Electromagnetic Interference Noise Source Research Articles

Noise Analysis Method of Radiated EMI based on Non-linear Principal Component Analysis

Aiming at the radiated electromagnetic interference (EMI) noise of electronic equipment, a novel method of radiated EMI noise analysis based on non-linear principal component analysis (NLPCA) algorithm is proposed in this paper. In order to obtain multiple independent common-mode / differential-mode radiated sources, and to find the sources that cause the radiated noises that exceed the limit of standard, NLPCA algorithm is used to process the near-field radiated signals superimposed by multiple radiated sources. The simulation results show that NLPCA can successfully screen out the radiated EMI noises which exceed the limit of standard. Moreover, the experiments are carried out with three models: double-common-mode hybrid sources, double-differential-mode hybrid sources and common-differential-mode hybrid sources. Compared with the traditional independent component algorithm (ICA), the method proposed in this paper can separate the radiated EMI noise sources more accurately and quickly. It can be concluded that the accuracy of NLPCA algorithm is 10% higher than ICA algorithm. This work will contribute to trace the radiated EMI noise sources, and to provide the theoretical basis for the future suppression.

Analysis of the Influence of Measurement Circuit Asymmetries on Three-Phase CM/DM Conducted EMI Separation

Electromagnetic interference (EMI) conducted emissions (CE) are of increasing concern in power electronics due to the high switching frequency and fast switching speeds of the latest generation of wide-bandgap semiconductors. The decomposition of the total conducted EMI noise into its common-mode (CM) and differential-mode (DM) part by means of a CM/DM noise separator is a useful tool that allows for a systematic EMI filter design. Carefully designed realizations achieve a CM rejection ratio and DM rejection ratio of 50 dB at 30 MHz. However, a very high-performance CM/DM noise separator is not sufficient. It is theoretically analyzed and experimentally proven that asymmetries in the EMI test setup result in an unwanted conversion between CM and DM EMI noise, and therefore significantly influence the CM/DM EMI separation. In particular, three main influences are identified: the line impedance stabilization network (LISN), the connection cables between LISN and the equipment under test (EUT), and the converter EMI filter. The unwanted noise conversion is pronounced for frequencies in the MHz range, where parasitic resonances occur. Experimental results show a CM-to-DM conversion of up to -30 dB at 30 MHz (a degradation by 20 dB or a factor of 10 compared to a high-performance separator alone) considering a connection cable length mismatch of roughly 5 cm. Values as high as -21 dB result when standard commercial LISNs are used for the measurement. The impact of asymmetries in the EMI filter is most severe, and clearly limits the EMI noise splitting at high frequencies. A high-performance noise separator can, however, be used to investigate such filter asymmetries (component tolerances and/or layout), and therefore helps to improve the filter design process and facilitates the modeling of EMI noise sources. [COMP: Change bullet list to numbered].

High side flyback circuit configuration for CM noise cancellation

Flyback topologies have advantages in terms of low cost, fewer electrical components, and simple circuit design. Semiconductor devices in the primary and secondary sides are regarded as major EMI noise sources in EMI propagation paths. However, the same transformers under different circuit configurations can bring different noise cancellation effects due to a change of the electric potential distribution in transformer windings as well as the phases of the EMI noise sources in the primary and secondary sides. In this paper, a CM noise cancellation mechanism is investigated. In addition, a flyback topology with high side gate driving in the primary side is proposed to form a CM noise cancellation mechanism. Based on the proposed flyback topology, the capacitor compensation cancellation technique can be applied to lower the electromagnetic interference (EMI) noise level of the designed converter. Finally, the experimental noise spectrums are used to verify the effectiveness of the proposed flyback circuit configuration scheme.

Study on conducted EMI noise source modelling applied in electromagnetic compatibility analysis based on GA in cooperation with LM

In this study, a new method employing scattering parameters (SPs) method, genetic algorithm (GA) and Levenberg–Marquardt algorithm (LM) is proposed for modelling conducted electromagnetic interference (EMI) noise source impedance. On the basis of the impedance information extracted by traditional SP method, GA is adopted to optimise the impedance information by taking advantage of the fast convergence speed. The obtained values of the RCL parameter are used as a set of initial values. Then, by using the advantage of the high precision of the LM, the initial values obtained by the GA are iteratively calculated. Better results can be obtained by using this combination method. This method improves the processing accuracy while ensuring the processing speed and contributes to the design of conduction EMI filter.

