Structural composites are increasingly being utilized in many large naval and civil structures where it is vital that their long-term performance be predictable and their variability definable over the life of the structure. However, these properties may be influenced by the degree of cure of the resin, particularly for room-temperature-cured systems. Thus, this investigation defines the postcure effects on E-glass/vinyl-ester fiber-reinforced polymer (FRP) composites manufactured using the vacuum-assisted resin transfer molding (VARTM) method, which are typical of those used by the US Navy for ship structures. The composites are differentiated by varying levels of postcure temperature and duration, and examined for the effects of advancing cure at various points in the time after postcure. Pseudo-quasi-isotropic [0/+45/90/−45/0]s and angle ply laminate [±45]2s samples from each level of postcure are examined at 1, 10, 30, 100, and 300 days after postcure in order to track strength, stiffness, failure strain, creep, and fatigue performance as functions of time. In parallel, the matrix polymer is inspected using FTIR (Fourier transform infrared spectroscopy) to directly assess the degree of conversion. Dynamic mechanical analysis and shrinkage measurements are also undertaken to assess the Tg and the amount of shrinkage undergone during post-curing, as well as the advancing of the level of cure during the prescribed aging time. Results suggest that the degree of conversion is limited to 80% for the vinyl-ester oligomer and 90–95% for styrene following a postcure of 93°C. It is observed that after 300 days of ambient storage the nonpostcured samples approach the degree of conversion exhibited by those postcured at 93°C, as measured by FTIR. Resin dominated quasi-static properties are greatly affected by the degree of cure, whereas fiber dominated properties are not. Where the degree of cure is comparatively low, viscoelastic properties cause greater changes in creep response as well as influencing fatigue performance.