Assembly Of Electronic Components Research Articles

Application of Friction Riveting technique for the assembly of electronic components on printed circuit boards (PCB)

This study focuses on the effects of reducing the diameter of rivets used in Friction Riveting due to the need for downscaling when joining assemblies on a smaller scale. The Friction Riveting process has shown promising feasibility for a variety of material combinations and applications in the transportation industry. Recent research has explored the potential application of this technique in electronics, specifically for the assembly of printed circuit boards (PCBs), using AA-2024-T351 rivets on thin glass-fiber-reinforced epoxy substrates (FR4). The joint formation of joints produced with PCBs was investigated in terms of process temperature evolution, microstructural changes, and mechanical properties. Joints were obtained at process temperatures ranging from 285 ºC to 368 ºC. The use of 4 mm rivets resulted in extensive delamination, weak joint mechanisms, and cracking, impaired by the different coefficients of thermal expansion of the materials involved. Reducing the rivet diameter to 3 mm significantly improved joint quality. A further reduction to 2.5 mm minimized delamination but led to insufficient anchorage and cracking. Joints produced with a 3 mm rivet diameter achieved the highest ultimate tensile force of 276 N. This study sets the foundation for applying the Friction Riveting process to practical PCB assemblies, demonstrating that optimizing the process parameters to the diameter-to-thickness ratio can balance sufficient rivet anchoring, minimize delamination, and reduce cracking.

The Influence of Organizational Commitment, Work Environment, Work Discipline, and Motivation on Employee Performance in Manufacturing and Assembly of Electronic Components

This research aims to determine and analyse the influence of Organizational Commitment, Work Environment, Work Discipline and Motivation. This type of research is quantitative with a population of 76 respondents. Questions are given using a questionnaire with the Google Form technique. The data analysis methods used are Descriptive Test, Validity Test, Reliability Test, Classical Assumption Test, Multiple Analysis and Determination (????2). The results of data analysis using multiple regression and hypotheses using the SPSS program and it can be seen that Organizational Commitment has a significant effect on employee performance, Work Environment does not have a significant effect on employee performance, Work Discipline has a significant effect on employee performance, Motivation has a significant effect on employee performance, and systematic testing Simultaneously shows that Organizational Commitment, Work Environment, Work Discipline and Motivation have a significant effect on Employee Performance.

Impact of product family complexity on process performance in electronic component assembly

AbstractWith the advent of Industry 4.0 and the impending shift towards Industry 5.0, the integration of human–robot collaboration (HRC) into production systems has become increasingly widespread. This paradigm shift leverages collaborative robots, or cobots, to mitigate physical and mental strain on human workers, thereby increasing productivity and improving overall quality performance. This paper investigates the interplay of productivity and quality factors with assembly complexity in both manual and collaborative assembly systems. The focus is placed on a product family of electronic boards, with varying levels of assembly complexity, to provide a comprehensive comparison between manual assembly and two different collaborative assembly scenarios. Key performance metrics such as assembly time and total defects are evaluated. This case study, rooted in the electronics industry, seeks to provide a valuable perspective on how assembly complexity influences productivity and quality in product family assembly systems. The results of this study aim to contribute to the growing body of knowledge on the implementation of HRC in manufacturing, facilitate informed decision-making and encourage further advances in this rapidly evolving field.

Review of Methods for PCB Panel Depanelization and Methods for Correct Assembly of Electronic Components on PCB Panels

Currently, processes related to PCBs (printed circle board), such as depanelization and checking the correct functioning of the boards, are carried out in separate devices. The purpose of this article is to review the literature and analyze trends related to these aspects of PCB panel manufacturing. The purpose of this analysis is to indicate the currently used depanelization methods and methods for checking the correctness of the assembly of electronic circuits on PCB panels. The publications were found in such knowledge bases as Scopus, IEEE Xplore or Emerald insight. In the following article, a systematic literature analysis along with a mapping study is used. This publication provides a review of selected scientific papers found in the above-mentioned databases. Based on these analyses, insights related to future work on both aspects of PCBs were presented. These insights are part of the development of new integrated devices for depanelization and verification of PCBs.

