Ceramics have a high degree of brittleness, relatively low thermal conductivity, and high elastic modulus, which renders them highly susceptible to catastrophic failure under severe thermal transient conditions [1, 2]. In the past 40 years, carbon fibers have been extensively used to reinforce glass, glass-ceramic, and ceramic matrix composites because they producing an excellent combination of strength and toughness [3–6]. In our previous work, TiC composites containing 20 vol% short carbon fibers (Cf/TiC) were prepared by an optimum vacuum hot pressing method, and they exhibited a high fracture toughness and good high temperature strength compared with the monolithic TiC materials [7], which demonstrated that carbon fiber reinforced TiC composites would be a potential high temperature material in non-oxidizing environments. It is hoped that the addition of carbon fibers to the TiC matrix can improve the thermal shock resistance of TiC ceramics by modifying the thermophysical properties. However, not enough attention was paid to the thermophysical properties, such as the thermal expansion coefficient, α, specific heat, Cp, thermal diffusivity, λ, and thermal conductivity, κ , which are at least as important as strength and fracture toughness, especially for applications in thermal shock environments. The aim of this work was to investigate the temperature dependence of the thermal expansion, specific heat, thermal diffusion, and thermal conduction of Cf/TiC composites, and discuss the effects of carbon fibers on these thermophysical properties. TiC composites containing 20 vol% short carbon fibers were prepared by hot-pressing at 2100 ◦C, 30 MPa for 1 h in vacuum; the short fibers, with a length from 20–180 μm and a diameter of 6–8 μm, were randomly and uniformly distributed in the TiC matrix. The detailed information of the materials preparation procedure can be found elsewhere [7]. Monolithic TiC was also fabricated by the same procedure for comparison reinforce. Thermophysical properties measurements were carried out in the temperature range from room tempera-