Efficient Material Removal Research Articles

Performance analysis of wire-electrochemical discharge cutting of glass material

The present study investigated the feasibility of micro-cutting in glass material by using Electrochemical Discharge Machining (ECDM) Process. Glass possesses outstanding properties that make it a versatile with widely used in a diverse range of applications. Because of its tendency to fracture brittle during machining, glass is typically processed in its liquid or viscous state to manufacture precise and high-quality parts. Machining glass with good dimensional accuracy is a challenging task due to its fragile nature. Therefore, researchers have recognized the very appropriate technique for machining glasses with precision. The Wire-Electrochemical Discharge Machining (WECDM) has been identified as the most economical and efficient technique for fabricating micro slits in thin glass samples. In the present work, an in-house setup for WECDM was developed and the feasibility of the developed configuration was examined. Two different thicknesses of glass specimen have been considered for experimentation for checking the quality of cut and it is found that thinner specimen possesses good quality cut. The regression model has been developed to find a relationship between input and response parameters. The developed regression model was reasonably well fitted with the observed values where applied voltage 55V, 15% by wt. electrolyte concentration and 70% duty cycle were the most influencing parametric combinations among others. Further mixed electrolytes have shown excellent performance up to a certain concentration in terms of Material Removal Rate (MRR). This study reveals that optimal capillary action, influenced by surface tension and electrolyte concentration, is crucial for consistent sparking and efficient material removal in WECDM.

Rapid and environmentally friendly reconstruction of airport runways under combined laser and liquid energy fields: Ushering a new era of low-carbon and efficient rubber removal in the aviation industry

When the aircraft takes off or lands, the tread rubber melts and adheres to the airport runway and its embedded ground lights, forming black pavement rubber marks, affecting the smoothness of the pavement, reducing the lighting degree and friction coefficient of the pavement, and directly affecting the safety of the aircraft take-off and landing. There are many shortcomings in the standard rubber removal methods. The multi-energy field composite laser cleaning technology comprehensively utilizes the laser field and auxiliary hydrodynamic field. It leverages the high-efficiency advantages of laser processing and avoids the shortcomings of its thermal energy surplus, achieving efficient, accurate, and green material removal. Based on this, this article presents for the first time the composite energy-field laser cleaning process mechanism and related performance of rubber mud layer from the surface of cement/asphalt runway and embedded grounding light cover (aluminum alloy)/light window (tempered glass). Pulse laser single energy-field cleaning is suitable for removing rubber marks from cement runways, grounding lamp covers, and light window surfaces. The cleaning mechanism is divided into two types based on the substrate: ablation and thermal stress peeling. Composite energy-field laser cleaning is suitable for removing rubber marks from asphalt runway surfaces, and the phase explosion of the liquid film is the cleaning mechanism. Under appropriate process parameters, laser cleaning can improve the runway's skid resistance, enhance the grounding light cover's corrosion resistance, and increase the grounding light window's transparency. This study can provide a reference for the laser cleaning behavior of different materials and solve the problem of rubber removal on international civil aviation airport pavement, promoting the construction of "safe, green, and smart" airports.

Soft material drilling: A thermo-mechanical analysis of polyurethane foam for biomimetic bone scaffolds and optimization of process parameters using Taguchi method

Drilling is a widely employed technique in machining processes, crucial for efficient material removal. However, when applied to living tissues, its invasiveness must be carefully considered. This study investigates drilling processes on polyurethane foam blocks mimicking human bone mechanical properties. Various drill bit types (118° twist, 135° twist, spherical, and conical), drilling speeds (1000–1600 rpm), and feed rates (20–80 mm/min) were examined to assess temperature elevation during drilling. The Taguchi method facilitated systematic experiment design and optimization. Signal-to-noise (S/N) ratio and analysis of variance (ANOVA) identified significant drilling parameters affecting temperature rise. Validation was conducted through confirmation testing. Results indicate that standard twist drill bits with smaller point angles, lower drilling speeds, and higher feed rates effectively minimize temperature elevation during drilling.

