Electrical Insulation Research Articles

AC ripple on DC voltage: Experimental and theoretical investigation of the impact on accelerated ageing in electrical insulation

AbstractWith the increasing penetration of DC systems into the high voltage and medium voltage power industry, DC voltage is becoming common for distribution/transmission and to supply different typologies of loads. The allowable extent of AC ripple superimposed to DC, and its effect on insulation ageing, is a long‐term discussed topic. The most harmful phenomenon causing extrinsic ageing acceleration and insulation system premature failure is partial discharges (PD); thus, the risk of incepting PD due to AC ripple could become a primary issue for electrical asset equipment reliability. In this work, the impact of AC sinusoidal ripple on insulation system life and reliability is dealt with, considering both intrinsic and extrinsic ageing but focusing on the latter, that is, the PD aspect. Experiments are performed to assess how the jump voltage (due to AC ripple) and the DC component impact on PD activity in terms of amplitude and repetition rate. For the first time, the correlation between the magnitude of jump voltage associated with ripple and PD inception is established, shedding a light on the allowable ripple extent which does not impact significantly on ageing and premature insulation failure. This approach can provide straightforward tools for design specification and ageing inference of insulation systems.

Constructing Heterostructured MWCNT-BN Hybrid Fillers in Electrospun TPU Films to Achieve Superior Thermal Conductivity and Electrical Insulation Properties.

The development of thermally conductive polymer/boron nitride (BN) composites with excellent electrically insulating properties is urgently demanded for electronic devices. However, the method of constructing an efficient thermally conductive network is still challenging. In the present work, heterostructured multi-walled carbon nanotube-boron nitride (MWCNT-BN) hybrids were easily prepared using an electrostatic self-assembly method. The thermally conductive network of the MWCNT-BN in the thermoplastic polyurethane (TPU) matrix was achieved by the electrospinning and stack-molding process. As a result, the in-plane thermal conductivity of TPU composite films reached 7.28 W m-1 K-1, an increase of 959.4% compared to pure TPU films. In addition, the Foygel model showed that the MWCNT-BN hybrid filler could largely decrease thermal resistance compared to that of BN filler and further reduce phonon scattering. Finally, the excellent electrically insulating properties (about 1012 Ω·cm) and superior flexibility of composite film make it a promising material in electronic equipment. This work offers a new idea for designing BN-based hybrids, which have broad prospects in preparing thermally conductive composites for further practical thermal management fields.

Optimizing the Dielectric and Mechanical Performance of 3D-Printed Cellulose-Based Biocomposites and Bionanocomposites through Factorial Design for Electrical Insulation Application.

Materials for low-permittivity and electrical insulation applications need to be re-engineered to achieve sustainable development. To address this challenge, the proposed study focused on the dielectric and mechanical optimization of 3D-printed cellulose-based composites for electrical insulation applications. Two different fillers, microcrystalline cellulose (MCC) and nanocrystalline cellulose (NCC), were used to create biocomposites and bionanocomposites, respectively, blended into a polylactic acid (PLA) matrix. The effects of infill ratio, printing temperature, and filler content on dielectric and mechanical properties were measured using an incomplete L9 (3^3) factorial design. The findings showed that the infill ratio was the most significant factor influencing the properties tested, directly attributable to the increase in material availability for polarization and mechanical performance. The second most influential factor was the filler content, increasing the polarity of the tested composites and decreasing the toughness of the biocomposites and bionanocomposites. Finally, printing temperature had no significant effect. Results for the biocomposites at a 50% infill ratio, 200 °C printing temperature, and a weight content of MCC of 15% gave a 60% higher tensile-mode stiffness than neat PLA printed under the same conditions, while exhibiting lower dielectric properties than neat PLA printed with a 100% infill ratio. These results pave the way for new lightweight materials for electrical insulation.

