AbstractPhenolic resins [commercial (CP), pure (PP), and woodflour‐filled (WP)] containing different levels of hexamine, were evaluated in terms of curing behavior as well as thermal, electrical, and mechanical properties. The degree and rate of curing increase markedly with the rise of the hexamine content; however, the dielectric constant, dielectric loss, and dissipation factor decrease gradually. Dielectrical values decrease with the increase of the applied frequency. When the ratios of hexamine to phenolics are increased, samples become harder and experience increased molding shrinkage. With the increase of molding time or temperature, the surface hardness and molding shrinkage improve. The optimal hexamine contents of WP and PP are determined with respect to the above properties.