Operation Of Electronic Circuits Research Articles

New Electromagnetic Threat Protection Systems

The issues discussed in the article refer to a new category of military operations - electronic warfare (EW). In the context of EW, the high-power microwave (HPM) technology currently enables remote disturbances of operations lasting until the circuit is reset or the electronic system is destroyed. The article examines the problem of protection and defence against using HPM pulses. The research used a compact HPM generator developed at the Polish National Centre for Nuclear Research. It has a power of 3MW, an operating frequency of 2.9 GHz and a 3 μs pulse duration, emitted with a repetition rate of 1, 50, 100 and 250 Hz. The developed HPM pulse protection systems were subjected to intense field exposure in the open space of the training ground, in its land and sea sections, and in the circuit with a reverberation chamber. The distribution of the generated field on each measurement station was tested using a high-power D-dot probe, from which the data was transferred to the recording system via an optical fibre link. In all cases, this distribution turned out to be repetitive. The field probe with a logger was used for measurements inside composite structures. Unprotected electronic systems in hobby drones, mobile phones, cameras and systems using sensors based on micro-mechanical units were exposed. An analysis was conducted to check the operation of electronic circuits, effects caused and phenomena occurring during exposures to intense microwave radiation. It was found that the developed system meets the design assumptions in conditions similar to actual exposure to HPM weapons. Screening efficiency has been determined for various spatial configurations of radiation beam incidence. The presented systems for the protection and defence against the effects of HPM weapons implemented in the technology of composite hybrid absorbers enable effective elimination of electromagnetic pulse effects.

The ink-jet printed flexible interdigital capacitors: manufacturing and ageing tests

Correct operation of electronic circuits (including those made with the ink-jet printing technique) requires the electrical parameters of the structures to be constant or to be changeable, but in a predictable way. Due to that, the flexible, ink-jet printed interdigital capacitors (IDSs) were made and then tested in various conditions. We used the conductive silver-based Amepox AX JP-60n ink. As a substrate, we chose the transparent, flexible Melinex OD foil with a thickness of 125 µm. The IDCs were designed and their capacitances were simulated using Comsol Multiphysics Software. Then the test structures were fabricated by the ink-jet printing process using Dimatix DMP 2831 printer. The printed structures were subjected to environmental exposures in a climate chamber to check the influence of temperature and humidity on the tested samples. The IDCs were also subjected to cyclic bending and straightening tests to analyze the outflow of tensile forces on the printed structures, which are exposed to the common factors, that could diminish the quality of the printed and flexible devices. Due to the small capacitance values of the designed and made IDSs, the measurements showed the key importance of the measuring table on which flexible substrates with IDC capacitors were placed for their capacitance value. Performed tests also demonstrated that in most cases, the capacitors are characterized by an increase in capacitance by a few to a dozen or so % after the ageing tests. Obtained results could be a good groundwork for further research, that will include ways of preventing the creation of discontinuities—or minimizing their impact on the printed device performance.

Contributions of Light to Novel Logic Concepts Using Optoelectronic Materials.

Instead of the current method of transmitting voltage or current signals in electronic circuit operation, light offers an alternative to conventional logic, allowing for the implementation of new logic concepts through interaction with light. This manuscript examines the use of light in implementing new logic concepts as an alternative to traditional logic circuits and as a future technology. This article provides an overview of how to implement logic operations using light rather than voltage or current signals using optoelectronic materials such as 2D materials, metal-oxides, carbon structures, polymers, small molecules, and perovskites. This review covers the various technologies and applications of using light to dope devices, implement logic gates, control logic circuits, and generate light as an output signal. Recent research on logic and the use of light to implement new functions is summarized. This review also highlights the potential of optoelectronic logic for future technological advancements.