Generation mechanism of optical surface in ultra-precision cutting polycrystalline zinc selenide

Despite having an excellent infrared optical property, efficient material removal of zinc selenide (ZnSe) is yet to be realized and its defect generation mechanisms during ultra-precision cutting are not fully elucidated. In this study, ultra-precision cutting experiments on polycrystalline ZnSe were conducted by considering various cutting parameters and utilising surface topography, chip morphology, cutting force, and X-ray diffraction data to investigate its surface generation mechanisms, which were further augmented by molecular dynamics simulations to analyse the generation and suppression of surface defects. The results revealed the presence of irregular microstructures on the surface of polycrystalline ZnSe, arising from variations in material rebound owing to differing grain orientations, as well as micron-sized craters located at grain boundaries and submicron-sized pits within individual grains. Increasing the cutting speed facilitated instantaneous grain fractures, thus preventing grain peeling and effectively suppressing the generation of micron-sized craters and material rebound. Although the use of a negative rake angle on the tool suppressed the generation of micron-sized craters, it introduced a proliferation of burrs that was detrimental to the surface finish. These findings provide valuable insights for optimising the ultra-precision machining process and enhancing the surface quality of brittle polycrystalline ZnSe.

Experiments of Main Parameters Affecting the Erosive Behavior of Self-Excited Oscillating Abrasive Water Jets: Length of Self-Oscillation Chamber, Jet Pressure, Abrasive Fluid Velocity, and Abrasive Grain Size.

To enhance the erosion efficiency in traditional abrasive water jet processing, an abrasive water jet processing method based on self-excited fluid oscillation is proposed. Traditional abrasive water jet methods suffer from reduced jet kinetic energy due to the presence of a stagnation layer, which hinders efficient material removal. By integrating a self-oscillation chamber into the conventional abrasive water jet nozzle, the continuous jet is transformed into a pulsed jet, thereby increasing the jet velocity and enhancing the kinetic energy of the process. This modification aims to improve material removal efficiency. Using Ansys Fluent, we simulated the material removal efficiency on workpiece surfaces with varying lengths of self-oscillation chambers. The simulation results reveal that the optimal length of the self-oscillation chamber for maximum erosion is 4 mm. SiC materials were used to evaluate the impact of self-oscillation chamber length (L), jet pressure (P), abrasive flow rate (M), and abrasive grain size (D) on erosion. Experimental results show that the self-oscillation chamber increases erosion depth by 33 μm. The maximum erosion depths recorded were 167 μm when L = 4 mm, 223 μm when P = 16 MPa, 193 μm when M = 80 g/min, and 268 μm when D = 2000 μm. Overall, the self-excited oscillation effect enhances the erosion efficiency of the waterjet by 14%. This study further elucidates the factors influencing erosion behaviors in oscillating abrasive water jet processing.

A new laser-induced plasma electrolyte jet machining method: Efficient material removal mechanism and synergistic effects

Laser electrolytic hybrid machining methods still present a more significant challenge regarding material removal rates due to the high energy loss of the laser in the electrolyte column and the low conductivity electrolyte column between the electrodes. In this paper, a laser-induced plasma electrolyte jet machining method is proposed for the first time to overcome the above problems. Specifically, the short propagation distance of the laser beam in the electrolyte column in the laser-induced plasma electrolyte jet machining method reduces the laser energy loss. In addition, a plasma is formed between the cathode and anode to reduce the ohmic voltage drop between the electrodes. Compared to conventional laser-electrolytic hybrid machining, the introduction of plasma into electrolyte jet machining leads to a significant difference in machining performance. The evolution of laser-induced plasma channels and the enhancement of plasma shocks under the jet liquid film are demonstrated. The material removal mechanism and laser-induced plasma electrolyte jet machining characteristics are comprehensively investigated. The grooves were finally machined using the proposed laser-induced plasma electrolyte jet machining method, and a material removal rate of 2.23 mm3/min was obtained. This study significantly increased the material removal rates of the laser electrolytic hybrid machining technique.

