on the glass transition temperature of carbon fiber reinforced hot curing epoxy – a case study

Carbon fiber-epoxy laminates are used in aerospace manufacturing, e.g. as substrates for solar cells of satellites. Commonly, fibers or fibermats are impregnated with epoxy resin and placed in the required orientation. During subsequent curing, the resin molecules are crosslinked. Cured parts are characterized by their glass transition temperature (Tg). It has been observed that Tg of epoxy matrix resin vary with recorded absolute air humidity during wet fiber placement manufacturing. Based on the production data of a series production of 203 carbon fiber laminates for space application, an empirical linear relationship between the absolute air humidity at the beginning of each production day and the observed glass transition temperature of the fully cured laminate is formulated and validated. The empirical equation describes a linear decrease of achievable glass transition temperature with increasing absolute air humidity. The quantitative nature of the results encourages straightforward practical application to determine the maximum achievable Tg for given production conditions.

Asynchronous Ring Opening of Cyclic Carbonate and Glycidyl Ether Induced Phase Evolution Towards Heat-Free and Rapid-Bonding Superior Epoxy Adhesive.

Structural adhesives that do not require heating are in high demand in the automotive and electronics industries. However, it remains a challenge to develop robust adhesives that rapidly achieve super adhesion near ambient temperature. Herein, a room-temperature curable, fast-bonding, and super strong epoxy-based structural adhesive was designed from the perspective of cross-scale structure, which lies in threefold pivotal aspects: (i) high branching topology of glycerol carbonate-capped polyurethane (PUGC) increases the kinetics of the ring-opening reaction, contributing to fast crosslinking and the formation of abundant urethane and hydroxyl moieties; (ii) asynchronous crosslinking of epoxy and PUGC synergistically induces phase separation of PUGC within the epoxy resin and the resulting PUGC domains surrounded by interpenetrated shell serves to efficiently toughen the matrix; (iii) abundant dynamic hydrogen bonds including urethane and hydroxyl moieties, along with the elastomeric PUGC domains, dissipate energy of shearing force. As a result, the adhesive strength rapidly grows to 16 MPa within 4 hours, leveling off to 21 MPa after 7 hours, substantially outperforming commercial room-temperature curable epoxy adhesives. The results of this study could advance the field of high-performance adhesives and provide valuable insights into designing materials for efficient curing at room temperature.

Asynchronous Ring Opening of Cyclic Carbonate and Glycidyl Ether Induced Phase Evolution Towards Heat‐Free and Rapid‐Bonding Superior Epoxy Adhesive

AbstractStructural adhesives that do not require heating are in high demand in the automotive and electronics industries. However, it remains a challenge to develop robust adhesives that rapidly achieve super adhesion near ambient temperature. Herein, a room‐temperature curable, fast‐bonding, and super strong epoxy‐based structural adhesive was designed from the perspective of cross‐scale structure, which lies in threefold pivotal aspects: (i) high branching topology of glycerol carbonate‐capped polyurethane (PUGC) increases the kinetics of the ring‐opening reaction, contributing to fast crosslinking and the formation of abundant urethane and hydroxyl moieties; (ii) asynchronous crosslinking of epoxy and PUGC synergistically induces phase separation of PUGC within the epoxy resin and the resulting PUGC domains surrounded by interpenetrated shell serves to efficiently toughen the matrix; (iii) abundant dynamic hydrogen bonds including urethane and hydroxyl moieties, along with the elastomeric PUGC domains, dissipate energy of shearing force. As a result, the adhesive strength rapidly grows to 16 MPa within 4 hours, leveling off to 21 MPa after 7 hours, substantially outperforming commercial room‐temperature curable epoxy adhesives. The results of this study could advance the field of high‐performance adhesives and provide valuable insights into designing materials for efficient curing at room temperature.

Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly

PurposeThe study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By comparing Sn58Bi and SAC305 particles and varying substrate widths, the research sought to provide insights into the stability and performance of solder joints under different scenarios, particularly in high-power applications.Design/methodology/approachThe study used a comprehensive design/methodology, encompassing the investigation of solder conductive particle types (Sn58Bi and SAC305) and substrate widths on the current carrying capability of FOB assembly. Stable solder joints were obtained by manipulating the curing speed of anisotropic conductive films for both particle types. Various tests were conducted, including current carrying capability assessments under differing conditions.FindingsThe study revealed that larger substrate widths yielded higher current carrying capability due to increased contact area and reduced contact resistance. Notably, solder joints remained stable beyond the solder melting temperature due to encapsulation by cured epoxy resin. SAC305 solder joints exhibited superior current carrying capability over Sn58Bi in continuous high-voltage conditions. The results emphasized the stability of SAC305 solder joints and their suitability for robust interconnections in high-power FOB assemblies.Originality/valueThis study contributes by offering a comprehensive assessment of the impact of solder particle types and substrate widths on solder joint performance in FOB assemblies. The finding that SAC305 joints outperform Sn58Bi under continuous high-voltage conditions adds significant value. Moreover, the observation of stable solder joints beyond solder melting temperature due to resin encapsulation introduces a novel aspect to solder joint reliability. These insights provide valuable guidance for designing robust and high-performance interconnections in demanding applications.

The effect of absorbed moisture and resin pressure on porosity in autoclave cured epoxy resin

AbstractOne of the main issues in epoxy‐based composite manufacturing is the formation of porosity derived from moisture absorption during storage and layup due to the high hydrophilicity of epoxy matrices. During the curing process, the presence of moisture and other volatile compounds can initiate the nucleation and growth of voids. In this study, the effect of both the initial water content absorbed in the uncured resin and the pressure on the porosity development in an epoxy resin was investigated. In particular, Kardos' and Ledru's models, aimed at predicting void formation in polymers, were applied to study the effect of different hydrostatic pressures in an epoxy resin during curing up to the gel point, after conditioning it at two different relative humidity levels, 50% and 95%. Subsequently, the porosity of the cured resin samples was quantified through density measurements. Comparative analysis of the microscopy images of cured samples and the predictions of both models revealed an overestimation of the final void sizes by both models, with the Kardos' model exhibiting a higher deviation. Additionally, a finite element model was employed to investigate the conditions leading to void formation, aiming to understand the factors influencing the porosity development and properly set the process parameters during composite manufacturing.Highlights Evaluation of the conditions leading to void growth in epoxy resin during curing Moisture sorption in uncured epoxy resin Effect of curing pressure on pore development Finite element analysis for void growth during resin curing

Co-enhancement of toughness and strength of room-temperature curing epoxy adhesive derived from hydroxyl-terminated polybutadiene based polyurethane resin

Incorporation of flexible chains into epoxy adhesives facilitates toughening but usually poses an opposite effect on strengthening. Herein, by combining hydroxyl-terminated polybutadiene (HTPB) with polyether diol as soft chains, epoxy-terminated polyurethane (EHTPU) is synthesized, a strategy balancing strengthening and toughening is developed. The use of polyolefin soft chains substantially contributes to sea-island phase separation for maintaining low glass transition temperature (Tg) and high strength and toughness simultaneously. Specifically, the modified epoxy adhesive has seen a significant increase in shear strength to 19.75 MPa, tensile strength to 48.25 MPa and fracture toughness to 3.63 MPa·m1/2, with increment of 914 %, 268 %, and 149 %, respectively, compared to neat epoxy. Moreover, even under low temperatures of -45 °C, the modified epoxy resin can still maintain a high shear strength, demonstrating excellent low-temperature adhesion performance. At the same time, the incorporation of EHTPU does not significantly affect the overall thermal stability of the epoxy resin, meeting the requirements for stability in practical applications. It is worth mentioning that the adhesive exhibit excellent bonding performance under different environments and substrates, indicating that this composite material has broad application prospects in various industrial fields. These findings provide valuable insights into optimizing the performance of epoxy resins by controlling the introduction of specific modifiers and offer new ideas and methods for the development of room temperature curing epoxy resin adhesives.

