Thermal Resistance Distribution Research Articles

A High-Power, Flexible, and Magnetically Attachable Radiative Cooling Film

Radiative cooling is an environmentally friendly, passive cooling technology that operates without energy consumption. Current research primarily focuses on optimizing the optical properties of radiative cooling films to enhance their cooling performance. In practical applications, thermal contact between the radiative cooling film and the object significantly influences the ultimate cooling performance. However, achieving optimal thermal contact has received limited attention. In this study, we propose and experimentally demonstrate a high-power, flexible, and magnetically attachable and detachable radiative cooling film. This film consists of polymer metasurface structures on a flexible magnetic layer. The monolithic design allows for convenient attachment to and detachment from steel or iron surfaces, ensuring optimal thermal contact with minimal thermal resistance and uniform temperature distribution. Our magnetic radiative cooling film exhibits superior cooling performance compared to non-magnetic alternatives. It can reduce the temperature of stainless-steel plates under sunlight by 15.2 °C, which is 3.6 °C more than that achieved by non-magnetic radiative cooling films. The radiative cooling power can reach 259 W∙m−2 at a working temperature of 70 °C. Unlike other commonly used attachment methods, such as thermal grease or one-off tape, our approach allows for detachment and reusability of the cooling film according to practical needs. This method offers great simplicity, flexibility, and cost-effectiveness, making it promising for broad applications, particularly on non-horizontal irregular surfaces previously considered challenging.

Research on temperature field and thermal deformation characteristics of casting rollers in twin-roll casting process

The twin-roll casting (TRC) process is considered a revolutionary technology in the metallurgical field and has garnered significant attention and research in recent years. The casting rollers used in the TRC process are crucial for achieving the desired shape of the casting strip. This study investigates the temperature distribution and thermal deformation of casting rollers in the TRC process using numerical simulation. A novel model for predicting the thermal resistance distribution at the circumferential interface between the casting roller and the molten pool has been introduced. The study examined the effects of various factors including casting roller diameter, water channel position, number, and diameter on temperature, thermal deformation, and heat flux. The findings reveal that increasing the casting roller diameter from 460 mm to 500 mm or augmenting the distance from the water channel to the casting roller surface from 35 mm to 55 mm resulted in a 37 % and 30 % increase in the maximum surface temperature of the casting roller, respectively. Additionally, an increase in the number of water channels from 30 to 50 and a growth in their diameter from 20 mm to 28 mm resulted in the average heat flux of the casting roller remaining stable, with fluctuations less than 1 MW/m2. Leveraging the insights gained from the thermal deformation behavior of the casting roller and the ideal shape of the casting strip, a comprehensive control approach for the casting roller profile was developed. The outcomes of this research provide a valuable theoretical framework for enhancing the design of casting roller structures in the TRC process.

Design and Performance Analysis of a Composite Thermal Protection Structure for a Robot Pan–Tilt

To improve the adaptability of the robot pan–tilt to the high-temperature environment, a design scheme for a composite thermal protection structure composed of aerogel felt, hollow glass, and skin is proposed. The effects of aerogel felt thickness, glass type, and ambient temperature on the thermal protection performance of the structure are studied, using a fluid–solid–thermal coupling model. Numerical results show that the structure exhibits good protection performance, and that the thermal resistance distribution changes the main path of heat transmission. The optimal thickness of the aerogel felt is approximately 8 mm. Compared to 3 mm, 5 mm, and 10 mm thicknesses, 8 mm reduces the maximum temperature by 15.90%, 8.37%, and 6.22%, and reduces the total entropy by 79.23%, 52.44%, and 12.5%. Lower thermal conductivity of the gas inside the hollow glass results in decreased maximum temperatures and total entropy. Using argon-filled hollow glass at 573.15 K decreases maximum temperature by 33.52% and 8.40%, with a total entropy reduction of 33.46% and 6.04%, compared to the single-layer and air-filled glass. Higher ambient temperatures correlate with increased maximum temperature, total entropy, and average surface-heat-transfer coefficient, indicating that the adaptability of the structure to high-temperature environments is limited.

