Wedge wire bonding is a solid-state joining process that uses ultrasonic vibrations in combination with compression of the materials to establish an electrical connection. In the battery industry, this process is used to interconnect cylindrical battery cells due to its ease of implementation, high flexibility and ease of automation. Wire materials typically used in battery pack manufacturing are pure or alloyed aluminum and copper. While copper wires possess better electrical properties, the force used in the bonding process can lead to cell isolator damage and cell thermal runaway. This is an unacceptable result of the bonding process and has led to the development of new types of composite wires containing a copper core embedded in an aluminum shell. This material has the advantage of high copper electrical and thermal conductivity combined with less aggressive bonding parameters of the aluminum wire. The aim of this study was to establish a process window for the wedge wire bonding of 400 µm composite copper–aluminum Heraeus CucorAl Plus wire on the surface of a BAK 18650 battery cell. This study was conducted using a Hesse Bondjet BJ985 CNC wire bonder fitted with an RBK03 bond head designed for the bonding of copper wires. The methods used in this study included light and scanning electron microscopy of bond and battery cell cross-sections, shear testing on the XYZtec Sigma bond tester system, and energy dispersive spectroscopy. The results were compared with a previous study conducted using a wire of the same diameter and made out of high-purity aluminum.