Electrothermal Curable Epoxy Interface Adhesive Composite with Low Voltage: An Ideal Thermal Management and EMI Shielding Material

Electrothermal Curable Epoxy Interface Adhesive Composite with Low Voltage: An Ideal Thermal Management and EMI Shielding Material

Innovative Approaches for Manufacturing Epoxy-Modified Wood and Cellulose Fiber Composites: A Comparison between Injection Molding and 3D Printing.

The current study focused on improving the properties of polylactic acid (PLA) for wider application in load-bearing scenarios. Various methods were explored to optimize the interaction between PLA and natural fibers, particularly wood fibers (WFs). Alkalized and epoxy-impregnated WFs were evaluated against untreated WFs and cellulose fibers in both injection molding (IM) and fused deposition modeling (FDM). FTIR analysis revealed the removal of hemicellulose and lignin in alkalized WFs and uniform epoxy curing. Addition of fibers reduced PLA's thermal stability while acting as nucleating agents. Additionally, fibers augmented the storage modulus of biocomposites, with alkalized fibers exhibiting the highest tensile modulus in IM. FDM samples with a 0° raster angle showed superior impact resistance compared to IM counterparts. Moreover, raster angle significantly influenced FDM biocomposite properties, enhancing the tensile strength and modulus of untreated WF and cellulose fibers at 0°. Although FDM did not produce alkalized WF samples, epoxy impregnation emerged as a promising method for enhancing PLA/WF composite mechanical properties in the IM process, offering valuable insights for composite material development.

Interlaminar toughening of carbon fiber/epoxy composites via interleaving co‐polyamide (Co‐PA) veils

AbstractThermoplastic veil interlayers offer a promising approach to improve interlaminar reinforcement in composite materials. This study investigates co‐polyamide (Co‐PA) interleaved veils, fabricated through the hot melt adhesive (HMA) technique. These veils are then applied with varying areal weight densities as interleaves to simultaneously toughen and strengthen carbon fiber/epoxy (CF/EP) composites, utilizing the vacuum‐assisted resin infusion (VARI) method. Integrating Co‐PA veils with a low melting point in the interlaminar of CF/EP composites improves compatibility and promotes strong adhesion between thermoplastics and epoxy resins. As result, The Co‐PA laminates exhibited significant improvements compared with the untoughened composites, with a maximum enhancement of 148.1% and 67.8% for Mode‐I (GIC) and Mode‐II (GIIC), respectively. Moreover, ILSS, tensile strength, and flexural strength improvements were also 20.9%, 34.9%, and 14.5%, respectively. The fracture surface analysis via scanning electron microscopy directly revealed the crack propagation on the fracture surfaces of Mode‐I and Mode‐II specimens. This analysis revealed that Co‐PA demonstrated excellent compatibility with epoxy resin, melts during the stage of epoxy curing, and undergoes phase separation in the later stage, resulting in the formation of “bead‐like” structures within the fibrous network. Remarkably, this structure significantly enhanced the toughness of the CF/EP composites. The Co‐PA veils can improve the interlaminar toughness of CF/EP composites due to their compatibility with the epoxy matrix and high inherent toughness and strength. This method is straightforward to manage and can be utilized for manufacturing large‐scale composite materials incorporating CF fabrics, demonstrating promise for industrial applications.Highlights With its low melting point, co‐polyamide helps prevent structural failure or excessive damage and is proposed to be utilized in composites to enhance the interlaminar fracture toughness properties. The effects of Co‐PA veils of different areal densities on the mechanical characteristics of interlaminar composites were examined. Co‐polyamide particles with fiber‐carbon laminates offer superior fatigue properties and an optimum carbon fiber‐bridging mechanism. Co‐polyamide veils with CF/EP laminates are feasible for structural use in high‐tech automotive applications.

