AbstractIntegration of complementary logic circuits using 2D layered MoS2 can overcome the fundamental device limitations of silicon‐based Complementary metal–oxide–semiconductor (CMOS) technology. For the high functionality of complementary MoS2 logic circuits, realizing high‐current p‐channel MoS2 field‐effect transistors (p‐FETs) is essential yet quite challenging. Herein, passivation of surface defects of MoS2 by atomic oxygen is proposed theoretically by ab initio simulations in favor of mitigating the Fermi level pinning. Experimentally, an atomic layer passivation (ALP) technique combined with a slow metal‐deposition strategy is developed to reduce contact resistance to p‐channel MoS2 and report a more than tenfold increase in the contact hole conductance. The fabricated p‐channel MoS2 FETs achieve a record high saturation current of 45 µA µm−1 with a 0.7 µm channel length under a VDS of −1 V. With these techniques, an electron–hole pairing in MoS2 similar to the Si counterpart is achieved for complementary circuit applications. An on‐chip integrated MoS2 inverter with Pt electrodes is demonstrated with a high gain of 20 at 3 V supply.
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