Dual-band Quantum Well Infrared Photodetector Research Articles

High speed QWIP FPAs on InP substrates

Quantum well infrared photodetector (QWIP) technology has allowed the realization of low cost staring focal plane arrays (FPAs). However, AlGaAs/(In)GaAs QWIP FPAs suffer from low quantum and conversion efficiencies under high frame rate and/or low background conditions. We extensively discuss the effect of sensor gain on the FPA performance under various operating conditions, and highlight the superiority of the InP/InGaAs material system with respect to AlGaAs/GaAs for high speed/low background thermal imaging applications. InP/InGaAs QWIPs, providing a bias adjustable gain in a wide range, offer the flexibility of adapting the FPA to strict operating conditions. We also present an experimental comparison of large format AlGaAs/GaAs and (strained) InP/InGaAs QWIP FPAs under different operating conditions. A 640 × 512 QWIP FPA constructed with the 40-well strained InP/In 0.48Ga 0.52As material system displays a cut-off wavelength of 9.7 μm ( λ p = 8.9 μm) with a BLIP temperature higher than 65 K ( f/2), and a peak quantum efficiency as high as 12% with a broad spectral response (Δ λ/ λ p = 17%). The conversion efficiency of the FPA pixels is as high as 20% under large bias (4 V) where the detectivity is reasonably high (∼3 × 10 10 cm Hz 1/2/W, f/2, 65 K). While providing a considerably higher quantum efficiency than the pixels of a similar AlGaAs/GaAs FPA, the InP/InGaAs QWIP provides similar NETD values with much shorter integration times and, being less sensitive to the read noise, successfully operates with sub-millisecond integration times. The results clearly demonstrate that InP based material systems display high potential for single- and dual-band QWIP FPAs by overcoming the limitations of the standard GaAs based QWIPs under high frame rate and/or low background conditions.

Large area III–V infrared focal planes

Jet Propulsion Laboratory is actively developing the III–V based infrared detector and focal plane arrays (FPAs) for remote sensing and imaging applications. Currently, we are working on Superlattice detectors, multi-band quantum well infrared photodetectors (QWIPs), and quantum dot infrared photodetector (QDIPs) technologies suitable for high pixel-pixel uniformity and high pixel operability large area imaging arrays. In this paper, we will discuss the demonstration of long-wavelength 1 K × 1 K QDIP FPA, 1 K × 1K QWIP FPA, the first demonstration of the megapixel-simultaneously-readable and pixel-co-registered dual-band QWIP FPA, and demonstration of the first mid-wave and long-wave 1K × 1K superlattice FPA. In addition, we will discuss the advantages of III–V material system in the context of large format infrared FPAs.

Quantum well infrared photodetector simultaneously working in two atmospheric windows

We have demonstrated a two-contact quantum well infrared photodetector (QWIP) exhibiting simultaneous photoresponse in both the mid- and the long-wavelength atmospheric windows of 3-5 mu m and of 8-12 mu m. The structure of the device was achieved by sequentially growing a mid-wavelength QWIP part followed by a long-wavelength QWIP part separated by an n-doped layer. Compared with the conventional dual-band QWIP device utilizing three ohmic contacts, our QWIP is promising to greatly facilitate two-color focal plane array (FPA) fabrication by reducing the number of the indium bumps per pixel from three to one just like a monochromatic FPA fabrication and to increase the FPA fill factor by reducing one contact per pixel; another advantage may be that this QWIP FPA boasts broadband detection capability in the two atmospheric windows while using only a monochromatic readout integrated circuit. We attributed this simultaneous broadband detection to the different distributions of the total bias voltage between the mid- and long-wavelength QWIP parts.

Demonstration of Megapixel Dual-Band QWIP Focal Plane Array

Quantum well infrared photodetectors (QWIPs) are well known for their stability, high pixel-pixel uniformity and high pixel operability which are quintessential parameters for large area imaging arrays. In this paper we report the first demonstration of the megapixel-simultaneously-readable and pixel-co-registered dual-band QWIP focal plane array (FPA). The dual-band QWIP device was developed by stacking two multi-quantum-well stacks tuned to absorb two different infrared wavelengths. The full width at half maximum (FWHM) of the midwave infrared (MWIR) band extends from 4.4-5.1 ?m and FWHM of the long-wave infrared (LWIR) band extends from 7.8-8.8 ?m. Dual-band QWIP detector arrays were hybridized with direct injection 30 ?m pixel pitch megapixel dual-band simultaneously readable CMOS read out integrated circuits using the indium bump hybridization technique. The initial dual-band megapixel QWIP FPAs were cooled to 68 K operating temperature. The preliminary data taken from the first megapixel QWIP FPA has shown system NE?T of 27 and 40 mK for MWIR and LWIR bands, respectively.

