There has been increasing demand for FOPLP package, due to its high performance compared to conventional rigid substrate package and low cost compared to FOWLP package. To achieve high yield using FOPLP process, warpage was the most serious problem. Warpage of the panel results in poor pattern accuracy and reduced yield of package, and warpage of the panel was often severely increased by molding. So low warpage mold was highly needed. To reduce warpage, we have developed novel low warpage mold films. Mold factors related to warpage were mainly curing shrinkage, CTE mismatch and elastic modulus. Conventional powder type mold and liquid type mold showed high cure shrinkage and high elastic modulus thus its often-showed high warpage. We adopted film instead of powder or liquid to reduce mold curing shrinkage. And we reduced elastic modulus of the mold film by considering proper formulation with keeping its CTE low. The film showed very low warpage in case laminating Si wafer, Cu foil, PI film and glass. We have also developed novel photo imageable film for RDL, and it showed very low warpage compared to conventional liquid type photo imageable polyimide. Using these two materials, Taiwan ITRI had made and presented FOPLP on glass substrate which had 5 layers RDL and mold, and it showed very low warpage.
Read full abstract