Abstract
High-frequency electronic devices with low dielectric loss and electronic components with high integration densities require high-performance electronic packaging materials. In this study, materials primarily composed of CaO-B2O3-SiO2 (CBS) with an elevated boron content were fabricated through solid-phase sintering using Al2O3 as the ceramic phase. The phase compositions, densification process, microstructures, thermal conductivity, thermal expansion, and dielectric properties of the LTCC were investigated. Remarkably, the CBS-1 LTCC composite sintered at 850 °C for 4 h, exhibited a dense and nonporous microstructure. It demonstrated exceptional thermoelectric properties, including a thermal shrinkage of 5.61 %, coefficients of thermal expansion of 4.86 ppm/°C, thermal conductivity of 2.36 W/m·K, dielectric constant (εr) of 4.88, and tan δ of 1.05× 10−3 at 15 GHz. These characteristics are conducive to minimizing the signal propagation time delay and filtering noisy signals. Consequently, the CBS-1 LTCC composite emerged as a promising substrate for LTCC applications.
Published Version
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