Gold Nanoparticle in Chemoelectronics: Fundamentals, Challenges, and Future Prospects

AbstractThe basic components of modern electronics are primarily fabricated by using semiconductor material in which the movement of charges can be electrically modulated. For metallic material, however, such modulation is almost impossible because of its field‐shielding characteristics, leading to insensitive response toward applied potentials. In this perspective, how to overcome this limitation of bulk metals (here, gold is taken as a particular example) is demonstrated by reducing the size to the nanoscale and functionalizing these nanogolds with charged molecules. The movement of mobile counterions within gold nanoparticle (AuNP) layers can generate charge gradients that feed back and control the motion of electrons which enables to design and fabricate several important components such as the diode, transistor, logic circuits, memristor, and various chemiresistive sensors. The assembly of AuNP electronic components and sensors gives rise to a new class of nanoparticle‐based “chemoelectronic” logic circuits that can sense, process, and ultimately report various chemical signals. The gas sensors are believed to be the most appropriate candidates for such integration as no solvent/solution is required and therefore, in the end, the combination of AuNP gas sensors and memristors is outlooked to achieve all‐gold‐nanoparticle in‐sensor computing for the development of future artificial olfactory.

Research on a lightweight electronic component detection method based on knowledge distillation.

As an essential part of electronic component assembly, it is crucial to rapidly and accurately detect electronic components. Therefore, a lightweight electronic component detection method based on knowledge distillation is proposed in this study. First, a lightweight student model was constructed. Then, we consider issues like the teacher and student's differing expressions. A knowledge distillation method based on the combination of feature and channel is proposed to learn the teacher's rich class-related and inter-class difference features. Finally, comparative experiments were analyzed for the dataset. The results show that the student model Params (13.32 M) are reduced by 55%, and FLOPs (28.7 GMac) are reduced by 35% compared to the teacher model. The knowledge distillation method based on the combination of feature and channel improves the student model's mAP by 3.91% and 1.13% on the Pascal VOC and electronic components detection datasets, respectively. As a result of the knowledge distillation, the constructed student model strikes a superior balance between model precision and complexity, allowing for fast and accurate detection of electronic components with a detection precision (mAP) of 97.81% and a speed of 79 FPS.

Research on Multi-Scene Electronic Component Detection Algorithm with Anchor Assignment Based on K-Means

Achieving multi-scene electronic component detection is the key to automatic electronic component assembly. The study of a deep-learning-based multi-scene electronic component object detection method is an important research focus. There are many anchors in the current object detection methods, which often leads to extremely unbalanced positive and negative samples during training and requires manual adjustment of thresholds to divide positive and negative samples. Besides, the existing methods often bring a complex model with many parameters and large computation complexity. To meet these issues, a new method was proposed for the detection of electronic components in multiple scenes. Firstly, a new dataset was constructed to describe the multi-scene electronic component scene. Secondly, a K-Means-based two-stage adaptive division strategy was used to solve the imbalance of positive and negative samples. Thirdly, the EfficientNetV2 was selected as the backbone feature extraction network to make the method simpler and more efficient. Finally, the proposed algorithm was evaluated on both the public dataset and the constructed multi-scene electronic component dataset. The performance was outstanding compared to the current mainstream object detection algorithms, and the proposed method achieved the highest mAP (83.20% and 98.59%), lower FLOPs (44.26GMAC) and smaller Params (29.3 M).

