Electronic Packaging Materials Research Articles

Syringaldehyde‐DOPO derivative for enhancing flame retardancy and mechanical properties of epoxy resin

AbstractWith the wide application of epoxy resins in adhesives, electronic packaging materials, and aerospace fields, it is necessary to prepare high‐performance flame‐retardant epoxy resins to reduce the fire risk caused by their flammability. In this study, the rigid structure intermediate Schiff base (DMDA‐SH) was synthesized by condensation reaction of syringaldehyde (SH) with O‐Tolidine (DMDA). Then, DMDA‐SH‐DOPO, a novel P/N‐structured biobased flame‐retardant curing agent, was synthesized by addition reaction with 9,10‐dihydro‐9‐oxaza‐10‐phosphame‐10‐oxide (DOPO) and was applied to the preparation of intrinsic flame‐retardant epoxy resin. As expected, DMDA‐SH‐DOPO has good flame‐retardant properties due to the synergistic action of N/P elements. Epoxy resin with only 2.5% DMDA‐SH‐DOPO (P = 0.16%) can pass the UL‐94 V‐0 test. Compared with DGEBA/DDM, DMDA‐SH‐DOPO‐7.5's (P = 0.49%) peak heat release rate was reduced by 48.4% and the limiting oxygen index (LOI) reached 27%, making it a flame‐retardant material. From the point of view of carbonaceous residue performance, the expansion height of carbon residue after DMDA‐SH‐DOPO‐7.5 combustion is significantly increased, and the amount of carbon residue at 800°C is increased by 36.4%. In addition, appropriate DMDA‐SH‐DOPO can effectively improve the bending property of epoxy resin. This study provides a new idea for preparing renewable high‐performance intrinsic flame‐retardant epoxy resin.

Crystallization and microwave dielectric properties of CaO-B2O3-SiO2 glass-ceramic/Al2O3 for LTCC applications

High-frequency electronic devices with low dielectric loss and electronic components with high integration densities require high-performance electronic packaging materials. In this study, materials primarily composed of CaO-B2O3-SiO2 (CBS) with an elevated boron content were fabricated through solid-phase sintering using Al2O3 as the ceramic phase. The phase compositions, densification process, microstructures, thermal conductivity, thermal expansion, and dielectric properties of the LTCC were investigated. Remarkably, the CBS-1 LTCC composite sintered at 850 °C for 4h, exhibited a dense and nonporous microstructure. It demonstrated exceptional thermoelectric properties, including a thermal shrinkage of 5.61%, coefficients of thermal expansion of 4.86 ppm/°C, thermal conductivity of 2.36W/m·K, dielectric constant (εr) of 4.88, and tan δ of 1.05× 10-3 at 15GHz. These characteristics are conducive to minimizing the signal propagation time delay and filtering noisy signals. Consequently, the CBS-1 LTCC composite emerged as a promising substrate for LTCC applications.

Modulation of the electromagnetic shielding effectiveness through micro/macrostructure design for electronic packaging

Lightweight electronic packaging that provides mechanical protection, cooling ability, and customizable electromagnetic interference (EMI) shielding effectiveness (SE) is needed for next-generation electronics. Although electronic packaging solutions with excellent EMI SE exist, there is limited research on how hierarchical design can modulate the EMI SE of an electronic packaging material on demand. In this study, the deliberate precise micro/macrostructure design of graphite-based materials using magnetically assisted 3D printing allows tuning of the EMI SE in the X band (8–12 GHz), leading to a maximum total shielding performance of 90 dB. Aligning high-density graphite microplatelets during 3D printing also remarkably amplified the total SE by 200%. Subsequently, rationally designing the oriented microstructure within a geometrical shape increases the reflection and improves the EMI SE from 40 to 60 dB in a specific direction. Our proof-of-concept samples demonstrate the potential of precise micro/macrostructure design for customizing and enhancing electronic packaging’s EMI SE while achieving good heat dissipation and mechanical protection using a versatile 3D printing method. These advances pave the way for more reliable and safer electronic systems.