Polyphosphazene with excellent superhydrophobicity, electrical insulation, flame-retardancy, and mechanical durability for composite insulators

Composite insulator is an important component of the power system which has high requirements for insulating properties, hydrophobicity, long-term reliability, and safety. Aiming to improve the comprehensive performance of composite insulators, we propose a novel composite based on polyphosphazene matrix and inorganic fillers including h-BN, SiO2 and aramid pulp (AF-p). By the synergistic effect of the optimized chemical structure of polyphosphazene and modification by multi-scale hydrophobic electrical insulation fillers, the poly(difluoroalkoxy)phosphazenes (PDFP) composite presents enhanced hydrophobicity with the static water contact angle (WCA) up to 154° and rolling angle (RA) as low as 8°. Benefiting from the multiscale roughness constructed by multi-fillers, the PDFP composite exhibits superior mechanical durability. The contact angle of the sample still exceeds 150° after abrasion by sandpaper (800#) for 1000 cm. Meanwhile, with the addition of hybrid insulation fillers, the Weibull breakdown strength of PDFP/30h-BN/10SiO2-200/6AF-p is improved by 76 % compared to PDFP. Besides, the unique elemental composition of PDFP endows the PDFP composite with excellent flame retardancy with a 55 % limiting oxygen index and V-0 of the UL-94 grade, which guarantees safety for insulator applications. The results confirm the great potential of polyphosphazene for composite insulators.

Enhancement of insulation properties of LLDPE by PPy-functionalized PS-NPs

The strategy of functionalized PS-NPs via PPy (PPy@PS-NPs) forming heterogeneous interface composition is highly efficient in increasing the insulation properties of linear low-density polyethylene (LLDPE). The morphology results show that PPy@PS-NPs are monodispersed in the LLDPE matrix after melting blend, which exhibits unparalleled engineering application value. The electrical insulation results show that PPy@PS-NPs introduced into the LLDPE matrix can reduce its DC electrical conductivity, enhance DC breakdown strength, and inhibit space charge accumulation. When the PPy@PS-NPs concentration is 0.5 wt%, the DC breakdown strength is 35.3 % higher than that of LLDPE. Mechanism research indicates that the depths of carrier traps are decreased due to high electron affinity caused by the introduction of PPy@PS-NPs, but the trap density is increased. The reported strategy of using functionalized polymer nanoparticles to improve the polymer insulation property provides new insights for developing future high-insulation materials and other functional materials based on functionalized polymer nanofillers.

Performance Enhancement of Tricalcium Phosphate Film for Bioelectronics with Bio‐Friendly Supercritical Fluids Desorption Technology

AbstractIn the rapidly advancing field of bioelectronics, searching for materials that combine superior insulating properties with biocompatibility is crucial, especially for implantable electronic devices. Traditional insulators in mature CMOS processes, though effective, lack biocompatibility, necessitating the exploration of alternative materials. This study introduces tricalcium phosphate (Ca3(PO4)2), a primary component of human bones, and teeth, as an insulating layer material for the first time. High‐quality, thickness‐controlled Ca3(PO4)2 films are fabricated using magnetron sputtering, and their electrical insulation, stability, and optical transparency have been thoroughly evaluated. To further optimize the insulation performance of Ca3(PO4)2, particularly against residual impurities, and fabrication‐induced defects, a bio‐friendly low‐temperature supercritical fluid desorption (LTSCF‐Desorption) technique is developed, effectively removing impurities, repairing defects, and improving the interface states. After LTSCF‐Desorption treatment, the leakage current of the Ca3(PO4)2 films is reduced by 30%, along with the enhancements of the films' stability and transmittance. Further material analysis clarified the internal mechanisms behind the improvement of the Ca3(PO4)2 films. Overall, this study not only broadens the application scenarios of Ca3(PO4)2 in bioelectronics but also develops a bio‐friendly supercritical desorption technique, providing a new pathway for optimizing the performance of bioelectronic devices and materials.

Polypropylene nanocomposite film with enhanced energy storage performance via a continuous preparation

Dielectric polymers have been extensively employed in renewable energy conversion, hybrid electric vehicle, and high voltage direct current transmission systems, owing to their excellent electrical insulation, processability, and self-healing capability. However, the challenge lies in their relatively low dielectric constant (εr) and limited discharge energy density (Ue), which hinder the advancement of integrated power modules. Despite numerous efforts aimed at enhancing Ue, the fabrication of scalable dielectric film with both enhanced Ue and high charge–discharge efficiency (η) remains a major obstacle. Herein, the polypropylene-based films with BaTiO3@PP-g-MAH (BTO@PP-g-MAH) core–shell nanoparticles are prepared through a continuous melt extrusion process. The resulting nanocomposite film, incorporated with 5 wt% BTO@PP-g-MAH, exhibits an impressive Ue of 5.15 J cm−3 and achieves a high η of 93.2 % at 433 MV m−1, along with excellent cycle dielectric stability. Such enhancements in εr and Ue are ascribed to the improved interfacial polarization facilitated by BaTiO3 nanoparticles and the enhanced interface binding achieved through the PP-g-MAH shell layers. Furthermore, the enhancement of electric breakdown strength (Eb) is comprehensively investigated based on electrical breakdown mechanism and electromechanical breakdown model. This study demonstrates a novel strategy to prepare nanocomposite dielectric films that are compatible with commercial capacitor fabrication process.