Holding Force Characteristics of Preformed Helical Fitting Based on Finite Element Method

As an important part of transmission lines, preformed helical fitting plays an indispensable role in the safe and stable operation of electronic circuits. However, due to the poor service environment of transmission lines, preformed helical fitting can often slip, scatter, and detwist. This paper explores variations in the holding force of the preformed helical fitting under different geometric parameters. First, the geometric structure of preformed helical fitting is analyzed, and the secondary development is conducted using the ABAQUS finite element software. The script program is written in Python language to realize the parametric modeling. Based on the experimental results, the changing trend of the holding force is consistent, which confirms the correctness of the finite element model. In addition, the preformed helical fitting is studied under different values of molding aperture, pitch length, pitch number, and armor rod diameter, and changes in the holding force under different parameters are analyzed. The results show that the holding force of the preformed helical fitting increases with the decrease in the molding aperture and pitch length, and the molding aperture has a negative linear correlation with the overall holding force. The holding force increases linearly with the pitch number; so, reducing the pitch length can increase the holding force of preformed helical fitting. Moreover, the results indicate that the holding force increases with the armor rod diameter. The research results presented in this study have important guiding value for the design of performed helical fitting.

Design and Investigation the Characteristics of the Components of a DC Regulated Power Supply Using Multisim 14.2 Simulator

In an ordinary (unregulated) power supply the voltage regulation is poor (i.e. the DC output voltage also changes due to variations in the input AC voltage). These variations in DC voltage may cause unreliable operation of electronic circuits; Therefore, regulated DC power supply is the only solution in such situations. In this paper, the V-I characteristics of a PN junction diode in both forward and reverse directions was investigated using Multisim 14.2, simulator and graphically discusses, the V-I characteristics of a Zener diode in both forward and reverse bias conditions and used it as voltage regulator was determined and discusses graphically, the effect of load resistance and filter capacitor on ripple factor of half wave was determined and discusses graphically, the effect of load resistance and filter capacitor on ripple factor full wave rectifiers was

Lead-free multilayer ceramic capacitors with ultra-wide temperature dielectric stability based on multifaceted modification

The rapid development of high technology—such as space exploration and electric vehicles—urgently requires ultra-wide temperature multilayer ceramic capacitors (UWT MLCCs) to achieve reliable operation of electronic circuits in harsh environments. However, simultaneously achieving high dielectric permittivity, low dielectric loss, and ultrahigh thermal stability has been a major challenge for practical dielectric ceramics. The co-firing matching of the internal electrode and the dielectric ceramic is also an important factor that affects the reliability of UWT MLCCs. Herein, through multifaceted modification—i.e., composition design related to the modulation of the local polar nanoregions (PNRs) and optimizing device sintering in the context of the compatibility of the heterogeneous interface—these concerns have been well-addressed. A new lead-free dielectric system (1-x) (0.56Na0.5Bi0.5TiO3-0.14K0.5Bi0.5TiO3-0.3NaNbO3)-xCaZrO3 (NKBTNN-xCZ) dominated by P4bm PNRs was designed and corresponding UWT MLCCs with reliable Pt internal electrode interface bonding were fabricated by optimizing the sintering temperature. A record-high dielectric permittivity (εr = 839 ± 15 %) and low dielectric loss (tanδ ≤0.02) was achieved over an ultra-wide temperature range from -70 °C to 337 °C for NKBTNN-0.063CZ UWT MLCCs. This work suggests that multifaceted modification should be generalized for construction of high-performance UWT MLCCs.

Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics.

Thiol-ene/acrylate-based shape memory polymers (SMPs) with tunable mechanical and thermomechanical properties are promising substrate materials for flexible electronics applications. These UV-curable polymer compositions can easily be polymerized onto pre-fabricated electronic components and can be molded into desired geometries to provide a shape-changing behavior or a tunable softness. Alternatively, SMPs may be prepared as a flat substrate, and electronic circuitry may be built directly on top by thin film processing technologies. Whichever way the final structure is produced, the operation of electronic circuits will be influenced by the electrical and mechanical properties of the underlying (and sometimes also encapsulating) SMP substrate. Here, we present electronic properties, such as permittivity and resistivity of a typical SMP composition that has a low glass transition temperature (between 40 and 60 °C dependent on the curing process) in different thermomechanical states of polymer. We fabricated parallel plate capacitors from a previously reported SMP composition (fully softening (FS)-SMP) using two different curing processes, and then we determined the electrical properties of relative permittivity and resistivity below and above the glass transition temperature. Our data shows that the curing process influenced the electrical permittivity, but not the electrical resistivity. Corona-Kelvin metrology evaluated the quality of the surface of FS-SMP spun on the wafer. Overall, FS-SMP demonstrates resistivity appropriate for use as an insulating material.

