Electron Microscopy is a powerful tool for aid in the development of new compound semiconductors because it has the ability to characterize materials from the atom (aberration-corrected Transmission Electron Microscopy) to the millimeter length scale (montaged scanning electron microscopy - SEM). By including important aspects of the electron-sample interaction in a microscopy, we can couple imaging with crystallography (diffraction), chemistry (energy-dispersive spectroscopy (EDS), electron energy loss spectroscopy (EELS)) and chemical bonding (electron energy loss spectroscopy) at ultrahigh resolution. All of these techniques allow us to probe defect structure, the fine details of interfaces, and the growth mechanism in electronic materials.Recently, the concept of remote epitaxy has been introduced, with the idea of growing semiconductors through a “veil” of 2-D material – demonstrated first in GaAs/Graphene/GaAs. This facile method demonstrates the new methods for creating defect-reduced but transferable thin films, where the deposited atoms line up “through the veil” across from their substrate counterparts. This exciting development has spurred great interest in similar types of epitaxy and understanding their details at the atomic scale. It also allows for easy transfer of near-perfect films to other substrates.In this talk, I will present how EM can elucidate materials problems through several examples different types of heteroepitaxy: the first example is epitaxy of 2-dimensional forms of III-N and III-O and group III metals on SiC mediated through epitaxial graphene (EG), a technique similar to but not exactly remote epitaxy. This technique, known as confinement heteroepitaxy (CHet) is a fabrication technique for 2D heterostructure in which atoms are intercalated between defective epitaxial graphene and substrates of silicon carbide in a CVD process typically at 800 °C. The confined layers can be designed with the merit of intercalation in several combinations and has the potential to create wafer-scale van der Waals heterostructures. I will discuss the details of the SiC/EG/III-V/Graphene growth, as elucidated using TEM imaging, SEM imaging, and atomic resolution EELS.A second example is the idea of a self-assembled heteroepitaxy of CdTe on sapphire. Grown by pulsed laser deposition, we discovered using advanced EM that the CdTe spontaneously forms a van der Waals interface of Te-Te bonds, thus making these films easy to peel/transfer from the substrate. We used atomic resolution imaging, EELS spectroscopy both of composition and of the interface plasmon to demonstrate this spontaneous and unexpected coordination at the interface. This exciting example of 3D-3D epitaxy with van der Waals interface could be developed for novel semiconductor devices or in other materials systems, and shows that advanced EM techniques are breakthrough enabling tool for compound semiconductor development.
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