Electrical Resistivity Of Copper Research Articles

A model for lattice dynamics of face centred cubic metals

A lattice dynamical model for the face-centred-cubic (FCC) metals has been proposed by incorporating the ion-ion central and angular and the electron-ion interactions through well known theories. The model satisfies the translational invariance and the condition for the internal force equilibrium of the lattice. The application of this model has revealed fairly well the phonon dispersion curves and the temperature variation of Debye-Waller factor and electrical resistivity of copper.

A calculation of the electron–electron scattering contribution to the electrical resistivity of copper

The contribution of electron–electron scattering to the electrical resistivity of copper has been calculated. Parts of the Fermi surface on which the initial and final electronic states contribute most heavily to the resistivity have also been determined. The calculations are based on two plane-wave states for the electrons and a Thomas–Fermi screened Coulomb interaction between electrons. The Fermi surface is approximated with the eight-cone model used in noble metals. The results of the calculations are presented here and compared with calculations and experimental data of other authors.

Electrical resistivity of copper - 5 wt% tin

Electrical resistivity of copper - 5 wt% tin

Effects of neutron radiation on the electrical resistivity of copper at room temperature

Industrial, oxygen-free, high conductivity (OFHC) copper and electrolytic tough-pitch (ETP) copper have been irradiated to a total integrated neutron dose of about 5 × 10 19 n/cm 2 ( E>0.1 MeV) at 40°C. Resistance measurements have been made at 22°C before and after irradiation. The radiation-induced increase in the electrical resistivity at a dose of 1.5 × 10 19 n/cm was ∼ 5% for annealed OFHC and ∼3.5% for annealed ETP coppers, respectively.

Electron-electron scattering in the low-temperature resistivity of the noble metals

Recently observed behavior in the electrical resistivity of copper at temperatures below 8 K and of silver below 5 K is interpreted as arising from electron-electron scattering. Similar behavior is predicted for gold below about 4 K, where data are not yet available. An estimate of the electron-phonon contribution shows that its ${T}^{5}$ asymptote is approached in the regime where electron-electron scattering is important.

Properties of Cu?Nb alloys

1. We investigated the effect of niobium (up to 1.5%) on the mechanical properties, heat resistance, and electrical resistivity of copper. 2. The properties of Cu−Nb alloys do not depend on the heat treatment conditions, which distinguishes the alloys of this system from most of the thermal conducting and electrical conducting alloys used at the present time. 3. With increasing concentrations of niobium the red hardness of the alloys increases continuously and exceeds that of copper by a factor of 2–3. The electrical conductivity decreases slightly. 4. Copper alloys with 0.2–0.75% Nb can be recommended for parts and structures in a wide range of operating temperatures where heat treatment is technically difficult or impossible.

Electrical resistivity of copper after high frequency fatigue (ultrasonic fatigue at 20 kHz)

Electrical resistivity of copper after high frequency fatigue (ultrasonic fatigue at 20 kHz)

Recovery of electrical resistivity of copper after high frequency fatigue (ultrasonic fatigue at 20 kHz)

Recovery of electrical resistivity of copper after high frequency fatigue (ultrasonic fatigue at 20 kHz)

Recovery of Lattice Parameter and Electrical Resistivity in Low-Temperature Neutron-Irradiated Copper

The fast---neutron-irradiation-induced change and subsequent isochronal annealing recovery of the lattice parameter and electrical resistivity of copper were studied. A wire resistivity specimen and single crystal were irradiated together in liquid helium and transferred to a cryostat without warm up. The simultaneous recovery of both properties was measured at 4.2\ifmmode^\circ\else\textdegree\fi{}K following isochronal anneals to temperatures as high as 675\ifmmode^\circ\else\textdegree\fi{}K. The results of the three successful experimental runs were in good agreement. An analysis, based on linear superposition of the effects of the individual defects, is presented as the simplest and most direct approach to determine the migration mechanism as a function of temperature. The most significant and unambiguous conclusion of this analysis is that stage-III recovery in copper (220-280 \ifmmode^\circ\else\textdegree\fi{}K) is due to vacancy migration. Alternative explanations in terms of more complex phenomena appear less probable, but cannot be excluded with certainty.

Temperature dependence of the electrical resistivity of copper below 80 °K

Measurements were made on annealed and highly deformed 99.999% pure copper samples. The best fit of the experimental data was obtained with a formula that takes into account the residual resistivity, ϱr, a temperature-dependent contribution ϱid(T) derived on the basis of the Bloch-Gruneisen formula with corrections for small variation, δθ, of the Debye temperature, θ, with the temperature of measurement, as well as an interference term for the superposition of both scattering processes. Die Widerstandsmessungen wurden an erholten und hochverformten Kupferproben (Reinheit 99,999%) ausgefuhrt. Die Ergebnisse liesen sich am besten darstellen mit Hilfe einer Beziehung, in welcher der Restwiderstand δr, ein temperaturabhangiger Beitrag ϱid(T) unter Verwendung der Bloch-Gruneisen-Formel, geringe mestemperaturabhangige Variationen δθ der Debye-Temperatur θ, sowie ein Interferenzterm fur die Uberlagerung beider Streuanteile berucksichtigt werden.