Development of copper-boron nitride core-shell structured fillers and surface treatment for thermally conductive composites

Core-shell structured copper-boron nitride (Cu@BN) spherical fillers were synthesized to fabricate thermally conductive composites. To enhance the interaction between the fillers and the matrix, polysilazane (PSZ) was coated on the surface of the filler. The resultant composite exhibited remarkable characteristics, including a substantial tensile strength of 32.36 MPa, excellent electrical insulation properties, and impressive thermal conductivity of 3.47 W/mK. When applied in a light-emitting diode (LED) application, the composite effectively managed heat, reducing the operating temperature by 34 °C. The epoxy/PSZ-Cu@BN composites hold great promise for improving thermal management in electronic devices.

Enhanced electrical insulation properties of 2-isopropenyl-2-oxazoline grafted polypropylene for high voltage direct current power cables

Polymers have been extensively used for high voltage direct current transmission systems as insulation power cables. Space charge accumulation consistently remains the primary factor contributing to the degradation of the electrical insulation properties of polymers. Grafting modification is a valid approach for suppressing the injection of space charges and free electrons by inducing deep traps. In this paper, the modified polypropylene grafted the group with low ionization energy is reported. The deep traps are revealed by the thermally stimulated depolarization current experiment and the band structure as well as the electrostatic potential by density functional theory simulation. The method with the innovative hybrid functional and basis set is adopted to establish the average local ionization distribution of the grafting group, thus confirming its strong electrophilicity. Furthermore, the modified polypropylene has been proved to obtain higher breakdown strength and operational stability by experiments. This work can provide insights for the design and selection of power cables with excellent electrical insulation properties.

Rapid repair and degradation: A study of high-performance recyclable vitrimer epoxy resin based on disulfide bonds

Petroleum-based epoxy resin is commonly used in electrical equipment due to its outstanding performance and affordability. However, its non-melting characteristics present challenges for recycling, leading to significant resource waste and environmental pollution. To address this issue, this study prepared and synthesized a kind of vitrimer epoxy resin polymer material based on disulfide bonds with 2,2′-Diaminodiphenyl disulphide as the curing agent. The research investigated the impact of the curing agent ratio on the resin's structure and properties. The resin was mechanically recovered through hot pressing at high temperature and pressure, and its chemical degradation and recovery were achieved via the reduction reaction of the thiol and disulfide bond. The findings revealed that a curing agent to epoxy group material ratio of 0.75 improved the resin system's electrothermal properties. The electrical insulation property retention rate after hot pressing recovery reached 95 %, with a mechanical property retention rate of 85 %. The disulfide bonds can be reoxidized and crosslinked to realize the recovery and reuse of vitrimer resin degradation solution. Vitrimer epoxy resin based on disulfide bonds is a significant way to realize the environmental protection of epoxy electrical equipment.

Simultaneous improvements in energy density and thermal conductivity of PAN polymer nanocomposites enabled by core-shell structure BZCT@BNNS nanofibers

If the heat generated by electronic devices in high-power applications cannot be dissipated in a timely manner, it will not only affect the use of the equipment but also reduce its service life. Therefore, there is an urgent need to develop thin films of dielectric nanocomposites with high thermal conductivity, high energy storage, and excellent flexibility and electrical insulation performance. In this study, we reported the successful preparation of BZCT nanofibers (BZCT NFs) and core-shell structures BZCT@BNNS nanofibers using electrospinning and coaxial electrospinning techniques, respectively, and there were used to composite with polyacrylonitrile (PAN) polymer matrix to prepare BZCT NFs/PAN and BZCT@BNNS/PAN dielectric nanocomposites thin film. Research has found that when the shell thickness of BNNS is 15 nm and BZCT@BNNS (15 nm) volume fraction is 20 vol%, the comprehensive performance of the dielectric nanocomposites is the best, with thermal conductivity and energy storage performance of 3.36 W m−1K−1 and 12.23 J/cm3, respectively. Therefore, the nanocomposites thin film can be used as a potential high-performance dielectric material for thermal management applications in high-power density electronic devices.