Large format voltage tunable dual-band QWIP FPAs

Third generation thermal imagers with dual/multi-band operation capability are the prominent focus of the current research in the field of infrared detection. Dual band quantum-well infrared photodetector (QWIP) focal plane arrays (FPAs) based on various detection and fabrication approaches have been reported. One of these approaches is the three-contact design allowing simultaneous integration of the signals in both bands. However, this approach requires three In bumps on each pixel leading to a complicated fabrication process and lower fill factor. If the spectral response of a two-stack QWIP structure can effectively be shifted between two spectral bands with the applied bias, dual band sensors can be implemented with the conventional FPA fabrication process requiring only one In bump on each pixel making it possible to fabricate large format dual band FPAs at the cost and yield of single band detectors. While some disadvantages of this technique have been discussed in the literature, the detailed assessment of this approach has not been performed at the FPA level yet. We report the characteristics of a large format (640 × 512) voltage tunable dual-band QWIP FPA constructed through series connection of MWIR AlGaAs–InGaAs and LWIR AlGaAs–GaAs multi-quantum well stacks, and provide a detailed assessment of the potential of this approach at both pixel and FPA levels. The dual band FPA having MWIR and LWIR cut-off wavelengths of 5.1 and 8.9 μm provided noise equivalent temperature differences as low as 14 and 31 mK ( f/1.5) with switching voltages within the limits applicable by commercial read-out integrated circuits. The results demonstrate the promise of the approach for achieving large format low cost dual band FPAs.

1024 × 1024 Format pixel co-located simultaneously readable dual-band QWIP focal plane

This paper reports the first demonstration of the megapixel-simultaneously-readable and pixel-co-registered dual-band quantum well infrared photodetector (QWIP) focal plane array (FPA). The dual-band QWIP device was developed by stacking two multi-quantum-well stacks tuned to absorb two different infrared wavelengths. The full width at half maximum (FWHM) of the mid-wave infrared (MWIR) band extends from 4.4 to 5.1 μm and the FWHM of a long-wave infrared (LWIR) band extends from 7.8 to 8.8 μm. Dual-band QWIP detector arrays were hybridized with custom fabricated direct injection read out integrated circuits (ROICs) using the indium bump hybridization technique. The initial dual-band megapixel QWIP FPAs were cooled to 70 K operating temperature. The preliminary data taken from the first megapixel QWIP FPA has shown system NEΔT of 27 and 40 mK for MWIR and LWIR bands, respectively.

QWIP focal plane arrays on InP substrates for single and dual band thermal imagers

Alternative material systems on InP substrate provide certain advantages for mid-wavelength infrared (MWIR), long-wavelength infrared (LWIR) and dual band MWIR/LWIR quantum well infrared photodetector (QWIP) focal plane arrays (FPAs). While InP/InGaAs and InP/InGaAsP LWIR QWIPs provide much higher responsivity when compared to the AlGaAs/GaAs QWIPs, AlInAs/InGaAs system facilitates completely lattice matched single band MWIR and dual band MWIR/LWIR FPAs. We present an extensive review of the studies on InP based single and dual band QWIPs. While reviewing the characteristics of InP/InGaAs and InP/InGaAsP LWIR QWIPs at large format FPA level, we experimentally demonstrate that the cut-off wavelength of AlInAs/InGaAs QWIPs can be tuned in a sufficiently large range in the MWIR atmospheric window by only changing the quantum well (QW) width at the lattice matched composition. The cut-off wavelength can be shifted up to ∼5.0 μm with a QW width of 22 Å in which case very broad spectral response (Δ λ/ λ p = ∼30%) and a reasonably high peak detectivity are achievable leading to a noise equivalent temperature difference as low as 14 mK ( f/2) with 25 μm pitch in a 640 × 512 FPA. We also present the characteristics of InP based two-stack QWIPs with wavelengths properly tuned in the MWIR and LWIR bands for dual color detection. The results clearly demonstrate that InP based material systems display high potential for dual band MWIR/LWIR QWIP FPAs needed by third generation thermal imagers.