Reconstruction of particle distribution for tomographic particle image velocimetry based on unsupervised learning method

The development of deep learning has inspired some new methods to solve the 3D reconstruction problem for Tomographic Particle Image Velocimetry (Tomo-PIV). However, the supervised learning method requires a large number of data with ground truth as training information, which is very difficult to gather from experiments. Although synthetic datasets can be used as alternatives, they are still not exactly the same with the real-world experimental data. In this paper, an Unsupervised Reconstruction Technique based on U-net (UnRTU) is proposed to reconstruct volume particle distribution explicitly. Instead of using ground truth data, a projection function is used as an unsupervised loss function for network training to reconstruct particle distribution. The UnRTU was compared with some traditional algebraic reconstruction algorithms and supervised learning method using synthetic data under different particle density and noise level. The results indicate that UnRTU outperforms these traditional approaches in both reconstruction quality and noise robustness, and is comparable to the supervised learning methods AI-PR. For experimental tests, particles dispersed in cured epoxy resin are moved by an electric rail with a certain speed to obtain the ground truth data of particle velocity. Compared with other algorithms, the reconstructed particle distribution by UnRTU has the best reconstruction fidelity. And the accuracy of the 3D velocity field estimated by UnRTU is 12.9% higher than that from the traditional MLOS-MART algorithm. It demonstrates significant potential and advantages for UnRTU in 3D reconstruction of particle distribution. Finally, UnRTU was successfully applied to the high-speed planar cascade airflow field, demonstrating its applicability for measuring complex fluid flow fields at higher particle density.

A latent curing agent for rapid curing of phenolic epoxy resin at low temperature

AbstractDeveloping effective latent curing agent for rapid curing of epoxy resins at low temperatures remains challenging. This study reports a latent curing agent, ortho‐cresol phenolic epoxy resin‐bisphenol A (EOCN‐BPA), prepared through the addition reaction of o‐methyl phenolic epoxy resin with BPA. When blended with dicyandiamide (DICY) in a 1:3 molar ratio, EOCN‐BPA/DICY is used to cure a linear epoxy phenolic novolac (EPN) resin (epoxy equivalent: 550 g eq−1, softening point: approximately 82°C), at an onset curing temperature of 90°C, which is considerably lower than the onset curing temperature of DICY with EPN (160°C). However, EOCN‐BPA does not react with EPN without a catalyst. Therefore, this latent curing system is successfully applied in powder coatings, rapid curing at 120°C within 3 min without an additional catalyst, outperforming the EPN/EOCN‐BPA system using cocatalyst 2‐methylimidazole. Consequently, DICY catalyzes the curing reaction between the phenol hydroxyl group and epoxy resin and participates in it. The prepared powder coating exhibits excellent storage stability, maintaining its properties for over 3 months at room temperature. These findings demonstrate the excellent latent properties of EOCN‐BPA/DICY, highlighting its potential as a highly effective latent curing agent.

Design and preparation of low-temperature curable, tough, repairable epoxy containing hindered urea-based dynamic reversible bonds

ABSTRACT Traditional epoxy resins are of technological significance for structural adhesives and composite materials, as well as many others. However, brittleness limits its further development, and achieving a combination of toughness and rigidity in epoxy networks remains a great challenge. In this work, we designed and synthesized low-temperature curable, tough and repairable epoxy networks via hindered urea bond (HUB) crosslinking strategies. Mechanical testing revealed that the material exhibited simultaneously improved toughness and stiffness, and specifically, tensile strength, elongation at break, and toughness were able to reach 78.2 MPa, 8.61%, and 4.63 MJ · m−3, respectively. More importantly, the dynamic exchange of HUB dispersed between polymer chains enables HUB crosslinked epoxy with thermal-triggered reparability and recyclability. In addition, thermal properties, chemical stability and water resistance of toughened epoxy samples were also characterized. This work provides a practical guidance for the exploration of high-performance epoxy with the potential to be extended to other polymers.