Abstract
This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, the surface level differences on which the PCB is placed, the process of assembling the electronic components induces a certain state of stress and deformation in the PCB. The main components affected are microprocessors due to the way they are glued to PCBs with BGA - Ball grid arrays (BGA). Digital Image Correlation (DIC) is a full-field contactless optical method for measuring displacements and strain in experimental testing, based on the correlation of images taken during test. The experimental setup is realized with Dantec Q-400 system used for image capture and Istra 4D software for image correlations and data analyses. The maximum level of the obtained strain is compared with the allowable limit. Finite element analysis (FEA) is a numerical method of analysis for stresses and strain in structures of any given geometry.
Highlights
Printed circuit boards (PCBs) are the boards that are used as the base in most electronics for physical support piece and wiring area for the surface-mounted and socketed electronical components
This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs)
These can cause problems in microprocessors Ball grid arrays (BGA) (Ball grid array) and causes of failure for the electronic component. [1,2,3,4,5,6,7] The current method used for strain measurement on PCBs is resistive strain gauge method presented in [8, 9]
Summary
Printed circuit boards (PCBs) are the boards that are used as the base in most electronics for physical support piece and wiring area for the surface-mounted and socketed electronical components. The reason for this is the size reduction of PCBs, change of solder material from Lead Solder (SnPb) to lead-free solder and the use of increasingly complex electronic components. The strains induced on PCB could be due to: differences of surface level on which the PCB is placed, assembly process of electronic components, bending of PCB due to assemblies, vibrations, temperature variation, and impact. These can cause problems in microprocessors BGAs (Ball grid array) and causes of failure for the electronic component. The numerical results obtained from finite element analysis (FEA) are compared with experimental results from digital image correlation (DIC) method
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