Electroplated Diamond Wheels Research Articles

Investigation on ultrasonic-assisted grinding of characteristics of C/SiC composites by brazed and electroplated diamond wheels

Investigation on ultrasonic-assisted grinding of characteristics of C/SiC composites by brazed and electroplated diamond wheels

Chip loading on electroplated diamond wheels in trimming process for CFRPs and effects by in-process laser dressing

Chip loading on electroplated diamond wheels in trimming process for CFRPs and effects by in-process laser dressing

Experimental research on wear mechanism of diamond wheels for grinding Cf/SiC composites grooves

Aiming at the problems of low processing efficiency, low groove shape accuracy and poor surface quality caused by grinding wheel wear in the grinding process of Cf/SiC composite grooves. In this paper, based on the motion mode of grinding wheel grinding, the wear volume formula of grinding wheels was analyzed, and the grinding wheel wear comparison experiment of different bond diamond grinding wheels grinding Cf/SiC composite grooves was carried out, and the more suitable kind of diamond grinding wheel for grinding Cf/SiC composite grooves was selected. From the experimental results, compared with the ceramic-bonded diamond wheel and resin-bonded diamond wheel, the grinding times of electroplated diamond wheel grinding Cf/SiC composites were increased by 20 and 104, respectively, and the surface roughness of the groove was most stable and the processing damage was smallest. Therefore, the best quality of grinding Cf/SiC composites groove was obtained by the electroplated diamond grinding wheel, and its life in grinding Cf/SiC composites was the longest. At the same time, the wear mechanism of the electroplated grinding wheel was explored, the wear on the bottom surface of the electroplated grinding wheel was more serious than that on the circumferential surface. The wear on the bottom surface was mainly wear and tear, and it gradually diffused along the inner diameter of the grinding wheel with the increasing grinding times.

Kinematic modeling of surface topography ground by an electroplated diamond wheel

This paper presents a three-dimensional kinematic simulation of surface topography ground by a D301 electroplated diamond wheel. For an individual cubo-octahedron diamond grain, its cutting process is modeled by decomposing it into active grain edges and discrete cutting points. By successively integrating the material removal caused by all the grains, the ground surface topography of workpiece is successfully predicted. The predicted surface roughness is close to the theoretical and experimental values with relative errors of − 7.9% and − 3.3% for aluminum and fused silica, respectively. The study reveals that the other amplitude parameters, e.g., kurtosis and skewness, of surface profiles can reflect the material removal mechanisms. The lateral pile-up of plastic aluminum alloy in grinding increases the kurtosis while the fracture of brittle fused silica results in a prominently negative skewness. For a fresh grinding wheel, the surface roughness Ra reaches a plateau after a rapid increase as the grinding depth increases to 1.25 times the SD of the grain protrusion heights. By contrast, the effects of grinding depth on the surface topography are negligible when the wear depth is beyond a certain value. As the feed rate increases, the number of active abrasive grains gradually increases. Meanwhile, the effect of the grain circumferential distribution on the workpiece surface topography becomes significant.

High performance grinding of titanium alloys with electroplated diamond wheels

This paper is concerned with an experimental study on grinding titanium alloys using electroplated diamond wheels with focus on wheel wear and its effects on forces, power, and surface roughness. Straight surface grinding experiments were conducted to measure forces, power, surface roughness, and wheel wear. Specific energy values ranging from about 19 to 43 J/mm3and G-ratios from about 296 and 944 were obtained. It was found that a higher material removal rate results in a lower G-ratio and electroplated diamond wheels wear less than electroplated CBN wheels on titanium alloys under other identical conditions.

Experimental Investigation on Face Grinding of 2024AI/SiCp with Electroplated Diamond Wheel

SiCw / 2024Al composite has excellent physical and chemical properties, such as high specific strength, good wear resistance, low coefficient of thermal expansion, etc. It has been widely used in the development of modern science and technology. An experimental research on face grinding of SiC particle-reinforced aluminium matrix composite 2024Al/SiCp with electroplated diamond grinding wheel was carried out. The effects of different grinding parameters on the surface morphology, grinding force and grinding quality of workpiece are analyzed. The results show that high quality ground surface can be achieved by using this technology; the residual stress on machined surface is compressive stress; grinding parameters have little effects on tangential and normal grinding forces, but have stronger effect on axial grinding force than that in other two directions, and the axial grinding force increased notablely as the increasing of grinding depth.

