Electro Optical Terahertz Pulse Reflectometry Research Articles

Emerging Techniques For 2-D/2.5-D/3-D Package Failure Analysis: EOTPR, 3-D X-Ray, and Plasma FIB

Abstract The complexity of sample preparation and deprocessing has risen exponentially with the emergence of 2.5-D and 3D packages. This article provides answers and insights on how to deal with the challenges of increasingly complex semiconductor packages. After identifying pressing issues and potential bottlenecks with state-of-the-art FA flows, the authors present two case studies demonstrating the capabilities of electro-optical terahertz pulse reflectometry (EOTPR), plasma FIB milling, and 3D X-ray imaging. The FA results confirm the potential of all three techniques and indicate that a fully nondestructive integration flow for 3D packages may be achievable with further development and optimization.

Electro Optical Terahertz Pulse Reflectometry, a non destructive technique to localize defects on various type of package

Localizing defects (particularly, dead open and resistive open defects) at package level is becoming a critical challenge for Failure Analysis Laboratories due to package miniaturisation and increased complexity. One of the well-known approaches to address this set of problems within a Device Under Test (DUT) is Time Domain Reflectometry (TDR). The main limitation of this technique is the lack of distance-to-defect accuracy and sensitivity. Electro Optical Terahertz Pulse Reflectometry (EOTPR) overcomes these limitations by using photoconductive terahertz generation and detection technology, resulting in a system with: (i) high measurement bandwidth, (ii) extremely low time base jitter, and (iii) high time base accuracy and range with greater sensitivity. In this paper we present case studies in which EOTPR has been successfully applied to a series of different device types.