This study investigates the impacts of various heat sink design parameters on the thermal dissipation performance of semiconductor packages using a heat sink as the thermal solution. A multiphase finite volume model was developed for heat transfer simulations to determine the heat sink and junction temperatures of the semiconductor assembly. Additionally, a heat transfer experiment was conducted to measure these temperatures over time. The numerical predictions closely matched the experimental results, with a maximum disparity of 0.26 % for junction temperature and 0.42 % for heat sink temperature, confirming the reliability of the numerical model. The results revealed that pin fin heat sinks demonstrated marginally superior thermal performance, reducing the junction temperature by 0.05 % compared to parallel heat sinks. Increasing the base area from 20x20 mm² to 50x50 mm² resulted in a significant 31.64 % reduction in junction temperature and a corresponding reduction in heat sink temperature from 60.41 °C to 36.42 °C. Extending fin height from 10 mm to 50 mm led to an 18.73 % decrease in junction temperature and a reduction in heat sink temperature from 46.07 °C to 34.56 °C. Enhancing the base thickness from 2 mm to 15 mm achieved a 24.35 % reduction in junction temperature and a decrease in heat sink temperature from 63.2 °C to 44.05 °C. The study concludes that optimizing these design parameters can substantially enhance heat dissipation, improving the reliability and efficiency of semiconductor devices.
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