Electronic Packaging Industry Research Articles

Grain Boundaries in High Thermal Conductivity Aluminum Nitride.

ABSTRACTThe benefits of AIN as a substrate material for the electronics packaging industry appear to be limited by the deleterious effects of boundaries in the polycrystalline material. Some observations on different types of boundary in AIN using several complementary techniques are reported.

Keeping an eye on the Japanese

A privileged group has been given an opportunity to see the electronic packaging industry in Japan. Stephen McClelland read their report.