Damage evolution and plastic deformation mechanism of passivation layer during shear rheological polishing of polycrystalline tungsten

Aiming at the problems of low processing efficiency and uneven material removal during shear rheological polishing (SRP) of polycrystalline tungsten, this paper introduces the Fenton-like reaction between H2O2 and Cu2+ to enhance the chemical effect on material removal. Passivation behavior and removal mechanisms were investigated using electrochemical tests, scanning electron microscopy, atomic force microscopy, and other characterization methods. Results show that the Fenton-like reaction exhibits excellent activity under the combined action of H2O2 and Cu(NO3)2, obtaining a satisfactory material removal rate of 702.22 Å⋅min−1 and a surface roughness Rq of 7.05 nm. The efficacy of the H2O2+Cu(NO3)2 slurry lies in its superior removal and passivation performance, attributed to the generation of hydroxyl radicals through the Fenton-like reaction. These radicals facilitate the formation of a WO3 passivation layer with good corrosion resistance on the surface, while enabling easy removal through mechanical wear. In addition, the plastic deformation mechanism of passivation layer was also studied by nanoscratch tests and transmission electron microscopy. It is found that a pure plastic flow groove can be obtained in the load range of 3–100 mN, accompanied by the formation of asymmetric deformation and pile-ups in the subsurface of the main plastic zone.

Grinding of Cemented Carbide Using a Vitrified Diamond Pin and Lubricated Liquid Carbon Dioxide

Despite extensive research on grinding of cemented carbide, few studies have examined abrasive machining of this material using small-diameter super abrasive tools (also known as grinding pins/points), especially with respect to varying cooling-lubrication methods. This study therefore focuses on a comparative experimental investigation of three such methods - dry, emulsion, and lubricated liquid carbon dioxide (LCO2-MQL). The performance of these methods and the resulting grindability are examined in terms of grinding forces, force ratios, specific energy, and through the analysis of wheel loading. The results show that LCO2-MQL grinding has lower grinding forces (normal forces – 8 % to 145 % lower than dry grinding, and 18 % to 33 % lower than emulsion grinding and tangential forces – 4 % to 66 % lower than dry grinding and 28 % to 78 % lower than emulsion grinding) and specific energy 24 % to 51 % lower compared to dry grinding and 64 % to 69 % lower than emulsion grinding, indicating its potential for efficient material removal. However, a challenge with high wheel loading was observed with LCO2-MQL, likely due to the lack of oxygen in the CO2 grinding atmosphere. Despite this issue, the LCO2-MQL method shows potential for efficient operations, especially at higher aggressiveness values where the lowest specific energies were achieved. These results provide new insights into various aspects of cooling-lubrication methods in the pin grinding of cemented carbides.

Atomistic study on the effect of the size of diamond abrasive particle during polishing of stainless steel

Nanofinishing or polishing helps to reduce surface roughness, which further improves both the optical and chemical properties of engineering materials. During the polishing of any engineering material, the size of abrasive particles plays a significant role in efficient polishing. In this paper, stainless steel 304 (or SS304) is selected for polishing through diamond abrasives with varying particle sizes using molecular dynamics simulations (MDS). It is found that the diamond abrasive particle initially causes elastic deformation due to the attractive force between the abrasive particle and the workpiece surface. As the size of the abrasive particle increases, plastic deformation occurs by spreading the dislocations on the surface only, which helps to annihilate the dislocations after polishing. It is revealed that the smaller abrasive particles (<3 nm) get trapped due to strong chemical bonding with the surface of the workpiece, and the abrasive particles start depositing on the workpiece instead of material removal. In this paper, it is proposed that an optimum size of abrasive particles is required for a given set of polishing parameters to achieve efficient material removal and minimum surface and subsurface defects. Thus, the present study is worthwhile for efficient polishing or nanocutting of stainless steel through monocrystalline diamond.