Using Karnaugh Maps in Software Requirements Analysis

Faulty requirements leading to design deficiencies have been shown to be an avoidable root cause of many product failures. This paper is an effort to push the boundaries of system safety by proposing a novel approach for discovering faulty or missing software requirements by adapting a proven methodology heretofore used in circuit analysis. Karnaugh Mapping is employed in Application-Specific Integrated Circuit (ASIC) design to minimize power consumption, facilitate temperature control, increase functionality and minimize the number of physical logic gates. Karnaugh Maps (K-Maps) are ideally suited to impose order on logical requirements that describe the operation of electronic circuits. With the assumption that software requirements are expressible as logical statements, this paper assesses the ability of Karnaugh Mapping to effectively deconstruct and rationalize developmental requirements in the analysis of software and seeks to demonstrate that K-Maps can be used not only to minimize the number of requirements, but also to detect missing requirements. The analysis conducted in the course of developing this paper indicates that K‑Maps can effectively identify faulty requirements in two examples of varying complexity, provided that sematic conventions are established and observed.

Flux Trapping Analysis in Superconducting Circuits

Flux trapping adversely affects the superconducting electronic circuit operation. Circuit designers would benefit from a tool to analyze the probability and effects of flux trapping at critical locations for a given circuit layout. We show how our tetrahedral volume element numerical solver, TTH, can be used to model trapped fluxons in the presence of external magnetic fields. We also show how to extract the self-inductance around holes and the mutual inductance between moats and other excitation ports. Understanding the coupling effects between moats and circuit elements such as signal lines or Josephson junctions can help determine the optimal size and placements of moats, preventing circuit performance degradation and operation malfunction.

From Geodesic Flow on a Surface of Negative Curvature to Electronic Generator of Robust Chaos

Departing from the geodesic flow on a surface of negative curvature as a classic example of the hyperbolic chaotic dynamics, we propose an electronic circuit operating as a generator of rough chaos. Circuit simulation in NI Multisim software package and numerical integration of the model equations are provided. Results of computations (phase trajectories, time dependencies of variables, Lyapunov exponents and Fourier spectra) show good correspondence between the chaotic dynamics on the attractor of the proposed system and of the Anosov dynamics for the original geodesic flow.

Finding hidden oscillations in the operation of nonlinear electronic circuits

Several dynamic behaviours can simultaneously coexist in the operation of a nonlinear electronic circuit. However, some of these dynamics are difficult to be observed due to their sensibility to initial conditions. The use of describing functions to determine the coexistence of multiple dynamics in the operation of an electronic circuit with nonlinear feedback is proposed.

Application of Pelletron Accelerator to Study High Total Dose Radiation Effects on Semiconductor Devices

Silicon bipolar junction transistors (BJTs), Silicon-germanium heterojunction bipolar transistors (SiGe HBTs) and metal oxide semiconductor (MOS) devices are the key components of BiCMOS integrated circuits. The semiconductor devices need to withstand very high total doses (100’s of Mrad) for reliable operation of electronic circuits for 8-10 years of LHC operation. The study of radiation tolerance of semiconductor devices up to 100 Mrad of total dose takes longer time with conventional60Co gamma, proton and electron irradiation facilities and the effects due to these radiations are well understood. Hence it is important to study the effects of heavy ion irradiation on various semiconductor devices. The irradiation time decreases with increasing linear energy transfer (LET) of incident radiation and LET increases with atomic number of the impinging ions. But it is essential to understand the mechanism of energy transfer by different heavy ions in semiconductor devices. Therefore, here we give an overview of different heavy ion interactions with Si BJTs, MOSFETs and SiGe HBTs by primarily focusing on the electrical characteristics of these devices before and after ion irradiation. We show that the irradiation time needed to reach very high total dose can be reduced by using Pelletron accelerator facilities instead of conventional irradiation facilities.

