A poly-silicon gate electrode can be considered as a distributed RC line. The delay induced by this RC time constant can become a limitation in designing high-speed VLSI's. This effect, called the gate electrode RC delay effect (GERDE), is studied for short-channel MOSFET's. A simple formula is derived to roughly estimate the GERDE, which can be used as a rule-of-thumb in VLSI design. An approximation of the GERDE by a simple lumped-circuit model is also described. The future trends of the GERDE are investigated and it is concluded that the GERDE gets more severe for shorter channel MOSFET's, but, if the gate width is confined up to 30 µm, the GERDE can be neglected for MOSFET's with a channel length of more than 0.8 µm. For a large conductance, division of the MOSFET width is shown to be effective through experiments.
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