Performance evaluation of creep feed grinding of γ-TiAl intermetallics with electroplated diamond wheels

This paper evaluates the performance of creep feed grinding γ-TiAl intermetallic (Ti-45Al-2Mn-2Nb) using electroplated diamond wheels. Firstly, a comparative analysis with the grinding results by using electroplated CBN wheels was conducted, mainly involving abrasive wheel wear behavior and maximum material removal rate below surface burn limit. It was found that the diamond wheel would produce much better grinding results including lower wheel wear rate and higher maximum material removal rate. Then the surface integrity obtained at different level of material removal rate was characterized with the utilization of the diamond wheel. The poor ductility of this γ-TiAl intermetallic material was found to have a marginal effect on the surface integrity, as no severe surface defects such as material pullout were generated during the stable wheel wear stage. For the involved operating parameters, a deformation layer was produced with ∼10 μm or more in thickness depending on the material removal rate used. Meanwhile, a work-hardened layer extending to more than 100 μm was produced with a maximum microhardness of above 520 HV0.05 (bulk value 360 HV0.05). The residual stress remained compressive, with a value of above −100 MPa and even up to −500 MPa for an elevated material removal rate. Shearing chip was the main chip type, indicating good wheel sharpness in the grinding process.

The wear mechanisms of diamond grits in grinding of alumina and yttria-stabilized zirconia under different cooling-lubrication schemes

Abrasion is the primary wear mechanism of diamond grits during grinding of advanced ceramics. This work not only highlights some unreported modes of wear of diamond grits but also illustrates and describes their mechanisms while grinding two dissimilar advanced ceramics, viz. alumina and yttria-stabilized zirconia (YSZ). Long-cycle plunge grinding of the ceramics was conducted with single-layer electroplated diamond wheels at 30 m/s and 50 m/s grinding speeds under three different cooling-lubrication schemes – flood cooling (FC), MQL-soluble oil (MQL-SO) and MQL-neat oil (MQL-NO). Radial wheel wear was measured employing indirect profilometry. Diamond grits on the electroplated wheels were observed under SEM before and after grinding to identify and characterize various modes of wear. Severe wheel loading was observed while grinding alumina and YSZ under FC and MQL-SO. Indentation fatigue fracture was found to be the dominant mode of diamond grit wear during alumina grinding under wheel loading conditions. The wear of diamond grits during YSZ grinding was dominated by thermal fatigue fracture at a higher grinding speed of 50 m/s. Thermal degradation of diamond grits was examined with Raman spectroscopy which revealed graphitization of some of the active diamond grits after YSZ grinding under FC and MQL-NO at 50 m/s.

Design of assembled substrate of electroplated diamond grinding wheel for disassembly of abrasive layer

Expensive diamond grains remaining within waste diamond grinding wheels and wheel substrate need to be recycled. Electroplated diamond grinding wheel was taken as an example. An idea of “substrate structure-induced cracks (SSIC)” was proposed to solve the disassembly problem of waste electroplated diamond wheels. An assembled substrate for electroplated diamond grinding wheel was designed. Fabrication and disassembly experiments of electroplated diamond wheel with assembled substrate were carried out. Also, finite element analysis was used to investigate the mechanism of disassembly processes. Recycling experiments of electroplated diamond wheels were carried out in three ways, namely acid corrosion method, electrolysis method and SSIC method. The experimental results show that cracks generate in the diamond abrasive layer of the assembled wheel. The simulated maximum principal stress occurs on diamond abrasive layer near the mating surface between cylindrical pins and substrate, which is consistent with the location where the crack is created. The abrasive layer can be easily peeled off from substrate after the cracks occur on abrasive layer. Compared with electrolysis and acid corrosion methods, the SSIC method has the shortest disassembly time and the lowest disassembly costs. The assembled substrate provides possibility to exert cracking forces from substrate to diamond abrasive layer. With assembled substrate, the nondestructive disassembly of electroplated diamond wheel can be fulfilled. Assembled substrate can meet the need of DFD for electroplated diamond grinding wheel.

N<sub>2</sub>-gas assisted truing method of electroplated diamond wheel

N<sub>2</sub>-gas assisted truing method of electroplated diamond wheel

Three-dimensional characterization and modeling of diamond electroplated grinding wheels

This paper presents a study on the three-dimensional characterization and modeling of morphology of diamond abrasive grains and electroplated diamond grinding wheels. A diamond abrasive grain was modeled by a cubo-octahedron that was determined by the intersection between an octahedron and a cube. The study revealed that the side length of octahedron and its side-length ratio followed a normal distribution and a generalized extreme value distribution, respectively. High-precision characterizations of grain density and protrusion height were realized by measuring wheel replicas with laser scanning confocal microscopy (LSCM). It was found that the grain protrusion height followed a normal distribution with an average of ∼40% of the grain size. Considering the randomly-distributed shape, size, position and protrusion height of abrasive grains, a geometric model of electroplated diamond wheels was established. The results show that the predicted morphology of grinding wheels agreed well with the experimentally measured. The model enables an accurate kinematic simulation for designing precision grinding processes.

