Performance Of Electronic Systems Research Articles

Enhancing voltage regulation in high-speed digital circuits: A simulation-based analysis of the modified Ohm's law

Voltage droop is a significant challenge in high-speed digital circuits, impacting the reliability and performance of electronic systems. This paper introduces a novel approach based on a Modified Ohm's Law to address this issue. By incorporating nonlinear resistance effects, the Modified Ohm's Law provides a more accurate representation of circuit behavior, particularly under dynamic conditions. Through a rigorous simulation framework, the behavior of power supply models under varying load conditions is analyzed. The paper systematically examines circuit responses, load variations, and power supply dynamics, integrating both Standard and Modified Ohm's Law to compare their effectiveness in voltage regulation. The simulation results indicate that the Modified Ohm's Law provides a more accurate prediction of voltage behavior, particularly under rapid load changes, leading to significant improvements in voltage stability. The applied parameter sweep analyses reveal that adjusting the time constant of the power supply within the Modified Ohm's Law framework yields superior voltage regulation compared to traditional methods. Additionally, the analysis of frequency and amplitude variations demonstrates the robustness of the Modified Ohm's Law in maintaining voltage stability across different operational scenarios. This approach effectively addresses the nonlinearities in resistance, reducing voltage droop and enhancing the reliability of high-speed digital circuits. The findings demonstrate the potential of the Modified Ohm's Law in practical applications, suggesting further research and real-world experimentation to fully explore its benefits and implementation strategies. This work contributes to the advancement of voltage regulation techniques, offering a robust solution to the persistent problem of voltage droop in modern electronic systems.

Quantitative analysis of the high speed and high precision waveform digital system for Jinping Neutrino Experiment

The Jinping Neutrino Experiment (JNE) aims to construct a 500-ton liquid scintillator detector for detecting and studying neutrinos. In JNE data analysis, particle energy and position reconstruction are crucial, with result accuracy closely related to the performance of the waveform digitization system. This study developed a quantitative model to explore correlations between sampling characteristics (effective number of bits and sampling rate) and detector system performance (single photoelectron charge spectrum resolution and transfer time spread). Additionally, three ADCs (Tsinghua ADC13B1G, ADI AD9695, TI ADS54J60) and MCP-PMTs were utilized to validate the model accuracy. The experimental results for the system charge spectrum resolution are in alignment with the theoretical predictions. When the ENOB of the ADC exceeds 10.66-bit and the sampling rate exceeds 1 GSPS, the system charge spectrum resolution is better than 45%, approaching the PMT inherent resolution of 44%. The transfer time spread within the system demonstrates minimal impact from the ADC sampling characteristics. These results serve as a reference for upgrading the JNE 60-channel and 4000-channel readout electronic systems. Additionally, this study can assist developers in maximizing the performance of physics experiment readout electronics systems within constrained budgets.

INDIDO: A novel low-power approach for domino logic circuits

Power dissipation in Nanoelectronic circuits at advanced technology nodes is dominated by leakage power dissipation. This is due to an increase in short channel effects in the scaled transistors.The VLSI industry is seeking alternative options to enhance the performance of portable electronic systems by ensuring higher speed and reduced power dissipation. In the ultra-deep submicron (DSM) regime, a new device called the fin-shaped field effect transistor (FinFET) was developed to replace CMOS technology. FinFET, a multi-gate device, significantly reduces power dissipation compared to planer MOS (Metal Oxide Semiconductor ) transistor, but it doesn’t entirely resolve the issue. To further reduce power dissipation in the ultra DSM regime, low power approaches are required. Domino logic, a widely-used dynamic logic, is commonly utilized in high-speed VLSI architectures. In this research work, a novel INput Dependent Inverter DOmino (INDIDO) logic approach for low-power domino logic circuits using FinFET devices is proposed. A comparative analysis between the proposed INDIDO method and the existing approaches is performed for domino logic circuits for various performance metrics at the 16 nm technology node. In this research, various circuits like domino buffer, domino OR, domino AND, domino XOR and domino half adder are designed using the proposed INDIDO approach.The proposed INDIDO FinFET buffer circuit offers significant improvement in energy efficiency and FOM (Figure of Merit) by 53.18% and 82% respectively as compared to conventional FinFET footed domino buffer circuit. Beside this, proposed circuits like INDIDO OR, INDIDO AND, INDIDO XOR and INDIDO Half adder circuit follow the same trend as INDIDO buffer circuit and show better performance parametres in comparison to the existing low power domino approaches as well. In addition to this, the proposed INDIDO buffer circuits are also analyzed for PVT(process voltage and temperature) variability.This whole analysis makes us to conclude that proposed INDIDO approach reduces power dissipation and delay penalty, have high noise tolerance capacity, more immunity against PVT variations and high energy efficiency in comparison to the already existing techniques.