Quantum Well and Quantum Dot Based Detector Arrays for Infrared Imaging

ABSTRACTA mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) 320x256 pixel quantum well infrared photodetector (QWIP) dualband focal plane arrays (FPAs) have been demonstrated with excellent imagery. Currently, we are developing a 1024x1024 pixel simultaneous pixel co-registered dualband QWIP FPA. In addition, epitaxially grown self-assembled InAs/InGaAs/GaAs quantum dots (QDs) are exploited for the development of large-format FPAs. The Dot-in-a-Well (DWELL) structures were experimentally shown to absorb both 45° and normal incident light, therefore a reflection grating structure was used to enhance the quantum efficiency. The devices exhibit peak responsivity out to 8.1 microns, with peak detectivity reaching ∼ 1 × 1010 Jones at 77 K. The devices were fabricated into the first LWIR 640x512 pixel QDIP FPA, which has produced excellent infrared imagery with NETD of 40 mK at 60K operating temperature.

Demonstration and Performance Assessment of Large Format InP–InGaAsP Quantum-Well Infrared Photodetector Focal Plane Array

There have been various studies showing that InP-InGaAs quantum-well infrared photodetectors (QWIPs) are potential alternatives to AlGaAs-GaAs QWIPs in the long wavelength infrared (LWIR) band, especially for applications requiring high responsivity. Being on InP substrate, this material system also offers lattice matched mid-wavelength infrared (MWIR)/LWIR dual band QWIP stack when it is used with the AlInAs-InGaAs system. It is desirable to extend the cut-off wavelength of InP based LWIR QWIPs to , which can be accomplished by replacing the QW material with InGaAsP. In this paper, we report the first InP-InGaAsP QWIP focal plane array (FPA). The 640 512 FPA displayed remarkably low noise equivalent temperature difference (NETD) with very short integration times (46 mK at 66 K with and f/1.5 optics). The results show that these QWIPs can be operated with high responsivity (1 A/W) while offering bias adjustable gain in a wide range where the detectivity is almost constant at a reasonably high level.

Towards dualband megapixel QWIP focal plane arrays

Mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) 1024×1024 pixel quantum well infrared photodetector (QWIP) focal planes have been demonstrated with excellent imaging performance. The MWIR QWIP detector array has demonstrated a noise equivalent differential temperature (NEΔT) of 17mK at a 95K operating temperature with f/2.5 optics at 300K background and the LWIR detector array has demonstrated a NEΔT of 13mK at a 70K operating temperature with the same optical and background conditions as the MWIR detector array after the subtraction of system noise. Both MWIR and LWIR focal planes have shown background limited performance (BLIP) at 90K and 70K operating temperatures respectively, with similar optical and background conditions. In addition, we have demonstrated MWIR and LWIR pixel co-registered simultaneously readable dualband QWIP focal plane arrays. In this paper, we will discuss the performance in terms of quantum efficiency, NEΔT, uniformity, operability, and modulation transfer functions of the 1024×1024 pixel arrays and the progress of dualband QWIP focal plane array development work.

GaAs/AlGaAs MULTI-QUANTUM WELL-BASED INFRARED FOCAL PLANE ARRAYS FOR INFRARED IMAGING APPLICATIONS

New infrared focal plane arrays (FPAs) with multi-spectral coverage, high sensitivity, and lower manufacturing costs are required for many ground-based and space-based infrared imaging applications, One of the most promising FPA technologies is a GaAs/AlGaAs based Quantum Well Infrared Photodetector (QWIP) FPAs. In this paper we discuss the importance of focal plane array non-uniformity on the performance, demonstrations of varies infrared imaging cameras based on narrow-band QWIP FPAs, demonstration of long-wavelength/very long-wavelength dual-band QWIP imaging camera, demonstration of the first broad-band QWIP imaging camera, and a novel multi-quantum-well based infrared detection device structure for low-background and low-temperature operations.

Laboratory and field imaging test results on single-color and dual-band QWIP focal plane arrays

We report on recent laboratory and field measurements on quantum well infrared photodetector (QWIP) focal plane arrays (FPAs). The results of laboratory measurements of imaging performance such as noise-equivalent temperature difference (NE ΔT), minimum resolvable temperature, conversion efficiency, uniformity of response and dark current and their dependence on operating temperature are presented on large format (640×480 pixels) single-color long-wavelength infrared (LWIR) and dual-band (256×256 pixels) mid-wavelength infrared (MWIR)/LWIR arrays. We found that under optimum operating conditions (65 K and 1 V bias), the NE ΔT of the LWIR FPA was approximately 30 mK and was limited by the optics and noise from the closed-cycle cooler. We will show field imagery of military targets taken with this FPA. In addition, field imagery taken with the LWIR QWIP camera of a large-transient event will be compared with that taken with an InSb MWIR camera. We will also show imagery of a recent total eclipse of the moon. We will also present laboratory results on a simultaneously integrating, pixel-registered dual-band FPA showing excellent operability and response uniformity with NE ΔT of approximately 30 mK in both bands ( T=60 K). The dual-band FPA was also taken to the field and we will present imagery of various targets acquired with this FPA.