Diamond-Reinforced Al(H2PO4)3@Epoxy Hybrid Thermal Adhesive With Ultra-High Thermal Conductivity and Bonding Strength.

The miniaturization, integration, and increased power of electronic devices have exacerbated serious heat dissipation issues. Thermally conductive adhesives, which effectively transfer heat and firmly bond components, are critical for addressing these challenges. This paper innovatively proposed a composite comprising inorganic phosphate/alumina as a matrix and diamond as filler. The composite achieved an isotropic thermal conductivity (TC) of up to 18.96Wm-1K-1, significantly surpassing existing reports while maintaining electrical insulation. First-principles calculations and experimental tests confirmed that the high TC of phosphate and excellent interface contact ensured efficient heat transfer. To optimize bonding performance, a modified-diamond/Al(H2PO4)3@epoxy hybrid composite is subsequently developed using an organic modification method. The unique hybrid structure, combining inorganic thermal pathways and an organic adhesive network, enabled the hybrid composite to simultaneously possess a high TC (3.23Wm-1K-1) and strong adhesion (14.35MPa). Compared to previous reports, the comprehensive performance of this hybrid thermally conductive adhesive is exceptionally remarkable. The superior heat dissipation capability of the hybrid thermal adhesive is demonstrated in chip cooling scenarios. This organic/inorganic hybrid approach offered a new direction for obtaining advanced thermal interface materials, demonstrating significant application potential in chip soldering, packaging, and heat dissipation.

Effect of brazing process on microstructure evolution and mechanical properties of Ti6Al4V/ZrO2 joints after laser surface treatment

Ti6Al4V alloy and ZrO2 ceramic have similar application fields and complementary properties. Brazing connections can broaden the application range. When using sealing glass with good air tightness, good electrical insulation, and low connection temperature to connect, the solder is difficult to wet on the metal surface. The traditional method is to oxidize the surface of the alloy at a high temperature, but the film is not uniform and the treatment time is long. In this study, nanosecond laser surface treatment was used as a prewelding pretreatment method to form a micro-nano structure on the surface and perform oxidation treatment. It is particularly important to select the brazing process. After the laser parameters and processing times were determined, the effects of different welding temperatures and holding times on the properties of the joints were compared, and it was found that there were regular changes. Finally, it is concluded that the maximum shear strength is 46 MPa when the welding temperature is 650 °C and the holding time is 30 min. Under this process, the performance of the joint significantly improved under the dual effects of mechanical bonding and metallurgical bonding. This study provides a new idea for the connection of metal and ceramic and has reference value for the selection of the brazing process.

Amorphous Boron Nitride Nanosheet‐Based Solid State Electrolytes with High Ionic Conductivity

AbstractAmorphous boron nitride nanosheets, with natural electrical insulation, outstanding chemical stability and mechanical properties, are introduced as a matrix to be incorporated with lithium bis (trifluoromethanesulfonyl) imide (LiTFSI) and polymer polyvinylidene fluoride‐hexafluoropropylene copolymer (PVDF‐HFP), for constructing a novel composite solid‐state electrolyte by a simple solution‐casting method. Amorphous boron nitride nanosheets are produced via a combination method of ball milling and pure water exfoliation. The obtained composite solid‐state electrolyte containing 40 % (mass fraction) PVDF‐HFP shows a high lithium ion conductivity (1.936×10−3 S cm−1) and lithium ion transference number (0.47), and a wide electrochemical stability window (5 V) at room temperature. The LiFePO4/Li based all solid‐state battery, consisting of the composite solid electrolyte (40 % PVDF‐HFP), delivers a capacity of 128.1 mAh g−1, a Coulombic efficiency of 99.79 % after 500 cycles and a capacity retention rate of 94.5 % at 1.0 C and 25 °C. The composite solid electrolyte (40 % PVDF‐HFP) can maintain flat and stable stripping/plating plateaus for over 800 hours in symmetrical cells. The amorphous boron nitride nanosheets with high lithium ion conductivity are employed to construct solid‐state electrolytes, which is important significant for the development of high energy density, high safety, and long cycle life all‐solid‐state lithium‐ion batteries.