Microstructure and performance of carbon fiber reinforced aluminum matrix composites with molybdenum carbide coating on carbon fibers

In this work, a molybdenum carbide coating on the surface of short carbon fibers prepared using molten salt method was proposed to ameliorate the interfacial bonding and improve the performance of carbon fiber/Al composites. The carbon fiber/Al composites were produced using vacuum hot pressing. The characteristics of molybdenum carbide coating were analyzed. Besides, the microstructures, bending strength and thermal properties of the carbon fiber/Al composites were explored. Furthermore, the interfacial thermal resistance of the composites was investigated in relation to theoretical evaluations derived from the combined Maxwell-Garnett effective medium approach and acoustic mismatch model schemes. The results indicated that a homogeneous Mo2C coating with a thickness of 0.5 μm was obtained by proper molar ratio of carbon fibers, MoO3 and chloride salts mixture and heated at 1000 °C for 60 min. The Mo2C coating greatly enhanced the bond between the aluminum matrix and carbon fiber, leading to improvements in the densification behavior and bending strength of the coated composites. The enhanced thermal properties including improved thermal conductivity and reduced coefficient of thermal expansion (CTE) were also achieved by the Mo2C coating. The in-plane thermal conductivity of 60 vol.% Mo2C-coated carbon fiber/Al composite was 221 W·m−1·K−1 enhanced by 92% compared to that of uncoated composite and the CTE was 6.0 × 10–6 K−1 which was suitable for electronic packaging materials.

Crystallization and microwave dielectric properties of CaO-B2O3-SiO2 glass-ceramic/Al2O3 for LTCC applications

High-frequency electronic devices with low dielectric loss and electronic components with high integration densities require high-performance electronic packaging materials. In this study, materials primarily composed of CaO-B2O3-SiO2 (CBS) with an elevated boron content were fabricated through solid-phase sintering using Al2O3 as the ceramic phase. The phase compositions, densification process, microstructures, thermal conductivity, thermal expansion, and dielectric properties of the LTCC were investigated. Remarkably, the CBS-1 LTCC composite sintered at 850 °C for 4h, exhibited a dense and nonporous microstructure. It demonstrated exceptional thermoelectric properties, including a thermal shrinkage of 5.61%, coefficients of thermal expansion of 4.86 ppm/°C, thermal conductivity of 2.36W/m·K, dielectric constant (εr) of 4.88, and tan δ of 1.05× 10-3 at 15GHz. These characteristics are conducive to minimizing the signal propagation time delay and filtering noisy signals. Consequently, the CBS-1 LTCC composite emerged as a promising substrate for LTCC applications.

TiO2-BN/CNTs coating with radiative cooling and reduced friction

To date, the demand for electronic packaging materials with combined highly efficient heat dissipation and low friction attracts intensive attention. There have been hardly any reports of coatings that provide simultaneous radiative cooling, thermal conduction, and friction reduction properties. In the present work, a novel biomimetic nanocomposite coating is gown on the titanium alloy substrate. The coating consists of a TiO2 ceramic layer adorned with hemispherical protrusions and is enriched with hexagonal boron nitride (h-BN) flakes and CNTs on the surface. The optimal microstructures are determined through Finite Difference Time Domain (FDTD) simulation calculations and then prepared using plasma electrolytic oxidation (PEO). The results show that the hierarchical micro/nanostructures enable the coating to achieve an infrared emissivity of ∼ 0.9 within the 3–14 wavelength range, whilst h-BN and CNTs contribute to the thermal conduction of the TiO2-BN/CNTs ceramic coating. The advantage of the biomimetic nanocomposite coating over the bare titanium alloy is that the coating facilitates a reduction in the equilibrium temperature of a 5 W LED by around 21.5 °C. In addition, the coating exhibits outstanding friction reduction performance with a low friction coefficient (COF) of 0.15 over a sliding distance of 94.2 m, benefitted from the lubrication effect of h-BN and CNT. This work introduces a straightforward and environmentally friendly approach to fabricating bifunctional thermal regulation materials.

High heat resistance and neutron shielding performance epoxy with carborane hybridized crosslinked network

Epoxy resin has gained significant attention in aviation equipment, coatings and electronic packaging materials due to its exceptional processability, adhesion and mechanical properties. However, its thermal resistance property and glass transition temperature (Tg) were relatively lower than cyanate resin (CE), polyimides (PI) and phenolic resins (PF), which largely restricts its application range. In this work, we had developed a new structural heat-and-shielding integrated epoxy resin via the design of carboranes-epoxy network. Benefiting from the structure of carborane, the thermal residual weight of the obtained epoxy reached 64.57 %, with a carbon atom protection rate of 45.47 % in air atmosphere at 800 °C, showing better thermal resistance property than most CE, PI and PF. And the Tg of the new epoxy was not observed within the tested temperature range (50–250 °C). Additionally, the introduction of carborane structures enhances the neutron shielding performance of the material (38.46 % enhanced). The reinforcement mechanisms of these above properties are systematically investigated. It's excepted that our work could provide some ideas to prepare structural -functional integrated epoxy and promote the development of carborane related materials.

