Copper-tin (Cu–Sn) serves as a prevalent alloy system in electronic packaging, envisioned for future high-power device applications. However, interdiffusion in Cu–Sn yields rigid and brittle Cu6Sn5 and Cu3Sn phases, causing joint hardening and embrittlement. This paper introduces a novel, non-homogeneous Cu–Sn composite employing heterostructure design. Through room temperature in-situ compression tests and molecular dynamics (MD) simulations, we investigate mechanical property degradation origins and Cu–Sn composite strength-ductility mechanisms. Our findings reveal hierarchical heterostructures in joints stimulate dynamic stress distribution at interfaces, generating a high density of geometrically necessary dislocations (GNDs). This enhances the material's work-hardening rate and imparts robust strain-hardening capabilities. This unique structural feature has altered the interaction between dislocations and interfaces, thereby effectively promoting the formation and driving force of dislocations. The combined effects of strain inhomogeneity induced by soft and hard phases, along with a hybrid mechanism involving stacking faults (SFs), Lomer-Cottrell (L-C) locking, and dislocation bypassing and shearing, realize exceptional strength-ductility synergies in Cu–Sn composite joints. This study presents a promising paradigm for designing microstructures in high-strength, deformable, and high-temperature-resistant soldered composites.
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