Quantum well infrared photodetector research and development at Jet Propulsion Laboratory

One of the simplest device realizations of the classic particle-in-the-box problem of basic quantum mechanics is the quantum well infrared photodetector (QWIP). In this paper, we discuss the effect of focal plane array nonuniformity on the performance, optimization of the detector design, material growth and processing that has culminated in realization of large format long-wavelength QWIP cameras, holding forth great promise for many applications in 6–18 μm wavelength range in science, medicine, defense and industry. In addition, we present the recent developments in long-wavelength/very long-wavelength dualband QWIP imaging camera for various applications.

640×486 long-wavelength two-color GaAs/AlGaAs quantum well infrared photodetector (QWIP) focal plane array camera

We have designed and fabricated an optimized long-wavelength/very-long wavelength two-color quantum well infrared photodetector (QWIP) device structure. The device structure was grown on a 3-in semi-insulating GaAs substrate by molecular beam epitaxy (MBE). The wafer was processed into several 640/spl times/486 format monolithically integrated 8-9 and 14-15 /spl mu/m two-color (or dual wavelength) QWIP focal plane arrays (FPAs). These FPAs were then hybridized to 640/spl times/486 silicon CMOS readout multiplexers. A thinned (i.e., substrate removed) FPA hybrid was integrated into a liquid helium cooled dewar for electrical and optical characterization and to demonstrate simultaneous two-color imagery. The 8-9 /spl mu/m detectors in the FPA have shown background limited performance (BLIP) at 70 K operating temperature for 300 K background with f/2 cold stop. The 14-15 /spl mu/m detectors of the FPA reaches BLIP at 40 K operating temperature under the same background conditions. In this paper we discuss the performance of this long-wavelength dualband QWIP FPA in terms of quantum efficiency, detectivity, noise equivalent temperature difference (NE/spl Delta/T), uniformity, and operability.

Recent developments and applications of quantum well infrared photodetector focal plane arrays

One of the simplest device realizations of the classic particle-in-the-box problem of basic quantum mechanics is the quantum well infrared photodetector (QWIP). In this paper we discuss the optimization of the detector design, material growth and processing that has culminated in realization of large format long-wavelength QWIP cameras, holding forth great promise for many applications in 6–25 μm wavelength range in science, medicine, defense and industry. In addition, we present the recent developments in long-wavelength/very long-wavelength dualband QWIP imaging camera for various applications.

Monolithically Integrated Dual-Band Quantum Well Infrared Photodetector

AbstractA monolithic quantum well infrared photodetector (QWIP) structure has been presented that is suitable for dual bands in the two atmospheric transmission windows of 3 – 5.3 μm and 7.5 – 14μm, respectively. The proposed structure employs dual stacked, strain InGaAs/AlGaAs and latticematched GaAs/AlGaAs quantum well infrared photodetector for mid wavelength and long wavelength detection. The response peak of the strain InGaAs/AlGaAs quantum well is at 4.9 μm and the lattice-matched GaAs/AlGaAs is at 10.5μm; their peak sensitivities are in the spectral regions of 3 – 5.3mu;m and 7.5 – 14μm. The peak responsivity when the dual-band QWIP is biased at 5 Volts is ∼0.065A/W at 4.9μm and ∼0.006A/W at 10.5μm; at this voltage the dual-band QWIP is more sensitive at the shorter wavelengths due to its larger impedance thus exhibiting wavelength tunability characteristics with bias. Additionally, single colored 4.9 and 10.5μm QWIPs were fabricated from the dual-band QWIP structure to study the bias-dependent behavior and also to understand the effects of growing the strain layer InGaAs/AlGaAs QWIP on top of the lattice-matched GaAs/AlGaAs QWIP. In summary, two stack dual-band QWIPs using GaAs/AlGaAs and strained InGaAs/AlGaAs multiquantum wells have been demonstrated with peak spectral sensitivities in the spectral region of 3 – 5.3μm and 7.5 – 14μm. Also, the voltage tunable dual-band detection have been realized for this kind of QWIP structure.