Influence of amine surface treatments of carbon nanotube and boron nitride hybrid fillers on the thermal and mechanical properties of flexible amine‐based acrylate composites via 3D vat photopolymerization

AbstractOwing to the rapid advancement in electronic devices, thermal interface materials have been introduced to solve the thermal dissipation and electrical insulation problems in electronic parts and packaging materials. In this study, flexible thermally conductive acrylate‐based composites were fabricated via 3D vat photopolymerization. The effects of amine functional groups on the thermal and mechanical properties of acrylate polymers were explored. Surface‐treatment agents, namely, (3‐aminopropyl)triethoxysilane (APTES) and octadecylamine (ODA), were selected to enhance the poor dispersibility of fillers in the resin matrix caused by aggregation. The APTES‐treated carbon nanotube (CNT)–boron nitride (BN) hybrid composite exhibited the highest thermal conductivity of 0.990 W m−1 K−1, which was remarkably 482.35% higher than that of the matrix owing to the addition of 30 wt% BN, 0.5 wt% CNTs, and APTES treatment. The ODA‐treated CNT composite, which contained only 0.5 wt% CNTs, exhibited a thermal conductivity of 0.540 W m−1 K−1, which was 217.65% higher than that of the matrix. The electrical insulation properties of the composites were characterized, and the composites exhibited low electrical conductivity as electrical insulation materials. The advantages of the 3D‐printed flexible thermally conductive acrylate polymers usher in a new era of using polymer composites to address heat dissipation problems in complex structures.

Rationally controlling interfaces and oxygen vacancies of CeO2@C core–shell nanorods/nanofibers for superior microwave absorption and thermal conduction

High-performance thermally conductive-microwave absorbing integrated materials are highly required to mitigate the severe electromagnetic pollution and overheating generated in electronic devices. However, the incompatibility between thermal conduction and microwave absorption impedes their collaborative development. Herein, an adjustment strategy for interface- and oxygen-vacancy-linkage was adopted to rationally construct CeO2@C core–shell nanorods/nanofibers (CSNRs/NFs) and cooperatively boost their electrical, thermal, and microwave absorption properties. A hydrothermal-annealing technique was employed to synthesize CeO2@C CSNRs/NFs. Their core–shell structure, oxygen vacancies/lattice defects, and length-to-diameter ratio were accurately adjusted by changing the annealed temperature (Ta) and toluene volume (V). The CeO2@C CSNRs/NFs produced under Ta = 600 °C and V = 1.5 mL exhibit high thermal conductivity (TC = 2.94 W/(m·K)) at a small load of 40 wt%. The large TC is mainly due to the weak phonon defect/interface scattering and electron/phonon co-transfer in a 3D continuous path consisting of a 1D structure. Furthermore, the CeO2@C CSNRs/NFs display strong microwave absorption (EABmax/d = 3.27 GHz/mm; RLmin=− 50.98 dB) due to their various polarizations, tunable conduction loss, and multiple internal reflections. These results demonstrate that the CeO2@C CSNR/NFs are an ideal multifunctional material that protects against concurrent EM interference and excess heat in electronic packaging materials.

Microstructure and properties of Cu/Si composites for electronic packaging: Effect of tungsten layer on silicon particles

Cu/Si composite are ideal electronic packaging materials, but the intense formation of Cu-Si intermetallics during preparation leads to a significant decrease in their plasticity and thermal conductivity. In this paper, a W layer was formed on Si particles using the sol-gel method, and Cu/Si composites were prepared by hot pressing. The results show that the maximum thickness of the W layer is 1.64 μm, and the minimum thickness is only 809 nm. The W layer acts as a diffusion barrier, effectively inhibiting the Cu-Si interfacial reaction and intermetallics formation, thus preventing the deterioration of matrix and reinforcement properties. Compared with the Cu/Si composite, the elongation of the Cu/Si@W composite improves from 0.2 % to 1.7 %, and the thermal conductivity increases by 7 times to 233.9 W/(m·K). Additionally, among the four samples, the Cu/Si@W composite has the lowest coefficient of thermal expansion (CTE). The W layer enhances the mechanical properties and thermal conductivity while reducing the CTE of Cu/Si composite for improved electronic packaging application.