Variation of the electrical resistivity of copper with thermal fatigue

Variation of the electrical resistivity of copper with thermal fatigue

Recovery of the electrical resistivity of copper, silver and gold after small plastic deformations at − 195°C

Recovery of the electrical resistivity of copper, silver and gold after small plastic deformations at − 195°C

The influence of an elastic stress on the electrical resistance of copper after plastic deformation

Thin wires were plastically deformed at −195°C, after this deformation the electrical resistivity is increased. This increase disappears after recovering at higher temperatures. During isothermal recovery, an elastic stress of about 15 kg/mm 2 was applied to or removed from the wire, causing an extra decrease of the electrical resistance. Thus the change of stress is essential for the decrease of the resistivity. The elastic stress was varied in different ways, sometimes in combination with temperature variations. The results are very sensitive to the details of the experimental method. Mainly pure copper was used, sometimes gold, silver and aluminium. Most of the results can be explained with the following hypotheses: 1. (1) As a result of changing the stress the dislocations bend out, and eliminate some dislocation loops or other configurations, causing a decrease of the electrical resistance. 2. (2) Point defects moving toward the dislocations can pin them. This pinning is dependent on the temperature and on the stress. 3. (3) Point defects moving toward the dislocations can give some dislocation climb, which enables the dislocations once more to take up some loops by bending out, if in the old positions the attainable loops have already been eliminated.

Effects of Transition Metal Solutes on the Electrical Resistivity of Copper and Gold Between 4° and 1200°K

We have determined the solute contribution ρi(T,c) of the solutes Cr, Mn, Fe, Co, and Ni in copper and of the solutes Mn, Fe, and Co in gold over the temperature range 4° to 1200°K and over a wide range of solute concentrations. The parameter ρi(T,c) for a given solute is defined here as the difference ρi(T,c) =ρalloy(T,c)—ρsolvent(T). The temperature dependence of ρi is quite complicated for several of the solutes, in particular, Fe and Co. For example, in an alloy containing 0.05 at.%Fe in copper this quantity ρFe exhibits a minimum at 25°K and a maximum at 65°K. Alloys of Fe in gold exhibit a broad maximum in ρFe at temperatures between 70° and 200°K, depending upon the iron concentration. In all the alloys investigated, except for Ni in copper, ρi decreases with increasing temperature in the region of high temperatures (above about 500°K).

The effect of pressure on the electrical resistance of copper at low temperatures

The resistivity of copper under hydrostatic pressures up to 3000 atm has been measured at temperatures between 4° K and room temperature. Two specimens of commercially pure copper (99⋅98%) and an alloy of 0⋅056 at. % iron in copper were studied, the alloy being chosen because it showed a large resistance minimum. The effect of pressure on the ideal resistivity is in good agreement with Grüneisen’s theory. There were some theoretical reasons for expecting that the alloy would have a large pressure coefficient of resistivity at or below the temperature of the resistance minimum. The pressure coefficient at these temperatures was, however, quite small and similar in value to the pressure coefficients of residual resistivity of the two purer specimens. Both the residual resistivity of the alloy and its pressure coefficient appeared to be strongly dependent on temperature.

The Application of Cable in Cathodic Protection

Abstract The requirements of a suitable metallic conductor in a cathodic protection system are discussed. Particular attention is paid to economic factors and power loss in the selection of suitable conductors and the most satisfactory cable sizes. Data are given to show the relative electrical resistivity of copper, aluminum, iron and lead. The selection of cable insulation and protective coverings in cathodic protection systems is discussed in detail. Data are given to show physical and accelerated aging requirements of polyethylene insulation and polyvinyl chloride sheath compound. Data also are included show the electrical stability of various types of insulation after immersion in tap water, and after immersion in various chemicals. Other topics discussed include mechanical properties of insulation, insulation versus environment, installation techniques and splicing requirements. It was found that a cable construction which makes use of a polyethylene insulation and a polyvinyl chloride sheathing com...

Change of the absolute thermoelectric power and electrical resistivity of copper by cold-working at liquid air and room temperature

Change of the absolute thermoelectric power and electrical resistivity of copper by cold-working at liquid air and room temperature

Change of the absolute thermoelectric power and electrical resistivity of copper by cold-working at liquid air and room temperature

Change of the absolute thermoelectric power and electrical resistivity of copper by cold-working at liquid air and room temperature

Electron transport in copper and dilute alloys at low temperatures. I

The electrical resistance of copper is noteworthy in showing a minimum at very low temperatures (~10°K). This phenomenon has been traced to the presence of very small quantities of certain specific metallic solutes, and a corresponding remarkable variation of thermoelectric power has been observed in these dilute alloys. Detailed experimental studies of a wide range of alloys are presented in this and a companion paper, and the problems involved in preparing such very dilute alloys and interpreting the findings are discussed.

The Effect of Cold Working on the Electrical Resistivity of Copper and Aluminum

The Effect of Cold Working on the Electrical Resistivity of Copper and Aluminum