Analysis on battery thermal management system based on flat heat pipe at high discharging rate

Power batteries are the core power source for electric vehicles. However, battery thermal management technology for electric vehicles will face more severe challenges in the future. Flat heat pipe has gradually received much attention in the field of battery thermal management due to its high heat conduction coefficient and lightweight structure. This paper focuses on the influence of flat heat pipe structural parameters on battery thermo-electrical performance by establishing simulation model of the battery cooling system, which makes contribution to the flat heat pipe structure design on optimizing battery overall performance. Based on the mechanism of working medium flow effect of flat heat pipe on the battery electrochemical heat generation, a coupled model of flat heat pipe-based battery system is established according to the relationship between battery electrochemical heat generation performance and flat heat pipe heat transfer characteristics. The accuracy of system model is further verified by experiment, and the battery thermo-electrical characteristics under different discharging conditions is simulated. The flat heat pipe-based battery thermal management system can effectively reduce the battery maximum temperature while improving the uniformity of battery temperature and state of charge (SOC). The reduction of the vapor chamber thickness causes the uneven distribution of vapor thermal resistance, so the battery maximum temperature and maximum temperature difference will become larger, which will further cause the uneven distribution of battery internal resistance, and this will finally increase the non-uniformity of battery module discharging current distribution. A structural design method of the flat heat pipe-based battery thermal management system is developed with the battery thermo-electrical coupling performance as the design objective and the flat heat pipe structural parameters (total thickness, vapor chamber thickness, total length) as the optimization variables. Compared with the original scheme, the battery maximum temperature can be reduced by 6.4% under transient high-rate discharging conditions with the modified flat heat pipe based on the proposed design method, while the battery maximum temperature and SOC difference can also be reduced by 18.4% and 16.3%, respectively.

Investigation of pin and perforated heatsink cooling efficiency and temperature distribution

The uneven temperature distribution resulting from thermal stresses in heat sinks is a significant issue in modern electronic devices. This numerical investigation utilizes fluid to analyze the cooling, flow, and heat transfer characteristics of eight different heat sink designs. These include pin–fin heat sinks with circular, triangular, square, and hexagonal cross-sections, as well as their perforated versions. The results show that the thermal resistance range for all geometries was between Rth = 0.29 and 0.51 K W−1. The circular cross-section pin structure was found to be the most efficient in terms of thermal resistance, while the triangular perforated structure was the least efficient. The narrow and low temperature distribution indicates a high cooling potential for the heat sink. It has been observed that the temperature range studied is between 308.732 and 315.273 K. The circular cross-section pin structure is most efficient in terms of homogeneous distribution between 308.73 and 311.306 K. The pin-type structure with a square cross-section attained the maximum Performance Evaluation Criteria (PEC) of 1.1872 at P = 689 Pa, while the pin-type structure with a triangular cross-section attained the lowest PEC of 0.67 at P = 2750 Pa. The investigation revealed that, in relation to PEC, perforated structures had superior performance compared to other pin designs, except for the square-section pin structure. This research found that measuring the efficiency of a heat sink based just on thermal resistance or average temperature distribution is not enough; the PEC criteria must also be taken into account.

Transient simulations and theoretical modeling of near-junction heat conduction in GaN-on-diamond HEMT

Under high-power working conditions, accurate predictions of the maximum temperature and thermal resistance distribution in devices during transient states are essential for monitoring the health status of the devices. In this work, the heat conduction characteristics of GaN-on-diamond high electron mobility transistors (HEMTs) near the junction region under transient conditions with thermal impedance are systematically investigated with the aid of finite element simulations and thermal impedance analyses. The effects of pulse characteristics, thermal properties of different layers on the maximum temperature and thermal resistance of the device are discussed specifically. The results show that pulse characteristics have a significant effect on the maximum temperature of the device. The shorter the pulse switching time is, the higher the maximum temperature will be. Regarding the effects of the thickness of the GaN layer, the maximum temperature initially decreases and then increases, with the lowest maximum temperature observed at 1.7 μm. As the TBR increases uniformly from 10 to 40 m2K/GW, the temperature increases by approximately 4 % per 10 m2K/GW. The analyses on the thermal resistance show that the GaN layer occupies the largest proportion of thermal resistance, while the diamond substrate occupies the smallest. The optimal substrate thickness is obtained by analyzing the thermal penetration depth in the substrate for working conditions with various pulse widths. For diamond substrate, the optimal thickness at a pulse width of 5 μs is about 25 μm, and increases as the increase in pulse width. At the end, a modified Cauer RC model is proposed for predicting the transient maximum temperature based on heat spreading analysis. The difference between the maximum temperatures predicted by the model and the finite element simulations is within 8 %.