Comparison of a Bat and Genetic Algorithm Generated Sequence Against Lead Through Programming When Assembling a PCB Using a Six-Axis Robot With Multiple Motions and Speeds

An optimal component feeder arrangement and robotic placement sequence are both important for improving assembly efficiency. Both problems are combinatorial in nature and known to be NP-hard. This article presents a novel discrete hybrid bat-inspired algorithm for solving the feeder slot assignment and placement sequence problem encountered when planning robotic assembly of electronic components. In our method, we use the concepts of swap operators and swap sequence to redefine position and velocity operators from the basic bat algorithm (BA). Furthermore, we propose an improved local search method based on genetic operators of crossover and mutation enhanced by the 2-opt search procedure. The algorithm is formulated with the objective of minimizing the total traveling distance of the pick-and-place device. Through numerical experiments, using a real printed circuit board (PCB) assembly scenario, we demonstrate the considerable effectiveness of the proposed discrete BA to improve the selection of feeder arrangement and placement sequence in PCB assembly operations and achieve high throughput production. The results also highlighted that even though the algorithms outperformed traditional lead through programming techniques, the programmer must consider the influence of different robot motions and speeds.

Laser-Induced Forward Transfer (LIFT) Technique as an Alternative for Assembly and Packaging of Electronic Components

Current trends in microelectronics chip bonding and assembly encompass ultra-fine pitch components with flexible form factors and advanced die-attach materials, which can sustain conformal strain without compromise in adhesion and reliability. These trends have highlighted the need for advanced microfrabrication technologies, which allow the on-demand digital fabrication of interconnections and die-attach bumps on chip carriers and interposers with challenging topographies. Laser printing, based on the laser induced forward transfer (LIFT) technique, has addressed such micromanufacturing challenges over the past decade. Several previous demonstrations of highly resolved and conformal interconnections for the bonding and packaging of micro and opto-electronic components are summarized in this paper. Latest advances in the laser printing and laser sintering of highly viscous nanopastes for achieving planar or three-dimensional (3D) structures consisting of Ag paste are demonstrated. The latter is achieved by stacking of arrays or bumps in a digital manner. The reported results verify that LIFT offers control over both the lateral and vertical dimensions. This control can facilitate the soldering process of heterogeneous components, whose pads have significant height and pitch dissimilarities. The applicability of LIFT in the fields of packaging and assembly of flexible and heterogeneous integration schemes, is further validated.

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Abstract One of the most important procedures in the electronics industry is the assembly of electronic components onto printed circuit boards (PCBs) through the soldering process. Among the various soldering methods available, wave soldering is a very effective technique. In this process, the components are placed onto the PCB, which, subsequently, is coated with a flux and then passed across a preheat zone. In the end, the assembly is moved by the conveyor and passed over the surface of the molten solder wave in order to create a reliable connection both mechanically and electrically. Although this process has been frequently used, there are soldering defects that remain unsolved and continue to emerge, such as the missing of surface-mount components in the PCB after the soldering process. Aiming to understand if such defects are related to the force exerted by the solder wave in the PCB, a numerical and experimental study was performed in this article. For this purpose, a computational fluid dynamic model was developed by using the fluent software to describe the interaction between the solder jet and the PCB with the integrated circuits, and the multiphase method, volume of fluid, was also applied to track the solder–air interface boundary. The results obtained were numerically validated by using an experimental setup designed and built to this end. In general, the data obtained showed to be in good agreement and it was concluded that the force exerted by the solder wave is approximately 0.02 N.

Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components.

Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<0.3 mm and <60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., stencil printing). Laser-Induced Forward Transfer (LIFT) constitutes an excellent alternative for assembly of electronic components: it is fully compatible with lead-free soldering materials and offers high-resolution printing of solder paste bumps (<60 μm) and throughput (up to 10,000 pads/s). In this work, the laser-process conditions which allow control over the transfer of solder paste bumps and arrays, with form factors in line with the features of fine pitch PCBs, are investigated. The study of solder paste as a function of donor/receiver gap confirmed that controllable printing of bumps containing many microparticles is feasible for a gap < 100 μm from a donor layer thickness set at 100 and 150 μm. The transfer of solder bumps with resolution < 100 μm and solder micropatterns on different substrates, including PCB and silver pads, have been achieved. Finally, the successful operation of a LED interconnected to a pin connector bonded to a laser-printed solder micro-pattern was demonstrated.