How does crosstalk influence the jitter of a clock signal?

The stability and accuracy of the clock signal are crucial for the proper operation of various electronic devices and systems, as they directly impact system performance. In high-speed electronic systems, the clock signal is susceptible to interference by crosstalk. Therefore, evaluating the performance of the clock signal under crosstalk disturbance is important. Jitter, commonly used as an indicator to assess the degree of this interference, plays a significant role in this evaluation. In this paper, a method is proposed for assessing crosstalk-induced jitter (CIJ) based on scattering parameters. To verify the effectiveness of the method, CIJ was measured for clock signals with frequencies of 25, 100, and 156.25MHz. In addition, the experimental results are well in agreement with the theoretical model. Thus, the potential application of this method is to assess the performance of circuits or electronic systems.

Ultrafast Self‐Powered Ti–Zn–N Photodetector‐Based Optocoupler for Power Electronics Applications

This study presents an early exploration into the application of a self‐powered photodetector based on titanium zinc nitride (TiZnN) films in power electronics, aiming to overcome inherent limitations of conventional optocouplers such as low switching speed and specific operating voltage requirements. The fabricated device demonstrates excellent performance metrics, including photosensitivity of 136, the responsivity of 3.22 mA W−1 at −8 V bias, and a peak detectivity of 1.76 × 108 Jones at 0 V bias. Remarkably, ultrafast rise (τs) and decay times (τd) of 0.11 and 0.10 ms, respectively, are achieved, alongside broad‐band spectral absorption characteristics. Experimental validation showcases the efficacy of the TiZnN‐based optocoupler in practical applications, notably in power electronics triggerable relay systems and AC–AC converters. Leveraging the self‐powering capability inherent to the TiZnN photodetector, this optocoupler eliminates external power source dependencies, thereby enhancing its versatility and applicability in diverse electronic systems. The rapid response time of the device and broad spectral absorption further underscore its suitability for high‐speed signal transmission across varied operating conditions. This research paves a path for developing stable, cost‐effective, and self‐powered ultrafast optocouplers, eliminating concerns about compromising electrical signal transit. These advancements hold significant implications for enhancing electronic system performance, reliability, and functionality in critical applications.

Identification of chronic obstructive pulmonary disease using graph convolutional network in electronic nose

Chronic obstructive pulmonary disease (COPD) is a progressive lung dysfunction that can be triggered by exposure to chemicals. This disease can be identified with spirometry, but the patient feels uncomfortable, affecting the diagnosis results. Other disease markers are being investigated, including exhaled breath. This method can be applied easily, is non-invasive, has minimal side effects, and provides accurate results. This study applies the electronic nose method to distinguish healthy people and COPD suspects using exhaled breath samples. Twenty semiconductor gas sensors combined with machine learning algorithms were employed as an electronic nose system. Experimental results show that the frequency feature of the sensor responses used by the principal component analysis (PCA) method combined with graph convolutional network (GCN) can provide the highest accuracy value of 97.5% in distinguishing between healthy and COPD subjects. This method can improve the detection performance of electronic nose systems, which can help diagnose COPD.