Performance simulation of novel heat pipe type phase change thermal storage device

Given that the performance of the phase change thermal storage device (PCTSD) is limited by the low thermal conductivity of the phase change material, more effective heat transfer structures should be developed to improve the thermal storage rate. In this paper, a novel micro heat pipe array (MHPA)–PCTSD with a highly rational heat transfer structure is proposed to understand the influence mechanism of the relative positions of the MHPA and heat transfer channel. The arrangement of the heat transfer fluid (HTF) channels on both sides of the MHPA (Type A) and the arrangement of the MHPA on both sides of the HTF channel (Type B) are numerically modeled in three dimensions, and the thermal storage performance is analyzed. Results show that Type B has a significant advantage over the traditional heat pipe PCTSD and Type A, which can obtain better temperature uniformity and more reasonable thermal resistance distribution. Moreover, its total thermal resistance and melting time are 17.4% and 21% lower than those of Type A, thus confirming its higher optimization potential.

Numerical optimization and experimental validation of vapor chambers having an outwardly protruding boss

The purpose of vapor chamber (VC) is to spread heat from small concentrated heat sources. In practice, a protruding boss surface on the VC is used to meet the layout of printed circuit board assembly. This study numerically examines the effect of outwardly protruding boss on the performance of the VC subject to various geometrical design parameters under varying heat load conditions. The overall thermal resistance, spreading resistance, and temperature distribution are monitored to characterize the thermal performance. The experimentally validated numerical model is used to undertake parametric studies of the VC. It is found that the compound pillars and the area ratio in the boss region have significant effect on the thermal performance of the VC. The shape of compound pillars in the peripheral region, and the impact of the height of the vapor region are also studied. Pillar diameter and the number of pillars in the boss region impose the maximum effect on the performance of the VC as they directly influence the evaporative heat transfer and the surface temperature. The optimal design based on the compound pillar structures and area ratio in the boss region reduces overall thermal and spreading resistances by 18.2% and 18.9%, respectively.

Experimental study on the thermal performance of a liquid-cooled heat sink integrating heat pipes for dual CPU servers

The increasing power consumption of server CPUs poses a challenge for data center cooling. In this work, a liquid-cooled heat pipe heat sink (LHPHS) with compactly arranged heat pipes is designed and fabricated for CPU cooling in dual CPU servers. Water is selected as the working fluid in the heat pipes. Experiments are conducted to explore the heat dissipation potential of LHPHS under high inlet coolant temperature and high heat load conditions, and to investigate the operational stability of LHPHS under the conditions of uneven heat generation between two CPUs. Furthermore, a one-dimensional thermal resistance network and numerical model of the LHPHS are established to quantitatively analyze the thermal resistance distribution of LHPHS and the variation of thermal resistance with coolant flow rate. The results show that, firstly, the LHPHS operates stably under high inlet coolant temperature and high heat load conditions, meeting the heat dissipation requirements of up to 37.5 W/cm2 with a coolant flow rate of 1 L/min and inlet coolant temperature of 35℃. Secondly, the LHPHS exhibits excellent performance in controlling temperature difference between CPUs and even when there is discrepant heat generation between them. Thirdly, the LHPHS performs a low thermal resistance, measuring 0.044 ℃/W at a coolant flow rate of 0.5 L/min, and this resistance further decreases as the flow rate increases. Additionally, it is observed that the thermal resistance of the liquid-cooled plate decreases with the increasing flow rate, and heat transfer within the heat pipes becomes a critical aspect under high coolant flow rates. Therefore, reducing the thermal resistance of the heat pipe is crucial for the thermal performance improvement of the LHPHS.

Investigation of thermal conductivity and thermal performance of heat pipes by structurally designed copolymer stabilized ZnO nanofluid

The present study concentrated on estimating the thermal conductivity, stability, efficiency, and resistance of a heat pipe for heat exchangers, which were essential for many industrial applications. To achieve this, copolymer of amphiphilic poly (styrene-co-2-Acrylamido-2-methylpropane sulfonic acid) poly (STY-co-AMPS) was synthesized by free radical polymerisation technique. The dispersant were used for homogeneous solution and stabilization of ZnO nanofluids. The effect of dispersant on the thermal conductivity of nanofluids was analysed using a KD2 pro thermal property analyser. There is a significant increase in fluid conductivity had a nonlinear relationship with the volume fraction. The maximum enhancement was observed at an optimized concentration of dispersant at 1.5 vol%. Same time, the influence of dispersant agent on the thermal conductivity of nanofluids were compared with linear polyelectrolytes. Further, the experimental values were compared to the existing classical models based on the reasonable aggrement, the prepared nanofluids were employed as a working medium. The conventional screen mesh heat pipe and the temperature distribution to the thermal resistance of the heat pipe was investigated experimentally. The result shows, optimum concentration of dispersants on nanoparticles exhibits an enhanced heat efficiency as compared with the base fluids. Further, the thermal resistance and temperature distribution show decreased behaviour by increasing the particle volume fraction and dispersant concentration.