Grinding of Chromium Carbide Coatings Using Electroplated Diamond Wheels

This paper reports an experimental study on grinding of chromium carbide coatings using electroplated diamond wheels. The work was motivated by machining carbide coatings in gas turbine engine applications. The objective is to explore the process conditions and parameters satisfying the ground surface quality requirements. Surface grinding experiments were conducted with water-based grinding fluid on chromium carbide coated on flat surfaces of aluminum blocks for rough grinding at a fixed wheel speed vs = 30 m/s, and finish grinding at vs = 30, 60 m/s. The effects of depth of cut and workspeed on grinding power, forces, and surface roughness were investigated for each of the wheel speeds. Material removal rate Q = 20 mm3/s for rough grinding at a grinding width b = 101.6 mm was achieved. It was found that the maximum material removal rate achievable in rough grinding was restricted by chatters, which was mainly due to the large grinding width. The specific energy ranged from 27 to 59 J/mm3 under the tested conditions. Surface roughness Ra = 3.5–3.8 μm were obtained for rough grinding, while Ra = 0.6–1.5 μm were achieved for finish grinding. Surface roughness was not sensitive to grinding parameters under the tested conditions, but was strongly dependent on the diamond grain sizes. Imposing axial wheel oscillations to the grinding motions reduced surface roughness by about 60% under the tested condition. It was proved that it is feasible to grind the chromium carbide coating with electroplated diamond wheels.

Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction

Due to the significant difference between the reinforcement grains and matrix phase, the machining of SiC particle-reinforced aluminum composites (SiCp/Al) is difficult and costly, especially for SiCp/Al with volume fraction higher than 50%. Ultrasonically assisted grinding (UAG), which has unique advantages in the machining of both ductile and brittle materials, is a promising solution of the machining of SiCp/Al. This study conducts both UAG and conventional grinding (CG) process on SiCp/Al with an electroplated diamond wheel. The study explores material removal mechanisms involved in UAG in comparison to that in the CG. It also investigates grinding forces, surface integrity, subsurface damage, and wheel wear. The study finds that material removal in grinding of SiCp/Al is dominated by SiC particle fracture that is induced in the grinding process. The ground workpiece is smeared with an aluminum layer, making it difficult to evaluate surface integrity. Compared with CG, UAG of SiCp/Al results in similar surface integrity in terms of surface roughness and subsurface damage, but a much lower grinding force (35–50% lower).

Ultrasonic assisted creep feed grinding of gamma titanium aluminide using conventional and superabrasive wheels

The paper details experimental work on ultrasonic assisted creep feed grinding (UACFG) of γ-TiAl intermetallic alloy: Ti–45Al–2Mn–2Nb+0.8vol.%TiB2XD (wt%), using conventional SiC and electroplated diamond wheels. The majority of forces recorded were lower when using vibration assistance compared to conventional CFG by up to ∼35%, while grinding-ratios for the superabrasive wheel were substantially higher by a factor of 2–7. A reduction in workpiece surface roughness by up to ∼10% together with fewer defects and marginally increased subsurface microhardness by a maximum of ∼8%, was obtained when employing ultrasonic assistance. With uprated process parameters however, the effects of UACFG were less apparent.

Improved grinding performance of electroplated diamond wheel trued by UV-irradiation polishing

Improved grinding performance of electroplated diamond wheel trued by UV-irradiation polishing

Study on force modeling considering size effect in ultrasonic-assisted micro-end grinding of silica glass and Al2O3 ceramic

Ultrasonic vibration-assisted micro-end grinding (UAMEG) is a promising processing method for micro-parts made of hard and brittle materials. Grinding force is one of the most important parameters which can synthetically reflect the grinding process. So, it is a key issue to establish a model for the reliable prediction of grinding force in UAMEG. First, by studying removal mechanism and the micro-topography of grinding surface, the micro-end grinding zone is divided into the following three grinding regions: main grinding region, plowing grinding region, and sliding grinding region. Then, the single-grain force model is developed under different material removal modes, and the grinding force model of the whole grinding wheel is established considering size effect. To verify the correctness of the proposed model, contrast grinding tests of silica glass with and without ultrasonic assistance using micro-radial electroplated diamond wheel are conducted. The theoretical predicted values of grinding force match well with the experimental results. The grinding forces are significantly reduced, and ductile machining is easier to be achieved.