High thermal conductivity and low dielectric loss of three-dimensional boron nitride nanosheets/epoxy composites

Electronic power devices are moving towards high frequency, high integration, and high power, which urgently needs to develop high thermal conductive encapsulating insulation materials to improve the heat dissipation of electronic devices. Herein, we propose to modify the commercialized encapsulating materials of epoxy resin (EP) by incorporating three-dimensional hydroxylated boron nitride nanosheets (3D-BNNSs). The cryogel and vacuum freeze-drying techniques are employed to prepare the 3D-BNNSs using agarose. The results show that the constructed high thermal conductive structure of 3D-BNNSs can effectively enhance the thermal conductivity of EP and reduce the interfacial thermal resistance between BNNSs fillers. The thermal conductivity of 3D-BNNSs/EP composites with 33.03 wt% BNNSs reach 2.54 W/(m·K), which is 13.11 times higher than that of EP (0.18 W/(m·K)). Meanwhile, the resultant composites remain outstanding electrical insulation and dielectric properties. Because agarose contains numerous hydroxyl groups that can form hydrogen bonds with the hydroxyl groups on the surface-functionalized BNNSs, hydrogen bonding can lead to strong intermolecular interactions, which is conductive to accelarate phonon transport. Additionally, agarose can cross-link with the molecular chains of epoxy, impeding the movement of molecular chain segments and resulting in composites with low dielectric loss at high frequencies. This study demonstrates that the 3D-BNNSs/EP composites have great potential for application in thermal management of electronic components.

Metal ion-crosslinked thermoconductive sugar-functionalized graphene fluoride-based cellulose papers with enhanced mechanical properties and electrical insulation

Thermally conductive papers with electrical insulation and mechanical robustness are essential for efficient thermal management in modern electronics. In this study, we introduced a metal ion-assisted interfacial crosslinking strategy to strengthen sugar-functionalized graphene fluoride (SGF) and cellulose nanofibers (CNF) by hydrogen bonding and metal ion crosslinking that leads to simultaneous enhancements in thermal conductivity and mechanical properties. The facile sugar-assisted ball-milling exfoliation method was developed to achieve the exfoliation of graphite fluoride and hydroxyl group functionalization on the surface of graphene fluoride. Thanks to the good dispersibility of the SGF sheets in water, the flexible SGF/CNF composite papers with hydrogen bonding were prepared via vacuum-assisted filtration. We introduced hydrogen bonding and metal ion crosslinking into SGF/CNF papers to obtain densely packed composite papers. Ca2+ or Al3+ ion-crosslinked SGF/ CNF papers exhibited superior thermal and mechanical properties owing to hydrogen bonding and metal ion crosslinking. SGF/CNF-Ca2+ and SGF/CNF-Al3+ papers at 50 wt% of SGF yield in-plane thermal conductivities of 72.93 and 75.02 W m–1 K–1, and tensile strengths of 121.5 and 135.7 MPa, respectively. A thermal percolation value was observed at 12.6 vol% of SGF filler content. In addition, the SGF/CNF papers exhibited electrical insulation properties. These remarkable characteristics of the metal ion-crosslinked SGF/CNF papers are attributed to the densely packed structures caused by the strong interfacial interactions from hydrogen bonding as well as metal ion-crosslinking that could promote phonon transport. High-performance metal ion-crosslinked SGF/CNF papers with these fascinating advantages offer great potential for the thermal management of flexible electronics.

All-natural, thermally conductive, flame-retardant electrical insulating lignocellulose-mica composite film fabricated via in-situ mineralization

Miniaturized, integrated, and functional electronic devices generate a large amount of heat accumulation during operation, which significantly affects the reliability, durability, and safety of electronic devices. In severe cases, it may even lead to fires. Therefore, the development of insulation composite materials with thermal conductivity and flame-retardant properties is particularly important. In this study, we propose an in-situ mineralization strategy to prepare insulation composite materials with thermal conductivity and flame-retardant properties. By dissolving and preparing a gel film, Al3+ and Zn2+ retained inside the lignocellulose are in situ mineralized to form Al(OH)3 and ZnO, and introducing inorganic blocks with high insulation performance (industrial waste mica tailings and synthetic mica). The prepared film has excellent tensile strength (117.4 MPa), low dielectric loss, high dielectric strength (83.8 kV mm−1), high insulation resistance, four times higher thermal conductivity than the unmineralized film, and excellent flame-retardant properties. Meanwhile, the environmental impact of the composite film is much lower than that of petrochemical-based plastic films and can easily degrade under natural conditions within 32 days. It is a composite material that meets the standards of the new electrical insulation field, and the in-situ mineralization strategy can also provide ideas for the preparation of high-performance lignocellulose-based materials.