Comparison of univariate and multivariate anthropometric accommodation of the northwest Mexico population

ABSTRCT Ergonomic workstation design is crucial to prevent work-related musculoskeletal disorders. Many researchers have proposed multivariate analysis for human accommodation. However, no multivariate anthropometric analysis exists for the Mexican population. This study compares common multivariate human accommodation approaches (e.g. principal component and archetypal analyses) and clustering techniques (e.g. k-means and Ward’s algorithm) with the classical percentile-based univariate accommodation approach, using the Chi-squared goodness-of-fit test and the McNemar’s test. The theoretical accommodation percentage obtained by multivariate approaches was higher than those obtained by the percentile univariate approach considering the central 98% data. k-means and archetypal analysis obtained similar and the highest accommodation values, followed by Ward’s algorithm and principal component analysis. The study findings can be deployed to assess the design of workstations in Mexico, such as electronic components assembly and crew designs, and the effects of different anthropometric measurements in human accommodation. Practitioner summary: Products and workplaces design are commonly based on the classical univariate approach, using the extreme percentiles. In this study, multivariate approaches were tested on dimensions for sitting workstations, and results showed a bigger accommodation level in comparison to the univariate 1%–99% approaches. Abbreviations: RHM: representative human model; DHM: digital human model; PCA: principal component analysis; AA: archetypal analysis (AA); PCs: principal components; FA: factor analysis; RSS: residual sum of squares; SSE: sum of squared estimated errors; WA: Ward’s algorithm; DBI: Davies–Bouldin index; CHI: Calinski–Harabaz index; SI: silhouette index; SH: sitting height; EHS: eye height, sitting; AHS: acromial height, sitting; PH: popliteal height; KHS: knee height, sitting; BPL: buttock–popliteal length; BKL: buttock–knee length; FGR: functional grip reach; AD: anthropometric dimension; E: expected; A: achieved

High Speed Soldering Using Laser Printing for the Assembly of Electronic Components

High Speed Soldering Using Laser Printing for the Assembly of Electronic Components

Synthetic Biology: What's In It for Electrical Engineers?

On the surface, electrical engineering and the genetic engineering of bacteria may appear to be disparate fields with little in common. The former concerns the assembly of electronic components to build systems that sense and compute in the electrical domain. Bacterial genetic engineering, on the other hand, involves modifying the deoxyribonucleic acid (DNA) of bacterial cells to arrive at organisms that have new, altered behavior.

Projection-Based Augmented Reality Assistance for Manual Electronic Component Assembly Processes

Personalized production is moving the progress of industrial automation forward, and demanding new tools for improving the decision-making of the operators. This paper presents a new, projection-based augmented reality system for assisting operators during electronic component assembly processes. The paper describes both the hardware and software solutions, and depicts the results obtained during a usability test with the new system.

Kinematic and dynamic analysis of a novel parallel kinematic Schönflies motion generator

This paper analyses the kinematics and dynamics of an over-constrained parallel mechanism with four degrees of freedom providing Schönflies motion with infinite tool rotation. Despite its limited motion capability in one translational degree of freedom, the proposed mechanism has several potential uses, such as assembly of electronic components or fabric cutting.Firstly, the instantaneous kinematic problem of the investigated mechanism is presented, which includes formulating the inverse kinematics for the position, velocity and acceleration of the mechanism. Then, singular configurations of the manipulator are studied, based on the obtained Jacobin matrices. Secondly, based on the foregoing kinematic relations and the concept of link Jacobian matrices, the dynamic model is formulated by means of the principle of virtual work. Finally, the correctness of the derived models is verified by comparing the results obtained from the formulated models with those obtained using MATLAB Simscape Multibody.

Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, the surface level differences on which the PCB is placed, the process of assembling the electronic components induces a certain state of stress and deformation in the PCB. The main components affected are microprocessors due to the way they are glued to PCBs with BGA - Ball grid arrays (BGA). Digital Image Correlation (DIC) is a full-field contactless optical method for measuring displacements and strain in experimental testing, based on the correlation of images taken during test. The experimental setup is realized with Dantec Q-400 system used for image capture and Istra 4D software for image correlations and data analyses. The maximum level of the obtained strain is compared with the allowable limit. Finite element analysis (FEA) is a numerical method of analysis for stresses and strain in structures of any given geometry.

Tailored and deep porosification of LTCC substrates with phosphoric acid

Low temperature co-fired ceramics (LTCC) as an advanced technology for robust assembly of electronic components, has attracted significant attention in a wide application range such as in wireless communication or automotive radar systems. However, accurate designs of micromachined devices operated at high frequencies require substrates with regions of tailored permittivities. Introduction of controlled porosity into the substrate via wet-chemical etching procedure, is a promising approach for permittivity reduction which can be applied to commercially available LTCC without necessitating to alter their composition or sintering process. In the present study, by selective dissolution of celsian phase a very deep porosification (highest reported so far) could be realized while preserving the surface quality. Also, by a careful selection of the etching parameters, the depth of porosification and hence the permittivity reduction can be delicately tailored. Laser ablation inductively coupled plasma mass spectrometry was used for the investigation of chemical compositions of substrates.

Motion optimisation for improved cycle time and reduced vibration in robotic assembly of electronic components

Traditionally, six axis robots have not been used in electronic surface mount assembly. However, the need for more flexible production systems that can be used for low to medium production builds, means that these robots can be used due to their high degrees of flexibility. This research investigated the application of an articulated robot to assemble a multi component PCB for an electronic product. To increase the potential of using this method of automation, a genetic algorithm was used to improve cycle time and condition monitoring was performed to assess the vibrations within the robot structure, during operation. By also studying the motion types the robot movements can be optimized in order to minimize the cycle time and maximize the production throughput with reduced vibrations to improve the accuracy of the assembly process. The study utilised a robotics assembly cell and a robot programmed with different velocities. Vibrations were present throughout out the assembly cycle and by analysing when these large vibrations occur and for which types of motion, an optimal selection could be made. The point-to-point motion type running at 50% speed had a faster assembly time and significantly lower accelerations and oscillations than the other motion types. The spline-linear motion type running at around 30% speed was best for the component insertion due to its linear nature and improved repetition accuracy.

Experimental determination of strain distribution on Printed Circuit Boards using Digital image correlation

The paper investigates the use of digital image correlation (DIC) for strain measurement on Printed Board Circuits (PCBs). Digital Image Correlation (DIC) is a full-field contactless optical method for measuring displacements and strain in experimental testing, based on the correlation of the digital images taken during test. This method is used to measure strain of the surfaces of materials and structures subjected to various stresses (such as mechanical stresses or thermal stresses).So, this method is used according to the documentation for a variety of applications such as: large deformation measurements, crack analysis, stress strain curves (σ-ε) for new materials, constructions - to evaluate certain displacements and cracks, measurement of strain caused by temperature variations.Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, the surface level differences on which the PCB is placed, the process of assembling the electronic components induces a certain state of stress and deformation in the PCB. The main components affected are microprocessors due to the way they are glued to PCBs with BGA - Ball grid arrays (BGA).To determine the strain on PCBs, the actual measurement method uses strain gages. This method allows determining the strain only at certain points. The Digital Image Correlation method provides full field strain field. The experimental setup is realized with Dantec Q-400 system used for image capture and Istra 4D software for image correlations and data analyses. The maximum level of the obtained strain is compared with the allowable limit.