Modelling of kerf width and surface roughness using vibration signals in laser beam machining of stainless steel using design of experiments

Manufacturing industries are increasingly interested in laser beam machining as an efficient material removal process. Accordingly, there is great motivation in the modelling of the machining process to understand the physics behind the machining process in order to improve the machining efficiency. The present study made an attempt to predict surface roughness, kerf width and metal removal rate by utilizing the vibration signals measured during the laser beam machining of AISI 304 stainless steel. As per Taguchi’s L9 design of experiments, nine experiments were conducted at three levels of laser power (2.0, 1.5 and 1.0 kW), laser frequency (10, 8 and 6 kHz), cutting speed (3.0, 2.5 and 2.0 m/min) and nozzle tip distance (1.2, 1 and 0.8 mm) on 6 mm thickness of sheet metal and the vibration of sheet metal was measured using an accelerometer. It was observed that, the sheet vibration along the cutting direction increased the metal removal rate and sheet vibration perpendicular to the cutting direction caused surface roughness. Mathematical models were developed with the vibration data and predicted the surface roughness, kerf width and metal removal rate. The root mean square error of the responses was calculated as 0.615 µm, 5.44 µm and 0.259 m3/min for surface roughness, kerf width and metal removal rate respectively, demonstrating a significant correlation with experimental results. Furthermore, effect of laser power, laser frequency, cutting speed and nozzle tip distance on the surface roughness, kerf width, heat affected zone and metal removal rate was studied. The laser power and cutting speed have significant effect on these responses. Finite element modelling based simulation was carried out and studied effect of molten metal temperature on the heat affected zone. Temperature in the molten pool reached to maximum of 1773 K and the heat affected zone increased, when the laser power increased to 2.0 kW. The root mean square error between the measured and simulated heat affected zone was computed as 4.68 µm, indicating a good correlation between both.

Reducing environmental risks in laser cutting: A study of low-pressure gas dynamics

High gas pressures (1.0–1.6 MPa) are employed in conventional inert laser cutting to achieve efficient material removal and high cut quality. However, this approach results in the emission of large quantities of by-products, which can pose a risk to human health and the environment. For applications such as nuclear decommissioning, where global extraction and containment can be challenging, hazardous by-product formation, rather than process efficiency, is the main priority. This paper demonstrates low-pressure (0.3–0.6 MPa) laser-cutting techniques developed to reduce by-products. This study investigates the causal links between melt ejection and gas dynamic interactions in low-pressure laser cutting. Experiments were conducted using a 300 W Nd:Yb fiber laser to cut 304 stainless steel samples. Melt ejection and breakdown profiles were captured using a FASTCAM mini AX 200 camera. The lens combination fitted to the camera provided a spatial resolution of approximately 1 μm. The gas dynamic interactions were assessed through comparisons with existing studies of Schlieren imaging in idealized environments. The results show that gas dynamics are crucial in melt ejection and breakdown mechanisms during laser cutting. The key findings of this study are images of breakdown mechanisms linked to low-pressure gas dynamics. The impact of this work is that breakdown mechanisms more favorable to reducing environmental risk have been demonstrated. A greater understanding of the risk is indispensable to developing new laser-cutting control methods for hazardous materials.