Construction of 3D BN network with high-density thermal conductive paths

Efficient heat dissipation is essential to further improve the integration of high-power electronic packaging devices. Three-dimensional BN networks with high-density thermal conductive paths were designed as the heat transfer skeleton of thermal interface materials. 3D networks with high-density thermal conductive paths inlaid between oriented BN paths were constructed using precursor self-assembly and freeze-drying to improve the thermal conductivity of polymeric materials. The results show that high-density thermally conductive paths have stronger polymer-enhanced thermal conductivity than directional thermal paths and compared with pure TPU, the thermal conductivity of TPU/BN-2 under low BN filling content (10%wt) is increased by 250 % and 286.5 % in the through surface and flat surface respectively. This work provides new ideas for the preparation of polymer composites for thermal interface materials in electronic packaging and integrated circuits with excellent thermal management properties.

Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging

The Cu-Sn full intermetallic compound is a promising high-temperature electronic packaging material, while its preparation is usually time-consuming. In this work, a novel dual-beam laser co-deposition method was proposed to prepare Cu-Sn nanoparticle film for power electronic packaging with high bonding efficiency. Various Cu-Sn contents were prepared to reveal the bonding mechanism of the full intermetallic compound structure. The results show that joints with a Cu content ranging from 20 wt% to 80 wt% could form full intermetallic compounds within 2 min with the shear strength reaching 120 MPa. Specifically, Cu6Sn5, 'island-like' Cu3Sn, and sintered Cu generated successively in the bondline center with the increasing Cu content. All failures occurred within the bondline indicating a higher interface bonding quality, while the 'island-like' Cu3Sn enhanced the shear strength. This die attach process is compatible with current commercial SiC die attach process with lower material cost as well as high efficiency, enabling the Cu-Sn nanoparticle film to be a promising material for high-reliability power electronic packaging.

Construction of three-dimensional network using boron nitride microspheres and the thermal conductivity/stability of epoxy resin composites

Efficient heat dissipation has become the focus of electronic packaging materials, constructing three-dimensional thermally conductive filler networks to prepare composites can realize efficient heat transfer. However, there are few studies comparing the effects of different ways of constructing three-dimensional networks on the thermal conductivity enhancement of polymers. In this study, BNMS self-assembled from BNNSs was used as a thermally conductive filler, and the three-dimensional skeleton was constructed by both the powder mixing pressing method and the ice template method, and scanned to analyze the morphological and structural characteristics. At the same time, the epoxy composites were prepared, and the advantages and disadvantages of the thermal conductivity of the composites prepared in different ways were analyzed by combining the SEM structures. In the powder mixing pressing method, the in-plane and through-plane thermal conductivity of the epoxy composites with the BNMS additive amount of 53.92 wt% reached 10.961 W·m−1·K−1 and 9.955 W·m−1·K−1, respectively, which was increased by 58 and 52 times. The thermal stability has been improved significantly that the T60 was in creased by 60.89°C compared to pure epoxy. Using the ice template method with 7.67 wt% of BNMS addition, the through-plane thermal conductivity of the epoxy composites reaches 0.977 W·m−1·K−1, which is an improvement of 428.1 % compared with pure EP. In addition, both composites maintain low dielectric constants and dielectric losses. It is instructive for the preparation method of subsequent construction of three-dimensional thermally conductive filler networks.

Dielectric, electrical and thermal properties of Sodium Molybdate-hexagonal Boron Nitride composites enabled by cold sintering

Advances in 5G and 6G communication technologies and their applications are in part limited by the capabilities of current electronic packaging materials, as expanded bandwidth is a pressing need for novel dielectric substrates capable of co-firing into packages and devices, characterized by low dielectric loss and enhanced thermal conductivity. This investigation provides further characterization in the dielectric, electrical and thermal conductivity properties over previously reported cold sintered composite of Sodium Molybdate Na2Mo2O7 (NMO) with hexagonal Boron Nitride (hBN), such as relative permittivity (εr) and dielectric loss (tan δ) values at high frequencies of 75–110 GHz, electrical resistivity (ρ) fitting to percolation theory, Weibull statistical analysis of electrical breakdown strength (Eb) and its anisotropic thermal conductivity (κ) influenced by the filler's crystal structure. The cold sintered composites were systematically characterized with respect to filler volume fraction, temperature, and frequency. The findings in this analysis position engineered composites as a promising alternative for microwave substrate materials, with using a densification method that limits interactions and maximizes densification, hence the demonstration with cold sintering.

