The accumulation and retention of hydrogen isotopes in the deposited films that are formed as a result of ion sputtering of the plasma-facing materials of tokamaks is a topical problem in fusion. In the research described here, the accumulation of deuterium in tungsten films under deuterium plasma irradiation was studied. Tungsten films 50 nm in thickness were deposited on substrates with different deuterium solubilities (W, Ni, Cu). The profiles of deuterium concentration in near-surface layers were determined by means of secondary ion mass spectrometry and residual gas analysis. It is shown here that deuterium concentrations in tungsten films deposited on different substrates are the same, and are higher than those in polycrystalline tungsten by a factor of ∼2. The total amount of retained deuterium depends on the substrate material. In the W–W system it is higher than that in W–Ni and W–Cu systems. The effect of oxide films on deuterium accumulation is also discussed.