A numerical investigation of hydrogen impingement-effusion array jet for a heat sink cooling using solid/porous fins: A thermo-hydrodynamic analysis

Increasing the aim of hydrogen use as fuel in vehicles motivates applying it to other critical requirements, such as cooling, owing to its thermal properties. Therefore, the effect of applying hydrogen impingement jets for cooling a hot surface of electrical devices, such as a prismatic battery, is investigated in this numerical study. The dependent variables are the volumetric flow rate, the jet distance from the target to the jet diameter, the coolant type, and the fins configuration, called in-line and staggered, and types, as solid or porous. The convective heat transfer coefficient, thermal resistance, pressure drop, and temperature and velocity distribution for the studied cases are considered. The simulation is conducted using the SST k-ω turbulence model, SIMPLE algorithm, and second-order method for discretization differential equations. Applying hydrogen as the coolant decreases the maximum temperature up to 2% and increases heat transfer by about 10%, while it mitigates the pressure drop by a factor of 1/12 if compared to air coolant. Further, inserting porous fins improves heat transfer by about 10% and 17%, respectively for air and hydrogen coolant in comparison with the case without fins. The fin decreases the temperature on the root and makes the recirculation zones.

Microscale mapping of thermal contact resistance using lock-in thermography

This paper proposes a new thermal contact resistance distribution measurement method using lock-in thermography. This method was used to evaluate a two-dimensional local thermal contact resistance distribution. To be able to measure the distribution, a uniform intensity laser heating system was developed. The developed system has a top-hat intensity distribution with a diameter of 30 mm. By combining this heat source and the lock-in thermography, a new measurement instrument was developed, which can evaluate local temperature behavior in the frequency domain, including the information of the contact interface in high spatial resolution of about 70 μm. Additionally, a new thermal contact resistance measurement principle was constructed based on a one-dimensional heat transfer equation that considers the reflected and transmitted temperature waves at the boundary and contact interface. The thermal contact resistance was acquired as a solution to the inverse problem of the temperature response done by fitting analyses. The validation of this method was performed quantitatively with two samples made of two bonded isotropic graphite plates. The one sample has an intentional defect area that has a slightly higher thermal resistance. The other sample has the known thermal contact resistance value measured with a validated method. Based on the results, the measurement value agreed with the referenced value. Also, the defect area was quantitatively detected clearly as a high thermal resistance region. Furthermore, as a practical example, the measurement method was applied for two different contact interface roughness samples consisting of aluminum alloys and thermal grease. Consequently, it was revealed and visualized that the contact interface with a rough surface has a high thermal resistance spot.

Experimental investigation of aluminum fins on relative thermal performance of sintered copper wicked and grooved heat pipes

Heat pipes are one of the most modern thermal devices used for high heat flux applications like fuel engines and thermal boilers to hydrogen storage tanks etc. Various kinds of thermal performance enhancement techniques have been employed to increase heat transfer through these pipes. For this purpose, manufacturing of a finned heat pipe is one of the famous techniques which maximizes heat transfer and increases operating range of heat pipes too. This study compiles the experimental results; 1) of installing Aluminum fins on the condenser section of heat pipes, 2) and a comparison between finned and finless distilled water based sintered wicked as well as grooved heat pipes, by keeping all other parameters same. The distribution of surface temperatures, thermal conductivity and thermal resistance is considered for comparison purposes. It is clearly observed that power surface temperature has an inverse relationship with the evaporator thermal resistance that is; if the power surface temperatures increases then the evaporator thermal resistance decreases. Also, installation of fins is more significant in sintered heat pipes as compared to grooved heat pipes. Due to installation of fins, there is an increase in the operating range which was observed 47% for sintered heat pipes and 30.1% for grooved heat pipes, when compared at 20 W. It has also been noted that the thermal conductivity of sintered heat pipes increased up to 73.2% due to the installation of fins and unexpectedly decreased up to 58.8% in case of grooved heat pipes. Thermal resistance of finned sintered heat pipes was 42% lower than finless type, and surprisingly it has increased up to 1.43 times in grooved heat pipes. Finally, a through comparison of finless sintered and grooved heat pipes results that finless grooved heat pipe shows the best performance and up to a 4.7% lower evaporator surface temperature was observed.