A novel ultrasonic-assisted dressing method of electroplated grinding wheels via stationary diamond dresser

To achieve fine surface roughness, tungsten carbides are mostly ground with resin or vitrified bonded diamond wheels. The use of cost-effective electroplated diamond tools (single layer) is, despite some specific improvements, such as geometrical flexibility, excellent profile holding, large chip spaces and good cooling characteristics, which allows even dry grinding processes, unusual when fine surface roughness is desired. It is generally due to the high grain protrusion (approx. 40 % compared to approx. 15 % with resin bonded or vitrified diamond wheels) which leads to the induced grooves on the ground surface combined with high surface roughness. Another disadvantage of single-layer bonded grinding wheels is their low range of dress ability. This article describes a possibility to overcome the drawbacks of the electroplated diamond wheels by ultrasonic-assisted fracturing of the diamond grains. For this purpose, an ultrasonic-assisted stationary dresser is used. The ultrasonic unit generates hits on the diamond grains. The grinding wheel rotates with a very slow circumferential speed, which is uncommon in conventional dressing methods, so that the grains are fractured by the oscillating movement of the dresser. However, numerous sharp cutting edges are generated due to the generated hits. This method allows the generation of cutting edges on relatively course grain sizes (in this case, D251) that have the properties of smaller grain sizes, and therefore, surfaces with lower roughness values are produced while the advantages of the electroplated grinding wheels, such as good profile keeping and good cooling characteristic, are maintained. Additionally, the service life of the electroplated wheel can be increased and the grinding parameters can be kept nearly constant. Experimental analyses have shown that the grinding of tungsten carbide with fractured electroplated D251 diamonds enables fine surface roughness from Ra < 0.1 μm and Rz < 0.8 μm.

The Development of Dislodgement Free Diamond Electroplated Wheel for Engineering Ceramic Grinding Processes

The engineering ceramic grinding process with an electroplated diamond wheel is significantly influenced by the detrimental effect of the grain dislodgement which causes surface roughness degradation and tool life decrease. Therefore, the thickness of the electroplated bond layer must be large enough to provide sufficient micro-bonding force to overcome the single grain micro-cutting force during grinding. However, large electroplated bond layer thickness hampers the protrusion condition of the grains, and causes insufficient active grains. The conventional „trial and error‟ method based on heuristic knowledge currently appears to be the only way in developing electroplated diamond wheels. The difficulty of a deterministic wheel design lies in the lack of an integrated model to predict micro-bonding force and the protrusion conditions of all diamond grains on the wheel surface for given a grain size, dimensional distribution, and bond layer thickness. In this paper, the digital grinding wheel model is developed for single layer electroplated diamond wheels by simulating each wheel fabrication procedure numerically. The model provides a 3D view of the wheel surface condition and micro-bonding force, protrusion information in correlation with the wheel design parameters, e.g. grain size, dimensional distribution and bond layer thickness. Based on the analysis of the micro-cutting force on a single grain during grinding, the optimal electroplated bond layer thickness can be determined. Finally, a grinding experiment for an alumina engineering ceramic is carried out to verify the efficacy of the model in the development of dislodgement free diamond wheels.

Study on Grinding Force Distribution on Cup Type Electroplated Diamond Wheel in Face Grinding of Cemented Carbide

In order to establish a high performance grinding method of cemented carbide, the grinding force distribution on the working surface of the cup type electroplated diamond grinding wheel is experimentally analyzed with the grinding force variation of face grinding, which is carried out on the narrow workpiece. The grinding force distribution is obtained by the successive difference of the grinding force variation. The grinding state becomes steady as soon as beginning of the interference of grinding wheel in workpiece, because the edge profile of workpiece is formed as same as the envelope of the grinding wheel. Main conclusions obtained in this study are as follows. In the region of the front edge of the grinding wheel, relatively large grinding force occurs, then in the region of the rear edge of the grinding wheel, the grinding force becomes smaller. In the left right-side end of the wheel, the grinding forces are larger than the center of the wheel. It is made clear that the grinding force distribution shows the peak value near the outer part of the wheel, and the peak value is larger in the center part of the wheel, on the contrary, the peak width become broad in both the left and right-side end of the wheel.

Study on Effect of Ultrasonic Vibration on Grinding Force and Surface Quality in Ultrasonic Assisted Micro End Grinding of Silica Glass

Ultrasonic vibration assisted micro end grinding (UAMEG) is a promising processing method for micro parts made of hard and brittle materials. First, the influence of ultrasonic assistance on the mechanism of this processing technology is theoretically analyzed. Then, in order to reveal the effects of ultrasonic vibration and grinding parameters on grinding forces and surface quality, contrast grinding tests of silica glass with and without ultrasonic assistance using micro radial electroplated diamond wheel are conducted. The grinding forces are measured using a three-component dynamometer. The surface characteristics are detected using the scanning electron microscope. The experiment results demonstrate that grinding forces are significantly reduced by introducing ultrasonic vibration into conventional micro end grinding (CMEG) of silica glass; ultrasonic assistance causes inhibiting effect on variation percentages of tangential grinding force with grinding parameters; ductile machining is easier to be achieved and surface quality is obviously improved due to ultrasonic assistance in UAMEG. Therefore, larger grinding depth and feed rate adopted in UAMEG can lead to the improvement of removal rate and machining efficiency compared with CMEG.