The rapid development of micro-electronics has a growing demand on the heat dissipation performance of devices, especially thermal management materials. However, recent researches focus on the improvement of single ability, such as thermal or mechanical properties. Herein, a strategy that simultaneously improves thermal and mechanical performance of thermal manager material was proposed, which was achieved by preparing Cu-SiCw composites via the co-electrodeposition technology. The influence of electroplating parameters, such as temperature, current density and reinforcement contents, on the microstructure evolution, mechanical and thermal conductivity were investigated systematically. The fabricated SiCw composite displayed excellent shear strength up to 420 MPa, which is resulted from the Orowan strengthening and load transferring. Additionally, the thermal conductivity of 340 W/(m·K) was obtained, owing to the uniform distribution of whiskers and good interface between the Cu matrix and whiskers. Therefore, the presented work provided an effective method for fabricating comprehensive thermal-mechanical properties and homogeneous heat dissipation capacity Cu-SiCw composites and paved the way for the practical application in the field of the connector between the power devices and heat sinks.