Simulation and optimization of the waste heat recovery system of the ship power system based on the heat current method

AbstractWaste heat recovery technique is of great importance to improve the coefficient and reduce the emission of greenhouse gas for ship power system. This paper builds the model of a waste heat recovery system of single pressure Rankine cycle with heat current method. Combining with the thermo‐electrical analogy method, the global heat current model of waste heat recovery system is obtained, which indicates the direction of heat flow, the distribution of thermal resistance and the relationship of temperatures. Applying the law of Kirchhoff builds a mathematical model of a system with no intermediate nodes temperatures. Considering the variation of physical property and distribution of thermal resistance in phase change heat exchanger, a double nested iteration solving algorithm is proposed. The results show that the heat transfer rates of economizer, superheater evaporator, condenser, and steam receivers are 9.1, 70.42, 143.89, 19.03, 171.98, and 17.28 kW, respectively. With the objective of maximum output of turbine, applying the genetic algorithm obtains the optimal mass flow rate of cycle water, which is 0.53 kg/s and improves the output of turbine from 53.25 to 147.45 kW. Discussions on the optimization model show that decreasing extraction ratio and increasing the mass flow rates of air discharge of compressor will increase the output work of turbine. Both the optimal mass flow rate of cycle water and maximum output work decrease rapidly at first and then change little while the circulation ratio increases. Particularly, the relative variations of mass flow rate and output work are less than 2% while the circulation ratio is larger than 4.

Thermal performance of an ultra-thin flat heat pipe with striped super-hydrophilic wick structure

• The UTFHP with striped super-hydrophilic wick structure was developed. • The mesh number of N = 200 and passage width of P = 1.5 mm is the best wick structure. • The UTFHP could tolerate 8 W heating load with the minimum thermal resistance of 0.26 K/W. The development of high-performance electronic devices requires high heat transfer components with small thickness and high thermal performance. This paper presented an ultra-thin flat heat pipe (UTFHP), and the total thickness and inner height is respectively 0.68 mm and 0.48 mm. The striped-channel structure was developed to withdraw the deformation of UTFHP and reduce the flow resistance. In order to improve the capillary performance of mesh wick, the oxidation treatment was finished by the thermal oxidation method. The thermal performance of UTFHPs was investigated under natural convection cooling condition. The effects of mesh structure, passage width and filling ratio on the thermal resistance and temperature distribution were analyzed. It is found that the UTFHP with mesh number of N = 200 and passage width P = 1.5 mm showed the best thermal performance under the filling ratio of φ = 57%. The minimum thermal resistance was 0.26 K/W with a maximum temperature of 74.07 °C at 8 W heating load, indicating that the proposed UTFHP was able to be a reliable candidate for the thermal management of electronic devices with high heat transfer rates.

Preparation of polybutylene terephthalate/artificial marble wastes composites with simultaneously enhanced thermal, crystallization, and impact properties by in situ polymerization

The treatment of artificial marble wastes (AMWs) is a difficult aspect of the artificial marble industry and has enormous impacts on the environment. Herein, a series of polybutylene terephthalate (PBT)/AMWs composites were prepared by in situ polymerization. The effects of AMWs content (1–10 wt%) on the thermal stability, crystallization rate, and impact strength of the PBT/AMWs composites were investigated in detail. The results showed that the composites containing 10 wt% of AMWs exhibited the best performance. Due to the high thermal resistance and uniform distribution of the AMWs particles, the heat deflection temperature reached 67.40°C with optimal thermal stability. Additionally, under heterogeneous nucleation, the crystallization rate was also the highest, and impact strength reached 17.29 kJ/m2 due to the partial core-shell structure and hardened matrix effects of the AMWs particles.

Investigation of interface profiles in meshed wicks and related evaporation characteristics

The porous wick in a heat pipe determines the working fluid capillary replenishment ability and heat transfer process. To study the evaporation characteristics of meshed wicks fabricated with wires of micron-scale, a mathematical model based on the augmented Young-Laplace equation and molecular kinetic theory to predict the evaporation interface profile is developed, and the Marangoni effect and slip velocity in the boundary are considered. The evaporation interface can be divided into the thin-film region and intrinsic meniscus region according to the ratio of capillary pressure and disjoining pressure. A new solution method considering the constraints at the intersection of the two regions to obtain the interface profile is proposed and validated. Based on the two-dimensional results, the area and heat transfer rates of the two regions formed in the meshed wicks are calculated by integrating along the four side wires. Then, the evaporation characteristics of the thin-film region, including the pressure and thermal resistance distribution, are studied. Finally, the influence of the Marangoni effect, superheat, wire spacing, interface pressure difference and slip velocity on the interface profile and heat transfer of these two regions are discussed.

