Energy resolution and leakage current are two key parameters for semiconductor neutron detectors. Metal-Oxide-Semiconductor (MOS) detectors introduce an additional oxide layer compared to Schottky Barrier Diodes (SBDs) detectors in order to reduce leakage current. However, this also leads to a degradation in energy resolution due to the introduction of an additional dead layer. Therefore, optimizing the thickness of the oxide layer is important for MOS detectors. In this study, a 4H–SiC-based MOS thermal neutron detector was designed with comprehensive consideration of the oxide layer. Subsequently, a prototype of the detector was fabricated and tested. The prototype of the MOS detector achieved an nA-level leakage current under a reverse bias of −200 V. Additionally, it demonstrated good energy resolution performance in a moderated D-T neutron source test. The MOS detector was able to clearly distinguish between the two reaction channels of 10B converter events, which is consistent with the theoretical branching ratio. This work highlights the potential application of 4H–SiC-based MOS detectors for thermal neutron detection.