Harvesting of energy from Human Walking with a piezoelectric transducer to supply a medical instrument

Abstract Introduction: Nowadays, the advanced technology of designing electronic circuits in very small size and with very low power consumption has led to development of wearable and implantable medical devices. However, the electronic circuits need power supply that is usually provided by relatively large and heavy batteries. The discharged batteries have to replaced or recharged for long time operation of electronic circuits. A new promising approach to overcome these limitations is harvesting the required power from the human body itself. Materials and Methods : In this paper, a harvesting system which implements a high performance piezoelectric transducer in the shoe was developed and evaluated for supplying the power required by a basic electronic circuit as a model of a wearable medical device. Results: The developed system was able to harvest 0.8mw of steady power with the use of only one piezoelectric transducer. The power was used to supply a basic micro-controller based electronic system steadily without the need for any batteries. Conclusion: The results demonstrate that low power monitoring or rehabilitation instruments may be supplied without batteries by harvesting the available energy in the walking process. Keywords: Energy harvesting, Human walking, Piezoelectric Transducer, Wearable Medical Devices

Self-integration of nanowires into circuits via guided growth

The ability to assemble discrete nanowires (NWs) with nanoscale precision on a substrate is the key to their integration into circuits and other functional systems. We demonstrate a bottom-up approach for massively parallel deterministic assembly of discrete NWs based on surface-guided horizontal growth from nanopatterned catalyst. The guided growth and the catalyst nanopattern define the direction and length, and the position of each NW, respectively, both with unprecedented precision and yield, without the need for postgrowth assembly. We used these highly ordered NW arrays for the parallel production of hundreds of independently addressable single-NW field-effect transistors, showing up to 85% yield of working devices. Furthermore, we applied this approach for the integration of 14 discrete NWs into an electronic circuit operating as a three-bit address decoder. These results demonstrate the feasibility of massively parallel "self-integration" of NWs into electronic circuits and functional systems based on guided growth.

An Electromagnetic Sensing Method (ESM) to Detect the Short-Circuit in PCB

The short-circuit phenomenon is one common error in the operation of electronic circuit. Short-circuit will cause the electrical components damage and the incorrect function in PCB. In general, the detection of short-circuit is performed by using the electrode probe to contact each pad in single PCB or the probe card in mass production of PCD. Due to the fast development of circuit layout, the size of IC with pads is getting smaller; therefore, it is much difficult to detect short-circuit in PCB by the pads-contact inspection. This paper presents a method to detect short-circuit area in PCB without the use of electrode probe, which employs the electromagnetic signals to sense and identify the change of electromagnetic induced by short-circuit. We design an electromagnetic sensing probe which comprises of an equivalent circuit to detect the change of electromagnetism in PCB, and employ an X-Y table for automatic positioning. Instead of tiny electrode probe manufacturing, the electromagnetic sensing method (ESM) is able to detect the short-circuit area inside the multi-layer PCB. In addition, the inspective module with ESM can be designed to be a portable instrument without the space limitation. The article shows the verification of proposed system with the scanning pitch is from 5 to 20 mil line width, the working distance of sensing probe is from 1 to 20 mm, and 4 layers PCB measurement. We also experiment the real case detection by using the ESM in PCB and display ESM can successful indicate the probable area of short-circuit.

Thermal Performance Analysis Based on Micro-Channel Structure of Heat Sink

Thermal performance determines the normal operation of electronic circuits and power devices. The required cooling capacity is always increasing with the abroad application of electronic system. Especially in high frequency and large power fields, the defection of fan-cooled radiator comes out. By comparison, liquid cooling system possesses better heat stability and conductivity, which not only improves the stability of system, but also reduces the working costs greatly. Cooling capacity of heat sink is mainly determined by the inner mechanical structure, it is necessary to study the different influences of related structure, so as to guide the structural design of heat sink effectively. Based on thermal analysis by changing a single structure parameter, the structural influences on thermal performance are discussed, and the acquired conclusions are of great importance in thermal design practice of heat sink.