Analysis of the Interference Effects in CMOS Image Sensors Caused by Strong Electromagnetic Pulses

With the electromagnetic environment becoming increasingly complex, it is crucial to address the risk posed by electromagnetic pulse, which critically impairs the performance and reliability of electronic systems based on complementary metal oxide semiconductor (CMOS) image sensors. In this context, research on the failure types of CMOS image sensors in a high-power electromagnetic environment, caused by strong electromagnetic pulses and the rapid evaluation method of interference immunity, has garnered significant interest. This paper conducts electromagnetic pulse simulation experiments on CMOS image sensors to first study their failure types, such as image abnormalities and functional interruption, and then identify the corresponding failure criteria. Furthermore, this study builds on the small sample test evaluation method to investigate the interference threshold of functional interruptions in CMOS image sensors by calculating the failure probability at different field strengths. The obtained data were combined with the Weibull distribution function for fitting, the results of which found the interference threshold to be at 40.4 kV/m. The findings of this study provide a basis for evaluating the survivability of CMOS image sensors and their associated reinforcement technology in high-power electromagnetic environments.

Design and Implementation of SRAM Using Verilog

Abstract: This comprehensive review delves into the intricate realm of the Static Random-Access Memory (SRAM) design and implementation, elucidating its pivotal role in shaping the performance, efficiency, and reliability of contemporary electronic systems, involving applications in ASIC devices. With a primary focus on the integration of Verilog, a hardware description language (HDL), the paper provides an in-depth background on SRAM, meticulously detailing its architecture, operation, and overall significance in electronic systems. The review meticulously addresses challenges inherent in SRAM design, encompassing considerations such as power consumption, speed, and area efficiency. Significantly, it underscores the crucial role of Verilog by delving into its syntax, modules, and procedural constructs, showcasing its application in modeling key SRAM components. The discussion extends to design trade-offs, including size, speed, and power consumption, illustrating how Verilog plays a pivotal role in facilitating optimal parameter optimization. The review seamlessly integrates technical concepts like RTL (Register Transfer Level), and procedural assignments, ensuring a comprehensive exploration of SRAM design intricacies. Additionally, it introduces terms such as testbench, bitcell and power reduction, further enhancing the reader's understanding of the complex interplay between Verilog and SRAM design.

Ni-modified BaTiO3 film prepared by sol-gel with high energy storage performance

The development of lead-free dielectric capacitors with high recoverable energy storage density and high energy storage efficiency is important for improving the overall performance of electronic and power systems. BaTiO3 (BTO) is one of the most common ferroelectric materials and has attracted much attention for energy storage applications in the past decades due to its excellent dielectric and ferroelectric properties. However, high remnant polarization and low electrical breakdown strength of BTO limit its development in energy storage applications. Many efforts (e.g., elements doping, interface/heterostructure, etc.) have been made to improve the energy storage density of BTO thin films. In this paper, Ba1-xNixTiO3 thin films (x = 0, 0.02, 0.04, 0.06, 0.08; abbreviated as BNxT) were synthesized via sol-gel and spin-coated method. The effect of Ni doping on the structural, dielectric, ferroelectric and energy storage properties of BTO thin films has been studied. The results confirmed that with the increase of Ni doping, a second phase arises and the dielectric constant decreases. While appropriate Ni doping led to the improvement of the breakdown strength, further increase of Ni deteriorated the energy storage because of the high oxygen vacancy. Finally, optimized energy storage performance was obtained for BN0.04T thin film: dielectric constant of 401, dielectric loss of 0.002, recoverable energy density of 20.2 J/cm3 and energy storage efficiency of 83.6% at 965 kV/cm. Meanwhile, the remnant and maximum polarization of the films were 0.06 μC/cm2 and 50 μC/cm2, respectively. BN0.04T thin film has an excellent application prospect and is expected to appear as a component in the future composite energy storage film system.

Evaluating Power Delivery and Thermal Management in High-Density PCB Designs

High-density PCB (Printed Circuit Board) designs have become increasingly prevalent in modern electronic devices due to their compact size and the need for high-performance functionality. However, this miniaturization and increased component density introduce significant challenges in power delivery and thermal management. Effective management of these aspects is crucial for maintaining the reliability, performance, and longevity of electronic systems. Power delivery networks (PDNs) are essential for distributing electrical power to various components on a PCB. In high-density designs, the complexity of PDNs increases as the demand for power grows and the available space for routing power distribution decreases. The primary challenge in power delivery is to ensure that all components receive stable and sufficient power while minimizing voltage drops and power noise. This involves careful design of power planes, vias, and decoupling capacitors. Techniques such as multi-layer PCB construction, power plane segmentation, and the use of advanced power delivery models can help address these challenges.