Theoretical and experimental analysis of plasma radius expansion model in EDM: a comprehensive study

Electrical Discharge Machining (EDM) is an established non-conventional process, which is particularly efficient for the processing of hard-to-cut materials, in order to obtain high dimensional accuracy and surface integrity. However, in order to determine the appropriate parameters for machining novel materials, it is necessary to investigate the EDM process in depth, both by experiments and numerical models, taking into consideration the fundamental physical phenomena occurring during this process and be able to predict the surface morphology and microstructural alterations under various conditions. One of the challenging issues of EDM simulation models that still remain open is the representation of the evolution of plasma channel radius, for which various approaches have been proposed such as a linear, power law, or a more complex piecewise relation, in respect to time. Thus, in this work, the effect of different relations for the plasma channel radius evolution on energy absorption coefficient, plasma flushing efficiency (PFE), and crater morphology is compared under various conditions with a numerical model, which is also compared to experimental data. The results indicate that the energy absorption coefficient is dependent on the plasma column radius function, as slower growth of plasma channel leads to lower absorption coefficient and more efficient material removal, whereas a lower variation and different trends under different conditions were observed regarding PFE values, in respect to the power law exponent. Finally, the crater dimensions were shown to be consistently more narrow and deeper with higher exponents; thus, based on actual observations of indicative craters, it was revealed that the appropriate values for the exponent of the power law plasma radius function are below 0.25.

Efficient uranium(VI) adsorbing bioinspired nano-sized hydroxyapatite composites: synthesis, tuning, and adsorption mechanism.

The production of large amounts of uranium-containing wastewater and its potential hazards has stimulated green and efficient material removal of uranium (VI). Inspired by the natural mineralization of bone, a facile and eco-friendly biomimetic synthesis of nano-hydroxyapatite (HAP) was carried out using chitosan (CS) as a template. It was found that the reaction temperature and the amount of precursors influence the particle size, crystallinity and specific surface area of the CS/HAP nanorods, and consequently their U(VI) adsorption efficiency. Moreover, the synthesized CS/HAP-40 with smaller particle size, lower crystallinity, and larger specific surface area show a more efficient U(VI) removal compared with CS/HAP-55 and CS/HAP-55-AT. It has a maximum adsorption capacity of 294.12mg·g-1 of the CS/HAP-40. Interestingly, the U(VI) removal mechanism of CS/HAP-40 in acidic (pH = 3) and alkaline (pH = 8) aqueous solutions was found to be different. As one of the main results, the U(VI) adsorption mechanisms at pH 8 could be surface complexation and ion exchange. On the contrary, three different mechanisms could be observed at pH 3: dissolution-precipitation to form chernikovite, surface complexation, and ion exchange.

A Model-Based Trajectory Planning Method for Robotic Polishing of Complex Surfaces

Off-line programming of the polishing tool trajectory for complex workpieces is challenging due to the nontrivial material removal model and the polishing accuracy requirement. Current tool trajectory planning methods are mainly developed for some simple surfaces but cannot handle the increasingly complicated industrial parts, such as the wheel hubs. This article first develops a numerical contact mechanics model for the point-sampled complex workpieces. The contact pressure distribution and the material removal depths on the workpiece point cloud can be predicted efficiently. A novel high-priority subregion searching algorithm is developed to track the most-worth-polishing workpiece points. By selecting the path pattern as direction-parallel, the path direction, tool dwell times, and the path spacings inside each extracted subregion are optimized to minimize the deviation from the desired material removal depths. The effectiveness of the proposed method is verified by performing disk polishing simulations on workpieces with different shapes. A robotic polishing experiment is also conducted on a wheel hub. Both simulation and experimental results show that reasonable tool trajectories can be generated on the workpiece, and the desired material removal depths can be achieved. Note to Practitioners—In robotic polishing industries, it is crucial to plan the tool trajectory (tool path and feed velocity) to achieve desired material removal depths on the workpiece surface, which means high surface quality. In this article, a model-based tool trajectory planning method for robotic polishing of complex surfaces that are represented by the point cloud form is presented. The advantage of using the point cloud is that workpiece surfaces with varying curvatures and complex features, e.g., grooves and holes, need not be expressed explicitly. The proposed method generates high-priority subregions according to the updated material removal distribution dynamically. In this work, the polishing path pattern is chosen as direction-parallel. Based on an efficient numerical contact mechanics and material removal model, the path locations and the tool dwell times inside each subregion are optimized to minimize the deviation between the actual and the desired material removal depths. When the desired material removal depths are attained in an extracted subregion, the algorithm finds the next high-priority subregion until the whole workpiece is well polished. The trajectory planning method can be integrated into an industrial robot with the force-control module. Future work is to integrate the roughness model into the tool trajectory planning method.

