AlN films with low-dislocation density and flat surfaces were grown by metalorganic vapor phase epitaxy (MOVPE) on nano-patterned sapphire substrates (NPSSs) with face-to-face annealed sputtered AlN (FFA Sp-AlN) as an initial layer. Dislocation annihilation mechanisms and coalescences of AlN layers were studied by transmission electron microscopy (TEM), atomic force microscopy (AFM) and X-ray rocking curve (XRC) measurements. From cross-sectional TEM images, the coalescence thickness was obtained to be 1.2 µm. This thickness is thinner than that for MOVPE-grown AlN films on NPSS without FFA Sp-AlN. AFM images revealed that atomically flat surfaces can be obtained from the samples with thicknesses above 3 μm. From XRC full width at half maximum values, the screw- and edge-dislocation densities of the 5-μm-thick AlN film on FFA Sp-AlN/NPSS were calculated to be 4 × 107 cm−2 and 6 × 108 cm−2, respectively. This edge-dislocation density, i.e., the dominant threading dislocation density, is approximately the same to that of AlN films grown on FFA Sp-AlN/flat-sapphire substrates (FSSs). These results show promise that FFA Sp-AlN is applicable not only for FSSs but also for NPSSs as the method for growing high-crystalline-quality AlN film.
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