Electrical Insulation Conference Research Articles

A review of electrical winding failures in wind turbine generators

Since its commercial beginnings in the early 1990s, wind energy has grown to be a significant factor in the electrical generation industry, representing 9.6% of the installed capacity in Europe [1] and nearing 3.5% in North America [2]. Almost 25% of the US-based turbines are in Texas, supplying 8% of that state's annual energy requirements and peaking at almost 25% of grid demand on occasion [3]. As with any new industry, there are learning curves in nearly all aspects, but the industry is maturing and coming to terms with some of the technical shortcomings of the early generations of turbines. Although most drive train issues are related to gearbox component failures, failure of and damage to the generators are the second most common cause of lost production. As reported by George Gao and William Chen at the Electrical Insulation Conference in 2009 [4], several common failure modes have been identified, many of which can be traced to identifiable root causes. However, many failures remain difficult to trace because minor failures can lead to catastrophic electrical failures not directly related to the root cause [5]. Understanding the types of failures and how often they might occur in a fleet of turbines is instrumental to developing a proper maintenance procedure and testing regimen. By reviewing the failures of more than 1200 generators, we have been able to isolate the failures of electrical materials from the pure mechanical failures. Here, we address their occurrences and present some general suggestions for both the generator design engineers and the operating companies responsible for maintaining the wind turbine performance.

Call for papers - 12th International Electrical Insulation Conference (INSUCON)

Call for papers - 12th International Electrical Insulation Conference (INSUCON)

EIC volunteer profile

A 53-year career, from lab technician at Armstrong Rubber Co. to president and owner of Hilec Sleeving, makes Don Hubert highly qualified to be a member of the Electrical Insulation Conference Board of Governors.

EIC call for papers 2011 Electrical Insulation Conference

EIC call for papers 2011 Electrical Insulation Conference

11th international electrical insulation conference - inside cover

11th international electrical insulation conference - inside cover

11th International electrical insulation conference (INSUCON) in birmingham, UK, in May 2009

11th International electrical insulation conference (INSUCON) in birmingham, UK, in May 2009

The 2007 Electrical Insulation Conference and Electrical Manufacturing Expo [EIC News

The 2007 Electrical Insulation Conference and Electrical Manufacturing Expo [EIC News

EIC News [THE 2007 Electrical Insulation Conference and Electrical Manufacturing Expo are taking place October 22-24

EIC News [THE 2007 Electrical Insulation Conference and Electrical Manufacturing Expo are taking place October 22-24

EIC Call for papers Electrical Insulation Conference 2007

EIC Call for papers Electrical Insulation Conference 2007

G. Harold Miller [EIC Volunteer Profile

Presents a professional and personal profile of G. Harold Miller, a long-time contributor to the Electrical Insulation Conference.

EIC Call for Papers - Electrical Insulation Conference 2007

EIC Call for Papers - Electrical Insulation Conference 2007

The Electrical Insulation Association is holding its 10th International Electrical Insulation Conference

The Electrical Insulation Association is holding its 10th International Electrical Insulation Conference

The Electrical Insulation Association is holding its 10th International Electrical Insulation Conference (INSUCON)

The Electrical Insulation Association is holding its 10th International Electrical Insulation Conference (INSUCON)

INSUCON 10th International Electrical Insulation Conference May 2006

INSUCON 10th International Electrical Insulation Conference May 2006

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

Generally, adhesive materials can be cured in a short time under high curing temperature. High curing temperature usually leads to an increase in cross-link density and a homologous increase in heat resistance. Nevertheless, curing process under high temperature problems can occur such as the inclination for the adhesive materials to shrinkage, cracks, voids and it would probably lower the dielectric properties. UV curing of anisotropic conductive adhesives (ACAs) offers several advantages over the conventional epoxy resin, including rapid cure, little to no emission of volatile organic compounds and without affecting other components in the assembly [Pataki, W. S., 1997, “Optimization of Free-Radical Initiation Reactions in the Electrical Industry,” Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference Proceedings, pp. 745–751]. Based on the aforementioned advantages, it is worth investigating the bonding properties at different curing conditions. In this work, a new type of UV curable ACA for chip-on-flex application is presented. The adhesive bonds of the chip-on-flex application are cured at different cure cycles within a range of UV frequencies. Cure cycles in this work were the different periods of time that were needed to cure the ACAs under different UV light intensities. Fourier transform infrared spectroscopy with attenuated total internal reflection was used to investigate the curing degree of the ACAs at different cure cycles. The result shows that the longer the curing time and the larger the UV intensity, the higher the curing degree can be obtained. Furthermore, the curing time in the UV curable ACA was much shorter than that of the conventional thermal curable ACAs. Shear test was done to find out the shear strength of the bonding. Finally, after shear test, scanning electron microscope was used to investigate the fracture mode of the chip-on-flex application at different curing cycles.

Electrical Insulation Conference

Electrical Insulation Conference

Electrical Insulation Conference

Electrical Insulation Conference

History of the Electrical Insulation Conference

This Electrical Insulation Conference (EIC) history gives a wide-ranging documentation of the EIC, from its inception in 1958 to the present. The EIC's inception was driven by advances in polymer technology. The EIC awards are outlined as is co-sponsorship of the conference.

History of the Eectrical Insulation Conference

The Electrical Insulation Conference (EIC) Was organized in 1958. Four conferences were held before the establishment of the IEEE. Starting with the fifth conference in 1963, IEEE became a co-sponsor for this conference. The history of the various awards and recognitions sponsored by the EIC are listed. Efforts at expanding the scope of the technical activities and the interactions with related groups are discussed.

More than 3,000 engineers expected to attend electrical insulation conference

More than 3,000 engineers expected to attend electrical insulation conference