(Invited) Integration of Functional Nanostructures and Nanoparticles into Micro- and Nanoelectronic Components and Systems

In recent decades, there has been a significant evolution of microelectronic and semiconductor technologies towards the nanoscale. Both bottom-up and top-down integration concepts of functional nanostructures and nanoparticles into micro- and nanofabricated electronic components have become critical issues that decisively affect the performance of smart electronic systems in various application areas such as environmental sensing and energy harvesting.Functional nanostructures and nanoparticles of different shapes, sizes, morphologies, and materials are now used in various technical and industrial applications, medicine, pharmacy, biology, electronics, power engineering, ecology, and many other fields. However, the complex engineering challenge here is the integration of functional nanostructures, such as molecular components (e.g., functional self-assembled molecular monolayers or entities of desoxyribonucleic acid, DNA), organic or inorganic nanoparticles (metal, semiconductor, colloidal materials), or similar building blocks into nanolithographically fabricated environments.Manufacturing paradigms for this integration go beyond current CMOS- and MEMS-fabrication schemes. Scale-bridging and hybrid manufacturing schemes that combine established top-down manufacturing techniques for microelectronic devices, including aspects of nanotechnology, with bottom-up nanoassembly of molecules on unstructured and pre-structured substrates are required. Microsystems technology based on the combination of conventional semiconductor processing with biotechnological approaches has thus become an emerging field with manifold applications, especially in the field of sensor technology.This contribution describes two illustrative and innovative research questions in nanopatterning and system integration at the micro-nano-interface to motivate applications with new and unprecedented functionalities. The first research question focuses on network-based biocomputing (NBC) using biological agents driven by biomolecular motor proteins in a lithographically fabricated nanofluidic channel system. This approach opens up opportunities for energy-efficient solutions to complex mathematical problems as they make their way through the NBC network. Methods are required to create switchable and rewritable nano-networks to address different mathematical problems using a single NBC-chip. Therefore, stimuli-responsive materials must be selectively and locally deposited into the nano-network to control the transport of the filaments through the network.The second research question focuses on nanophotonic devices based on DNA origami. The high-precision arrangement of nanoscopic substructures using specific binding sites (capture ends) of the DNA origami enables the precise arrangement of DNA origami functionalized with individualized metal nanoparticles. This arrangement could be used to exploit individual spectral response mediated by plasmonic effects.From a technological perspective, top-down lithographic nanostructuring technologies and bottom-up nanostructuring technologies are the basis for new device concepts. The adaptability of nanostructures to the world of biological molecules and other nanoscopic building blocks such as quantum dots and nanoparticles enables novel, even personalized, devices and engineering solutions.

Framework for the Assessment of Virtual Archival Systems and Provision of Virtual Archival Services for Environmental Sustainability in South Africa

Archival records/resources in electronic and those that only existed in physical formats have been made available to a larger audience and received much more usage as a result of digitization and remote accessibility. Virtual archives can help to reduce the environmental impact of traditional archival practices by storing and sharing information digitally rather than physically. The aim of this paper is to assess and develop a framework for the delivery of a virtual archive system tailored to the needs of both users and archival institutions for the promotion of environmental sustainability especially in developing countries. The qualitative research explained user expectations and perspectives on the provision of a newly established electronic archival system for the provision of virtual archive services at an archival institution in the City of Cape Town. This paper anchored on the Expectation Confirmation Theory proposed the Virtual archival systems expectations and satisfaction (VASES) framework to identify electronic archival system users’ expectations, measure perceived performance of electronic archival systems, and assess confirmation and satisfaction.

Response surface methodology-based multi-nozzle optimization for electrospray cooling

The performance of electronic systems has decreased due to an increase in heat flux density. New methods such as electrospray cooling are promising to ensure that these systems operate under desired conditions. In electrospray cooling, the working flow rate is limited because the small nozzle diameter is preferred to improve the electric field strength and heat transfer performance. However, it is known that increasing the fluid flow rate is a good method to improve heat transfer. For this reason, multi-nozzles should be used to remove more heat from the surface with electrospray cooling. For the first time in the literature, multi-nozzles were optimized for electrospray cooling with the optimization method in the study conducted for this purpose. Nozzle optimization studies were carried out for ethanol–water mixture used as a fluid for the first time in the literature, nozzle diameter, distance between nozzles, and nozzles number. In the experimental study, it was determined that the fluid composition ratio was effective on electrospray cooling and the effects of nozzle geometry parameters (nozzle diameter, distance between nozzles, nozzle number) were limited. As a result of the optimization process based on the response surface methodology, the highest heat transfer coefficient was obtained for the 5 mm nozzle-center distance where 3 pieces of 26G nozzles.