Analysis and Modeling of Conducted EMI from an AC–DC Power Supply in LED TV up to 1 MHz

Critical conduction mode (CRM) boost power factor correction (PFC) converter is widely used in ac–dc power supplies to achieve high power factor. The switching frequency varies in a half-line cycle. In this article, both the differential-mode (DM) and common-mode (CM) electromagnetic interference (EMI) noises below 1 MHz from the ac–dc power supply in a LED TV are analyzed and modeled. The power supply consists of two parts: CRM boost PFC converter and LLC resonant converter. The conducted EMI noise and noise source voltages are measured in the time domain and then converted to the frequency domain via short-time fast Fourier transform (STFFT). Through the joint time-frequency analysis using STFFT, the drain-to-source voltage of the power MOSFET in the PFC converter is identified as the dominant noise source of both CM and DM EMI noises below 1 MHz from the power supply. The EMI current path is different during different periods of a cycle of the line voltage. During most time of a cycle, two diodes of the bridge rectifier are forward biased, and the bridge rectifier can be treated as short circuit. The current paths of DM and CM EMI noises are explained and modeled by a linear equivalent circuit model. Three parasitic capacitances need to be considered to model the CM EMI noise in this device under test. From the circuit model, transfer functions relating DM and CM EMI spectra to noise source voltage spectrum are obtained. The conducted EMI spectra are predicted by multiplying the spectrum of noise source voltage by the transfer functions. The prediction matches with measurement. The effects of parasitic capacitances on CM EMI noise are analyzed by simulation and then validated by measurement. The analysis results can help with EMI design to reduce the CM EMI.

A Survey of EMI Research in Power Electronics Systems With Wide-Bandgap Semiconductor Devices

Wide-bandgap (WBG) power semiconductor devices have become increasingly popular due to their superior characteristics compared to their Si counterparts. However, their fast switching speed and the ability to operate at high frequencies brought new challenges, among which the electromagnetic interference (EMI) is one of the major concerns. Many works investigated the structures of WBG power devices and their switching performance. In some cases, the conductive or radiated EMI was measured. However, the EMI-related topics, including their influence on noise sources, noise propagation paths, EMI reduction techniques, and EMC reliability issues, have not yet been systematically summarized for WBG devices. In this article, the literature on EMI research in power electronics systems with WBG devices is reviewed. Characteristics of WBG devices as EMI noise sources are reviewed. EMI propagation paths, near-field coupling, and radiated EMI are surveyed. EMI reduction techniques are categorized and reviewed. Specifically, the EMI-related reliability issues are discussed, and solutions and guidelines are presented.

Investigation on conducted EMI noise source impedance extraction for electro magnetic compatibility based on SP‐GA algorithm

A new approach employing scattering parameters (SPs) and genetic algorithm (GA) (SP-GA) is proposed for modelling conducted electromagnetic interference (EMI) noise source impedance. Based on the principle of SPs, the source impedance is measured through transmission and reflection parameters from a vector network analyser when the circuit is shorted and loaded with noise source impedance, respectively. Moreover, amplitude-frequency performance and phase-frequency performance are optimised by using GA, and therefore the equivalent resistance, capacitance, and inductance are attained following the usual formula of the phase and amplitude of source impedance. This work made contribution for the design of the conducted EMI filter.

Characteristic Analysis and Applications of Electromagnetic Shielding Materials for Wireless Communications Device

As the trend of consumer electronics and mobile communications devices is obviously developing toward to miniature and high-speed processing, the problem involving with electromagnetic compatibility (EMC) or radio frequency interference (RFI) is becoming more critical for the system integration of high-speed digital and RF mixed signal platforms. This paper is mainly focusing on the characteristics analysis of various electromagnetic shielding materials by utilizing the various shielding effectiveness (SE) measuring methods developed by TDK and ASTM (ASTM D4935). We also adopt the electromagnetic interference (EMI) testing methods developed by IEC for chip level (IEC 61967-3 and IEC 61967-6) to investigate the characteristics and distribution of EMI noise sources. To effectively shield the electric, magnetic, or electromagnetic field originated from noise source, we thus analyze the shielding capability for various materials with different measuring methods. Finally, we will show the EMI reduction and RF performance improvement with implementation of shielding material on module under investigated. With the systematic measurement and analysis described in this paper, we can further identify the related EMI problem and resolve the severe chip or module level EMC problem more effectively.

Reduction in conducted EMI noises of a switching power supply after thermal management design

Owing to the increasing power density of a switching power supply (SPS), the placement of the components for thermal management and electromagnetic interference (EMI) characteristics is more difficult to design at a given form factor. When thermal management is a critical issue for the SPS, then methods for improving EMI noises seem not to be simultaneously successful at this design stage. As a result, the conducted EMI noises will deteriorate due to the placement of components for thermal management. Furthermore, the performance of the designed EMI filter will deteriorate due to severe internal electromagnetic interference, and thus lead to failure in the EMI conducted measurement. To improve this condition, the locations of EMI noise sources, modes of conducted EMI noise, their coupling paths and the characteristics of the electromagnetic field are investigated in detail. Various shielding schemes are proposed to reduce the EMI inside the SPS. Through this, the interference between the EMI sources, coupling paths and receivers can be significantly reduced so that the conducted EMI measurement of the SPS can meet the requirements. Finally, the effectiveness of the shielding schemes will be demonstrated by some experimental results and some EMI reduction methods will be suggested.