Parametric Optimization for Quality of Electric Discharge Machined Profile by Using Multi-Shape Electrode.

The electrical discharge machining (EDM) process is one of the most efficient non-conventional precise material removal processes. It is a smart process used to intricately shape hard metals by creating spark erosion in electroconductive materials. Sparking occurs in the gap between the tool and workpiece. This erosion removes the material from the workpiece by melting and vaporizing the metal in the presence of dielectric fluid. In recent years, EDM has evolved widely on the basis of its electrical and non-electrical parameters. Recent research has sought to investigate the optimal machining parameters for EDM in order to make intricate shapes with greater accuracy and better finishes. Every method employed in the EDM process has intended to enhance the capability of machining performance by adopting better working conditions and developing techniques to machine new materials with more refinement. This new research aims to optimize EDM’s electrical parameters on the basis of multi-shaped electrodes in order to obtain a good surface finish and high dimensional accuracy and to improve the post-machining hardness in order to improve the overall quality of the machined profile. The optimization of electrical parameters, i.e., spark voltage, current, pulse-on time and depth of cut, has been achieved by conducting the experimentation on die steel D2 with a specifically designed multi-shaped copper electrode. An experimental design is generated using a statistical tool, and actual machining is performed to observe the surface roughness, variations on the surface hardness and dimensional stability. A full factorial design of experiment (DOE) approach has been followed (as there are more than two process parameters) to prepare the samples via EDM. Regression analysis and analysis of variance (ANOVA) for the interpretation and optimization of results has been carried out using Minitab as a statistical tool. The validation of experimental findings with statistical ones confirms the significance of each operating parameter on the output parameters. Hence, the most optimized relationships were found and presented in the current study.

The feasibility of fast slotting thick CFRP laminate using fiber laser-CNC milling cooperative machining technique

Thermal damage is inevitable during laser cutting CFRP laminates due to significantly different thermal properties between carbon fiber and resin matrix, which severely affects the assembly accuracy and service performance of composite structures. This work proposed a newly designed fiber laser-CNC milling cooperative machining technique to slot 10.0 mm thick CFRP plates, it integrated the advantages of high efficiency and high material removal rate during high-power laser cutting process, together with good surface quality in milling with limited cutting allowance and high cutting speed. The influence of different machining strategy/method, cutting parameters and thermal damage on surface quality and morphology were comprehensively investigated. Thermal defects including cracks, striations, protruding fibers and matrix recession were the main damage during laser processing thick CFRP laminates, while laser-CNC milling cooperative machining technique successfully slotted 10.0 mm thick CFRP plate without thermal damage and kerf angle with the surface roughness (Sa) down to 5.4 μm. Experimental results from this work indicated that the proposed cooperative machining technique was an alternative method for slotting thick CFRP laminates with superior quality and efficiency.

Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries

Single crystal silicon wafers are widely applied in the field of Integrated Circuits (ICs). However, in order to pursue high surface quality and efficient material removal rate (MRR) on polishing single crystal silicon, a large amount of abrasives is consumed, which increases the processing cost and burdens the environment on discharge. A novel abrasive-free method of polishing single crystal silicon wafers was proposed and explored to solve the above problems. A polishing pad pretreated by colloidal silica was employed. The MRRs of the polished silicon wafers with potassium carbonate, potassium silicate and potassium hydroxide slurries before and after pretreating pads were measured and compared. The polishing pad pretreated by colloidal silica can improve the processing efficiency, stability and quality of single crystal silicon wafers in the abrasive-free slurries containing potassium carbonate, potassium hydroxide or potassium silicate. The outstanding MRR of silicon wafer was obtained using abrasive-free slurries containing potassium carbonate and potassium silicate. The material removal mechanisms of polishing single crystal silicon wafers with pretreating pad adsorbing SiO2 grains and abrasive-free slurries were investigated by XPS analysis of silicon wafer surfaces and EDS and SEM analysis of the pad surfaces.