Demonstration of negative signal delay with short-duration transient pulse

This paper introduces theoretic and experimental analyses of short-duration pulse propagation through a negative group delay (NGD) circuit. The basic analysis method of this electronic circuit operating in baseband and microwave frequencies is investigated. Then, its electrical fundamental characteristics vis-a-vis transient signals are developed. To validate the theoretic concept, planar hybrid devices with one- and two-stage NGD cells were designed, simulated, fabricated and tested. Transient analyses with ultra-wide band (UWB) pulse signals with different widths are realized. Then, experimental results in good agreement with the theoretical predictions were observed. Consequently, group delay going down under −2.5 ns is evidenced in baseband frequency up to 63 MHz with one-stage NGD cell. In time-domain, a Gaussian pulse in advance of about t 0 = −1.5 ns or 20% of its half-height time-width was measured. This corresponds to a negative group velocity of about v g = L / t 0 = −0.13 c ( L is the physical length of the tested device and c is light speed in the vacuum). More significant NGD value over 100-MHz bandwidth is stated with two-stage NGD cells. This results in a Gaussian pulse peak advance of about −5 ns (raising a group velocity of about v g = −0.12 c ) or 31% of its half-height time-width. Finally, some potential applications based on the NGD function are discussed.

Silicon-Germanium as an Enabling Technology for Extreme Environment Electronics

“Extreme environment” electronics represent an important niche market in the trillion dollar global electronics industry and span the operation of electronic circuits and systems in surroundings lying outside the domain of conventional commercial or military specifications. Such extreme environments might include, for instance, the following: 1) operation down to very low temperatures (e.g., to 77 K or even 4.2 K or below); 2) operation up to very high temperatures (e.g., to 200°C or even 300°C); 3) operation across very wide and/or cyclic temperature swings (e.g., -230°C +120°C night to day, as found on the lunar surface); 4) operation in a radiation environment (e.g., in space while orbiting the Earth); or 5) at worst case even with all four simultaneously. The unique bandgap-engineered features of silicon-germanium (SiGe) heterojunction bipolar transistors and the electronic circuits built from them offer a considerable potential for simultaneously coping with all four of these extreme environments, potentially with no process modifications, ultimately providing compelling advantages at the integrated circuit and system level across a wide class of envisioned commercial and defense applications. Here, we detail the nuances associated with using SiGe technology for extreme environment electronics, paying particular attention to recent developments in the field.

Bistable phase control via rocking in a nonlinear electronic oscillator

We experimentally demonstrate the effective rocking [de Valcarcel and Staliunas, Phys. Rev. E 67, 026604 (2003)] of a nonlinear electronic circuit operating in a periodic regime. Namely, we show that by driving a Chua circuit with a periodic signal, whose phase alternates (also periodically) in time, we lock the oscillation frequency of the circuit to that of the driving signal, and its phase to one of two possible values shifted by pi, and lying between the alternating phases of the input signal. In this way, we show that a rocked nonlinear oscillator displays phase bistability. We interpret the experimental results via a theoretical analysis of rocking on a simple oscillator model, based on a normal form description (complex Landau equation) of the rocked Hopf bifurcation.

Computational estimation of ESD conditions between charged particles and grounded surfaces

The paper examines the conditions in which a discharge occurs between charged spherical particles and grounded surfaces, in air, at atmospheric pressure. The study is of interest to a large group of electrostatic applications which involve the processing of particulate matter: separation of granular mixtures, precipitation of dust, and spraying of powders. At the same time, this simple physical model simulates a class of hazardous situations quite often met in the operation of electronic circuits. The boundary-element method was employed for the computation of the electric field in the gap of length x between a charged conductive spherical particle of radius R and a grounded plate. The data on field distribution represented the input data of an original program which employed Pedersen's criterion for estimating the breakdown conditions of that air-gap. The study was carried out for spheres of various sizes (radii: 0.01-1 mm). Some computations were performed for the case when the grounded plate was covered with an insulating layer of known permittivity. The computational results were in good agreement with the experimental data for both long (x/R>10) and short (x/R<0.1) gaps.