Phosphononitrile based bismaleimide electronic packaging substrate with both fire safety and dielectric properties: Assisting 5G communication

Due to the high polarizability of traditional flame retardants, it is difficult to meet the excellent dielectric properties and flame retardancy required for electronic packaging materials. Therefore, we have designed a novel linear polyphosphazene that can balance the dielectric properties and flame retardancy of bismaleimide (BMI) composites. Here, fluorinated aromatic ring structure with the large freedom volume is connected to the main chain of polydichlorophosphazene (PDCP) as a side group, resulting in multifunctional fluorinated linear polyphosphazene (PBTFP). Attributed to the excellent P/N/F combination flame retardant strategy, extremely low polarizability, and large molecular free volume, PBTFP simultaneously improves the dielectric properties and flame retardancy of the BMI composites, including UL-94 rating of V0, and a dielectric constant (Dk) as low as 2.69. In addition, as an elastomer, PBTFP exhibits positive effects on improving the hydrophobicity and toughness of BMI. Therefore, through a simple affinity substitution reaction, we prepared a multifunctional fluorinated linear polyphosphazene modified BMI based electronic packaging substrate material that can be applied to 5G high-frequency communication.

Filter-paper-derived CF/M/C (M = Co, Ni, or Fe/Fe3O4) 2D interlinked frameworks toward ultrawide absorption bands, high thermal conductivity, and excellent electrical insulation

Reasonable design of protective multifunctional materials is highly required for the safety protection of devices/personnel from electromagnetic radiation and heat damage in the 5G/6G era. Herein, a simple soaking-annealing route was adopted to carbonize filter paper into 2D interlinked carbon fiber frameworks inlaid with magnetic nanoparticles, and the products were referred to as CF/M/C 2DIFs (M = Co, Ni, or Fe/Fe3O4). The concentration and type of metal ions as well as the annealing temperature of the CF/M/C 2DIFs were controlled to precisely modulate their composition, porosity, and defects. Results show that the CF/Co/C 2DIFs produced under Ta = 600 °C and [Co2+] = 0.45 mol/L exhibit high thermal conductivity (2.931 ∼ 3.167 W/m·K) at small loads (10 ∼ 30 wt%) owing to not merely the presence of 2D interlinked path for electron/phonon heat co-transfer but the reasonable control of interface/defects for weakening phonon/electron defect/interface scattering. Also, the CF/Co/C 2DIFs can attenuate microwaves over a broad frequency range via dielectric/magnetic dual loss and 2DIFs, which boosts their loss ability and matching performance. The excellent performance in both heat dissipation and EM wave absorption proves that the CF/M/C 2DIFs can be a promising candidate for next-generation electronic packaging materials in heat management, military, and aerospace fields.

The preparation and feasibility analysis of magnetic orientation method in the study of thermal insulation composite materials in the field of electronic packaging

AbstractAs an emerging field of current technological development, the heat dissipation performance of electronic packaging materials has become the key to determining product reliability. Therefore, the applied thermal interface materials (TIMs) need to simultaneously meet the performance indicators of thermal conductivity, mechanics, and insulation. Although BN had excellent in‐plane thermal conductivity and insulation performance, it is currently difficult to achieve vertical orientation of powder which leads the layered powder cannot complete a continuous and effective heat transfer path along the Z‐axis direction inside the composite material. In order to solve the above two problems, out‐of‐plane thermal conductive composite was prepared by introducing magnetic oriented method. In order to comprehensively evaluate the thermal conductivity, mechanical and electrical properties, BN@Fe3O4/EP magnetic oriented composites were compared with BN@PDA‐Al2O3/EP composite prepared by mechanical blending method. The vertical thermal conductivity of the magnetic oriented composite material was 2.24 W/(m·K) at 30 vol%, which was 3.39 times that of the blended composite material and 12.4 times that of pure EP. This proves that the magnetic oriented composite materials prepared by the research institute can meet the vertical heat transfer needs in the field of electronic packaging and have high research value in this area.Highlights BN@Fe3O4 core–shell particles were prepared with both thermal conductivity and magnetic controllability. The thermosetting composites were prepared by heated through preliminary gel point and then cured at high temperature. The orientation of powder inside the matrix was constructed, resulted in excellent out‐of‐plane heat transfer performance. Comparisons were made between various properties of magnetic oriented materials and conventional blend materials. The magnetic orientation method is feasible in the field of electronic packaging.