Research of the thermal interface of LED lighting sources by thermal relaxation differential spectrometry (TRDS)

Thermal relaxation differential spectrometry (TRDS) was used to study the thermal parameters of samples with various design features for heat removal - a powerful LED lamp (150 W) used in industrial and street lighting, low power LED lamps (4 W) with filament emitters, as well as SMD emitter. It is shown that the method of thermal relaxation differential spectrometry is effectively applicable to the study of the structure of thermal parameters of both high-power and low-power LED devices. The method is informative and allows to study in the distribution of thermal resistance and heat flux over the volume and layers of the LED device detail. The use of the TRDS method allows the optimization of the thermal design of LED devices to reduce the overheating temperature of their active regions, and, therefore, to reduce the degradation of LED devices.

Engineering a superinsulating wall with a beneficial thermal nonuniformity factor to improve building energy efficiency

To increase the energy efficiency of buildings and lower carbon emissions, heat losses through exterior walls could be considerably decreased by using high-performance thermal insulation materials with superlow thermal conductivities or superhigh heat capacities. A superinsulating layer would result in a highly nonuniform distribution of thermal resistance and capacitance within the exterior wall. An interesting problem concerns how to engineer the nonuniform thermal distribution for given total resistances and capacitances to improve energy efficiency. This paper proposes using a thermal nonuniformity factor to quantitatively characterize the nonuniform distribution of thermal resistance and capacitance in an exterior wall built with superthermal aerogel insulating panels and given total resistance and capacitance values. Various thermal nonuniformity factors for several insulation modes were investigated by calculating the relevant transmission loads through the walls. The effect of the thermal nonuniformity factor on the wall transmission load was explored to improve the energy efficiency of a building. The results indicated that the wall heat flux could be greatly decreased by engineering walls with a high nonuniformity factor. For instance, engineering a wall in a sandwich mode with thermal nonuniformity factor of 0.97 could decrease the wall heat flux by ∼35% compared to a uniform wall. These findings on engineering walls based on thermal nonuniformity factors to decrease the wall heat flux could be a useful reference for superinsulated buildings and for further improving thermal insulating performance and building energy efficiency.

A detailed mathematical model and experimental validation for coupled thermal and electrical performance of a photovoltaic (PV) module

Photovoltaic (PV) performance fluctuates greatly due to varying meteorological, physical, and operational conditions. Therefore, there is a need to develop accurate predictions without unjust simplification of how it will perform in real conditions. In this paper, a detailed mathematical model was developed to determine the thermal and electrical parameters of a PV module under transient conditions. The model simultaneously solved a thermal model based on thermal resistance circuit and an electrical model based on an equivalent electrical circuit. In order to evaluate the proposed model in a wider way, the experimental validation was made by taking into account different meteorological conditions. The root mean square error (RMSE) and mean bias error (MBE) values of the solar cell temperature for a winter day were 1.341 ℃ and 1.916%, respectively. For a summer day, these values were 1.296 ℃ and 0.855%, respectively. The RMSE and MBE values of the power output for a winter day were 5.094 W and −0.022%, respectively. For a summer day, these values were 3.913 W and −2.499%, respectively. Experimental validation showed that the errors in the proposed model were within an acceptable level. The model was then implemented to investigate the distribution of thermal resistance in the PV module. The results show that the radiative thermal resistance for the winter and summer days is 80.3% and 70.7% of the total thermal resistance, which includes conduction, convection, and radiation, respectively, while the conductive thermal resistance has a negligible effect on the total resistance. A long-term evaluation of the model was used to examine the highest temperatures and electrical power output that the PV module can reach in various weather conditions. According to the findings, the wind speed was not dominant in effecting the cell temperature compared to the solar radiation and ambient temperature. As the intensity of solar radiation got higher, less electrical power was produced than its capacity due to an increased cell temperature. Finally, it was compared with previous models in the relevant literature to investigate the effect of different approaches. Accordingly, it is revealed that the proposed model provides a significant improvement in both the cell temperature and power output prediction.