Nano-BN and nano-cellulose synergistically enhanced the mechanical, thermal, and insulating properties of cellulose insulating paper

The complex and demanding environments of high humidity, heat, altitude, and intricate electric fields necessitate higher standards for the mechanical, thermal stability, and electric insulation properties of insulating paper. However, a single nanomaterial alone struggles to enhance overall performance. Hence, we propose employing two-phase nanomaterials with distinct dimensions to synergistically enhance the performance of cellulose insulation paper. Accordingly, “simulation design directly guided experimental research” was utilized in constructing nano-BN/nanocellulose/cellulose (nano-BN/NFC/cellulose) models through molecular dynamics simulation, and its mechanical parameters, dielectric properties, thermal stability, and so on were simulated and calculated. Based on simulation results, suitable proportions of nano-BN/NFC/cellulose insulating paper were prepared. Nano-BN and NFC synergistically enhance the mechanical properties of insulating paper. The nano-BN, CNF, and cellulose are arranged layer by layer under the action of gravity, allowing the fillers to overlap diagonally along the plane, synergistically forming a thermally conductive network conducive to heat transfer. Additionally, a strong interfacial effect is formed between the three-phase materials, reducing the overall structure's polarization effect and charge accumulation, and synergistically enhancing electrical insulation performance. The 12%nano-BN/NFC/cellulose (P12) exhibits optimal overall performance and is expected to be used in power equipment operating in special environments with high humidity and heat.

Covalent bond-assisted continuous interface structure for high thermal conductive polyimide composite films

Polyimide (PI) is widely used in electronic, electrical and communication fields because of its outstanding mechanical properties, electrical insulation and thermal stability. However, the lower thermal conductivity limits their application. Here, PI composite films with high thermal conductivity are obtained by utilizing reactive groups on the carbon nitride nanosheets (CNNS) surface to form covalent bond with PI matrix. The thermal conductivity of CNNS/PI composite films can reach 5.84 W∙m−1∙K−1, which is about 10 times higher than that of pure PI (0.56 W∙m−1∙K−1). This is attributed to the covalent bond between CNNS and PI matrix acting as a “thermal bridge” to connect the discontinuities at the interface, thereby reducing the interfacial thermal resistance between CNNS and PI. The heat transfer mechanism of composite film is further revealed by finite element analysis. This work provides a viable solution to improve the thermal conductivity of PI, allowing for a wide range of potential applications for PI in electronic devices.

A processable high thermal conductivity epoxy composites with multi-scale particles for high-frequency electrical insulation

The solid-state transformer (SST) in the renewable energy grid is developing in the way of high voltage and high frequency, which often results in a sharp increase in heat production of the equipment and accelerates the failure of the insulating materials. Epoxy resin (EPR) is commonly used as an insulation material for SST due to its excellent electrical insulating properties, processing performance (viscosity), and low price. However, the thermal conductivity of EPR is only about 0.2 W/(m·K), which leads to poor insulating performance under high frequency and temperature. To enhance thermal conductivity, a substantial quantity of highly thermally conductive particles is incorporated into the EPR, accompanied by a severe increase in electrical insulation defects and viscosity. This study utilized a multi-scale particle-filled approach to investigate the thermal conductivity, processing characteristics, and high-frequency electrical insulation performance of composites. The composite, filled with 25 µm BN and 5 µm SiO2 particles, enhances thermal conductivity to 0.732 W/(m·K) and demonstrates superior electrical insulating properties at both 10 kHz and 20 kHz bipolar square waves (with an increase of 131.76% and 163.97% in relative EPR, respectively), as well as good processability. Meanwhile, it is found that the dielectric loss, thermal conductivity, and electric field distribution of the composite are the main factors affecting the electrical insulating properties from 10 to 20 kHz under high voltage.Graphical