Research Progress in Breakdown Enhancement for GaN-Based High-Electron-Mobility Transistors

The breakdown characteristics are very important for GaN high-electron-mobility transistors (HEMTs), which affect the application voltage, power density, efficiency, etc. In order to further enhance the breakdown voltage of the device, it is necessary to carry out research on the breakdown mechanisms of the device. This article summarizes several breakdown mechanisms of GaN devices, including electric field concentration, buffer leakage current, gate leakage current, and vertical breakdown. In order to suppress the breakdown mechanisms, techniques such as the use of a field plate, reduced surface field (RESURF), back barrier, gate dielectric, substrate removal, and addition of AlGaN channels can be developed. With the continuous development of various technologies, the breakdown characteristics of GaN devices can be fully explored, laying the foundation for improving the performance of power electronic systems.

Dynamic mass estimation framework for autonomous vehicle system via bidirectional gated recurrent unit

AbstractThe precise estimation of vehicle mass is crucial for the optimal performance of electronic control systems in autonomous vehicles. However, the nonlinear nature of vehicle dynamics makes it a challenging task to estimate the mass accurately. In response to this concern, this paper proposes a dynamic vehicle mass estimation framework underpinned by a bidirectional gated recurrent unit, developed using deep neural networks. The bidirectional mechanism and gated recurrent unit network are adopted to elevate the precision of the neural network estimator. The dataset used for training and validation is collected from heavy‐duty vehicle simulations and real vehicle road tests. The average root mean square error, mean absolute percentage error, and mean absolute error evaluated over simulation tests are 92.66 kg, 0.93%, and 79.67 kg, respectively, and those in real vehicle data tests are 16.61 kg, 0.13%, and 16.61 kg, respectively. The outcomes manifest that the method put forth surpasses the contrasted approaches in relation to accuracy in the conducted experiments.

OSM: Leveraging model checking for observing dynamic behaviors in aspect-oriented applications

In the intricate domain of software systems verification, dynamically model checking multifaceted system characteristics remains paramount, yet challenging. This research proposes the advanced observe-based statistical model-checking (OSM) framework, devised to craft executable formal models directly from foundational system code. Leveraging model checking predicates, the framework melds seamlessly with aspect-oriented programming paradigms, yielding a potent method for the analytical verification of varied behavioral attributes. Exploiting the transformative capacity of OSM framework, primary system code undergoes a systematic metamorphosis into multifaceted analysis constructs. This not only simplifies the model verification process but also orchestrates feature interactions using an innovative observing join point abstraction mechanism. Within this framework, components encompassing parsing, formal verification, computational analytics, and rigorous validation are intrinsically interwoven. Marrying the principles of model checking with aspect-oriented (AO) modularization, OSM framework stands as a paragon, proficiently scrutinizing and affirming system specifications. This ensures the unyielding performance of electronic health record systems amidst shifting preconditions. OSM framework offers runtime verification of both object-oriented and AO deployments, positioning itself as an indispensable open-source resource, poised to automate the enhancement of system performance and scalability.

Optimization of Multi-Phase Motor Drive System Design through Thermal Analysis and Experimental Validation of Heat Dissipation