An investigation into the role of specimen geometry when undertaking tribological testing on seal fin components

Labyrinth seal systems are used in aeroengines to seal the clearance, the understanding of the wear mechanism of labyrinth seal system is necessary to achieve better sealing performance. In this work a series of tests are conducted on a high-speed test rig capable of fin tip speeds of 100 m/s. With force and temperature measurements recorded in each case, the influence of specimen geometry is investigated. Surface examination and debris analysis is also performed using microscopy post-test. The wear mechanism was found to be influenced by fin geometry. A discrete fin was observed to trigger a more efficient material removal mechanism at both incursion conditions. Where the fin segment and ring-shaped fin leading to increased temperatures and material smearing. The heat dissipate role of fin was also observed during test where longer contact time of fin and abradable gives better heat removal performance.

Freeform surface generation by atmospheric pressure plasma processing using a time-variant influence function.

Based on a controllable chemical reaction, atmospheric pressure plasma processing (APPP) can achieve efficient material removal even when the tool influence function (TIF) size is reduced to several millimeters, resulting in its great application potential for generating freeform surfaces. However, the TIF changes with the local dwell time, introducing nonlinearity into processing, because of the influence of the plasma thermal effect on chemical reactions. In this paper, a freeform generation method using a time-variant TIF is presented and validated. First, the time-variant removal characteristics of APPP and its nonlinear influence on freeform surface generation are analyzed. Then, the freeform surface generation concept is proposed based on controlling the local volumetric removal. Consequently, the dwell time calculation method is developed to suppress the nonlinearity induced by the time-variant TIF. Finally, the developed method is evaluated by the simulation and experimental analysis of the complex structure generation process. Results show that the proposed method can reduce the nonlinear influence of the time-variant TIF by reasonably calculating dwell time, promoting the application of APPP in freeform surface generation.

Electrochemical jet-assisted precision grinding of single-crystal SiC using soft abrasive wheel

The next-generation wide bandgap semiconductor single-crystal SiC is extremely stable both mechanically and chemically, which poses problems for micromachining. In this paper, a novel hybrid process combining electrochemical jet anodization and soft abrasive grinding, namely, electrochemical jet-assisted grinding (EJAG), is proposed to enhance both the grinding efficiency and surface integrity of SiC. This process combines characteristics from jet-electrochemical machining (jet-ECM) and grinding into a new micromachining process. In EJAG, the interaction of the jet with the local material efficiently oxidizes the workpiece surface and results in a softened modified layer, which enables the application of soft abrasive grinding to machine SiC with the introduction of little subsurface damage. In this study, details of this hybrid EJAG process are presented, and the process-material interaction is examined experimentally. The material removal mechanism and surface morphology are investigated via anodization/grinding results and scanning electron microscope/atomic force microscope (SEM/AFM) studies. On the basis of a nanoindentation test, the microhardness of SiC decreases by 90% after electrochemical jet anodization (EJA) compared with the unmodified surface. The grinding results show that with the assistance of EJA, both the machining rate and wear resistance of the wheel can be improved. In addition, the surface quality resulted from the proposed EJAG method is close to that from polishing by chemical mechanical polishing (CMP), while the processing time is evidently shorter. By utilizing a cylindrical corundum rod as the grinding wheel, EJAG realized localized machining of microcavities in predefined areas with an extremely smooth surface finish (Sa = 2.18 nm). A three-level and four-factor orthogonal experiment was designed to obtain the optimum conditions. Based on this, a highly efficient material removal rate (MRR) of SiC while maintaining a defect-free surface was demonstrated.