The electrochemical spark process, alternately known as the electrochemical discharge process or sparkassisted chemical engraving process, is emerging as a viable machining process. Though it emerged accidentally, has been found to be useful in the machining of wide variety of materials. The process has received global attention mainly because of its applicability to electrically non-conducting materials. Many researchers have investigated the process, especially its spark formation mechanism, its hydrogen gas evolution together with its bubble formation mechanism, and its material-removal mechanism. With our intensive experimental research investigations, we have tried to understand the underlying phenomena during the process. With this information, we announce its application to the micromachining of a wide range of materials, including copper, tungsten, molybdenum, glass, quartz, and silicon, among others. With the careful design of the experimental setup, tool material selection, power supply selection, and the in-house development of an automated 5-DOF machine, we have been able to achieve micro-level machining, deposition, and surface modification. These phenomena can be achieved simultaneously or one at a time. Simultaneous surface treatment, micromachining, and copper deposition on a silicon wafer, are achieved using this process. A novel metrology technique based on replica making using polymeric material is devised to measure the depth and width of the microchannels produced using ElectroChemical Spark MicroMachining (ECSMM). This metrology technique is prominent in the study of surface morphology.