Preparation and properties of novolac epoxy resins containing polycyclic aromatic hydrocarbons

AbstractTo meet the demands of high‐density and miniaturized integrated circuits, electronic packaging materials need to have excellent properties. One approach to enhance the performance is to design novel structures. In this study, two novolac oligomers containing naphthalene Naphthalene novolac oligomer (NPF) and biphenyl Biphenyl novolac oligomer (LPF) were synthesized and then reacted with epichlorohydrin to synthesize novel novolac epoxy resins containing polycyclic aromatic hydrocarbons (NPF‐EP and LPF‐EP). Their chemical structures were characterized by Fourier transform infrared and 1H nuclear magnetic resonance spectra. Tetrahydromethyl‐1,3‐isobenzofurandione (MeTHPA) was used as curing agent to prepare cured NPF‐EP/MeTHPA and LPF‐EP/MeTHPA thermosets. Both NPF‐EP/MeTHPA and LPF‐EP/MeTHPA exhibited better thermal and mechanical properties compared with novolac epoxy resin (PF‐EP/MeTHPA). In particular, NPF‐EP/MeTHPA presented the highest glass transition temperature of 193°C and LPF‐EP/MeTHPA had excellent mechanical properties, with tensile and flexural strengths of 94 and 151 MPa, respectively. Additionally, the cured NPF‐EP/MeTHPA and LPF‐EP/MeTHPA also exhibit a lower dielectric constant and dielectric loss, and low coefficient of thermal expansion compared with cured PF‐EP/MeTHPA. This investigation provides valuable insights for the manufacturing of high‐performance novolac epoxy resins for application in electronic packaging materials.

Synergistic enhancement of toughness and flame retardation for cyanate ester composites through hyperbranched polyborosiloxane

AbstractExcellent flame resistance is supposed to be taken into consideration for electronic packaging materials due to the spontaneous combustion of short circuits, except for good mechanical and dielectric properties. Herein, a hyperbranched polyborosiloxane (HPSiB) flame retardant was synthesized via a simple one‐pot transesterification as a multifunctional additive for cyanate ester (CE) resin. The HPSiB with many active terminals features good compatibility with the resin matrix, while catalyzing the curing reaction that conducts at a lower temperature. With as little as 2 wt% HPSiB incorporated, the HPSiB/bisphenol A cyanate ester (BADCy) resin achieves a UL‐94 V0 rating and 32.4% LOI value, and its peak heat release and total smoke production are simultaneously reduced. Its flexural strength and impact strength were significantly enhanced by 30.0% and 85.4%. Besides, the minimum values of dielectric constant and loss can reach 2.77 and 0.0024 at 10 GHz, which are, respectively, reduced by 7.9% and 88.5%. The integration of unique hyperbranched SiOB backbone of HPSiB with CE crosslinked network was responsible for the enhanced overall performance. This work paves a facile strategy to develop multifunctional flame retardant as a promising candidate for the high‐performance electronic packaging materials.Highlights A novel hyperbranched polyborosiloxane flame retardant was synthesized. HPSiB shows good compatibility and catalyzes the curing reaction of CE resin. HPSiB/CE resin with significantly enhanced flame retardancy was obtained. Simultaneously high toughness and low dielectric loss were achieved. Hyperbranched structure containing SiOB chains led to the great enhancement.

Research on Silicon Carbide Dispersion-Reinforced Hypereutectic Aluminum-Silicon Electronic Packaging Materials

The objective of this study is to improve the mechanical properties and machining performance of high thermalconductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon electronic packaging materials to meet the needs of aviation, aerospace, and electronic packaging fields. We used the powder metallurgy method and high-temperature hot pressing technology to prepare SiC/Al-Si composite materials with different SiC contents (5vol%, 10vol%, 15vol%, and 20vol%). The results showed that as the SiC content increased, the tensile strength of the composite material first increased and then decreased. The tensile strength was the highest when the SiC content was 15%; the sintering temperature significantly affected the composite material’s structural density and mechanical properties. Findings indicated 700 ℃ was the optimal sintering and the optimal SiC content of SiC/Al-Si composite materials was between 10% and 15%. Besides, the sintering temperature should be strictly controlled to improve the material’s structural density and mechanical properties.