In power semiconductor systems such as inverters, managing losses is critical for optimizing performance. Inverters, which convert DC to AC for applications such as renewable energy systems, motor drives, and power supplies, are significantly affected by the thermal performance of components such as metal-oxide-semiconductor field-effect transistors (MOSFETs). Efficient thermal management is critical for the longevity and performance of power electronic systems, especially in high-power applications. Designing effective thermal management strategies for inverters reduces losses, increases efficiency, and improves performance while considering space constraints and complex component interactions. In this study, power electronics simulations and computational fluid dynamics (CFD) thermal analysis were integrated to design the inverter. Using an integrated simulation, a thermal analysis was performed based on the inverter losses per module. A power electronics simulation was used to verify the validity of the loss values in the inverter design, and the CFD thermal analysis facilitated the visual analysis of the variables to be considered. The validity of the design was evaluated through experimental verification of the inverter system. A temperature saturation of 63.9 ℃ at 60Arms was recorded in the simulation, and a temperature saturation of 45 ℃ or less at 59Arms to 60Arms was obtained for each phase in the actual test. Considering the ambient temperature difference, it showed a difference of approximately 9.9 ℃. This conclusion allows us to reduce the high probability of risk derived by considering a small margin of safety for each variable in the design. This solution can be used to compactly design real inverters and solve complex thermal problems in power semiconductor-based systems. Finally, this study analyzes the similarities and differences between CFD simulations, power electronics simulations, and real-world experimental validation, highlighting the importance of thermal management in improving the efficiency of power electronic systems, particularly inverters.

A Review on the Design of Equalizers for Frequency Selective Channels

Wireless channels rarely fulfill the conditions required for distortion-less transmission. sensible wireless channels suffer from the impact of a non-flat magnitude response and a non-linear section response that leads for distortions within the received signals. what is more effects liketiny scale weakening, massive scale weakening and physicist shifts cause dis- similarity between the transmitted and received signals. Wireless channels not showing the perfect impulse response ends up in the reception of multiple copies of the transmitted signal at the receiver thereby leading to entomb image Interference (ISI). A additive and cascading impact of the on top of mentioned reasons ends up inthe degraded performance of electronic communication systems. to avoid these prejudicial effects, many equalizer styles are projected.This paper focuses on the design aspects of equalizers with an inclination towards decision feedback equalizers, due to their efficiency in nullifying the detrimental effects of practical wireless channels. Keywords: Frequency Selective Channel, Equalizer, Decision Feedback Equalizer, Bit Error Rate (BER), Probability of Error (Pe), Throughput.

Approaches to Heterogeneous Integration for Millimeter-Wave Applications

Introduction. Enhanced performance of electronic systems can be achieved by heterogeneous integration of different semiconductor technologies. The benefits of heterogeneous integration become obvious when close connections between the devices are provided. The development of integration approaches, enabling functionality and improved performance, appears a relevant task for modern microwave microelectronics.Aim. Review of state-of-the-art and promising heterogeneous integration concepts and techniques in microwave microelectronics.Materials and methods. Eight integration approaches that ensure the connection of devices based on different semiconductor technologies for microwave frequencies are considered: monolithic heterogeneous integration, wafer bonding, micro-transfer printing, embedded chip assembly, print additive manufacturing, wire bonding, flip-chip, and hotvia. The integration approaches are analyzed in terms of their implementation specifics, advantages and disadvantages.Results. Monolithic heterogeneous integration and wafer bonding, as well as micro-transfer printing, despite the minimum interconnections, have a number of fundamental limitations. These limitations are related to the compatibility of various semiconductor technologies and the necessity of high technological capabilities. The technology of embedded chip assembly enables the variability of implementation techniques, which makes it possible to provide unique characteristics, e.g., due to the integration of magnetic materials. However, this approach is associated with a high complexity of integration technological processes. Flip-chip integration ensures minimal interconnect losses due to bump miniaturization. Hot-via, as a modification of flip-chip, provides for a better compatibility with microstrip type circuitry. Their further improvement and mass application largely depends on the development of technologies for the formation of low-pitch interconnections.Conclusion. The development of close integration approaches in microwave microelectronics is proceeding both in the monolithic direction, i.e., monolithic heterogeneous integration wafer bonding, as well as in the quasi-monolithic direction, i.e., micro-transfer printing, embedded chip assembly, print additive manufacturing, flip-chip, and hot-via. The conducted comparative analysis of the presented methods has practical application.

Software implementation of methods for optimal design of power electronic devices

The manuscript presents a software implementation of methods for the optimal design of power electronic devices based on MATLAB. Model-based optimization is one of the effective approaches to guarantee the performance of power electronic devices and systems. Through its application, the efficiency of the conversion of electrical energy is increased when setting a certain target function. Several examples are presented to demonstrate the effectiveness of the proposed optimization.