Custom Integrated Circuits Conference Research Articles

Guest Editorial Special Section on the 2011 IEEE Custom Integrated Circuits Conference (CICC 2011)

The eleven papers in this special section are expanded versions of papers presented at the Custom Integrated Circuits Conference (CICC 2011), held in San Jose, CA, in September 2011. The papers are grouped into three broad areas: analog,digital/memory, and RF circuits.

Introduction to the Special Issue on the IEEE 2011 Custom Integrated Circuits Conference

This special issue comprises 13 papers selected from the 2011 IEEE Custom Integrated Circuits Conference (CICC). The issue spans contributions in RF/wireless, high-speed I/O, and analog/mixed-signal including PLLs, data converters, and power management. The selected papers demonstrate state-of-the-art performance in power, area, or integration along with innovative circuit implementations and techniques.

Guest Editorial Special Section on 2010 IEEE Custom Integrated Circuits Conference (CICC 2010)

The ten papers in this special section were selected from the 2010 IEEE Custom Integrated Circuits Conference (CICC) held in San Jose, CA, in September 2010.

Introduction to the Special Issue on the 2010 IEEE Custom Integrated Circuits Conference

The 15 papers in this special issue were selected from the 2010 IEEE Custom Integrated Circuits Conference (CICC). The issue spans contributions in RF/wireless, high-speed I/O, and analog/mixed signal including PLLs, data converters, and power management. The selected papers demonstrate state-of-the-art performance in power, area, or integration along with innovative circuit implementations and techniques.

Guest Editorial Special Section on 2009 IEEE Custom Integrated Circuits Conference

The six papers in this special issue were originally presented at the 2009 IEEE Custom Integrated Circuit Conference (CICC), held in San Jose, CA, September 13-16, 2009.

Introduction to the Special Issue on the IEEE 2009 Custom Integrated Circuits Conference

The 19 papers in this special issue were selected from presentations made at the 2009 IEEE Custom Integrated Circuits Conference (CICC). The issue includes contributions in mixed-signal and analog design, wireless, RF, and millimeter-wave integrated circuit design, digital IC design, as well as integrated test techniques and power management.

Guest Editorial Special Section on 2008 IEEE Custom Integrated Circuits Conference

The nine papers in this special section are selected from papers presented at the 2008 IEEE Custom Integrated Circuits Conference (CICC), held in San Jose, CA, from September 21-24, 2008.

Introduction to the Special Issue on the 2008 IEEE Custom Integrated Circuits Conference

The 15 papers in this issue cover a wide range of technical areas, including wireless, RF, and millimeter-wave integrated circuit design, mixed-signal and analog design, system in package, process variation, limiting standby power and integrated power regulation.

Custom Integrated Circuits Conference 2009 (CICC)

Custom Integrated Circuits Conference 2009 (CICC)

Custom Integrated Circuits Conference 2009 (CICC)

Custom Integrated Circuits Conference 2009 (CICC)

Introduction to the Special Issue on the IEEE 2007 Custom Integrated Circuits Conference

This special issue of the IEEE Journal of Solid-State Circuits is a selection of papers published in the IEEE 2007 Custom Integrated Circuits Conference (CICC). The issue consists of 14 papers that cover a wide range of technical areas, including wireless and RF circuit design, mixed-signal and analog design, digital IC design, integrated power regulation, memory design and biological applications of IC technology. The selected papers demonstrate state-of-the-art performance in power, area, or integration along with innovative circuit implementations and techniques.

Custom Integrated Circuits Conference (CICC) Celebrates 30th Year, More than 400 Expected on 21-24 September in San Jose

Custom Integrated Circuits Conference (CICC) Celebrates 30th Year, More than 400 Expected on 21-24 September in San Jose

Introduction to the Special Issue on the IEEE 2006 Custom Integrated Circuits Conference

The 17 papers in this special issue cover a wide range of technical areas, including wireless and RF circuit design, mixed-signal and analog design, digital IC design, integrated power regulation, integrated test techniques, MEMS and biological applications of IC technology. The papers were part of the IEEE 2006 Custom Integrated Circuits Conference (CICC).

Custom Integrated Circuits Conference

Custom Integrated Circuits Conference

2007 IEEE Custom Integrated Circuits Conference (CICC 07) in San Jose, Showcase for Circuit Design in the Heart of Silicon Valley on 16–19 September

2007 IEEE Custom Integrated Circuits Conference (CICC 07) in San Jose, Showcase for Circuit Design in the Heart of Silicon Valley on 16–19 September

Introduction to the Special Issue on the IEEE 2005 Custom Integrated Circuits Conference

Introduction to the Special Issue on the IEEE 2005 Custom Integrated Circuits Conference

Custom Integrated Circuits Conference (CICC 2006)

Custom Integrated Circuits Conference (CICC 2006)

Wide area microprobe analyser (WAMPA)

Wide area microprobe analyser (WAMPA) represents a new scientific instrument concept for planetary exploration. WAMPA builds on recently published research such as sensor webs and distributed microsensors [The sensor web: a new instrument concept, SPIE Symposium on Integrated Optics, 20–26 January 2001, San Jose, CA; Design considerations for distributed microsensor systems, Proceedings of the IEEE 1999 Custom Integrated Circuits Conference (CICC ’99), May 1999, pp. 279–286] but adds new sensor and localisation concepts. WAMPA is driven by the recurrent theme in spacecraft and sensor design to achieve smaller, lighter and lower cost systems. The essential characteristics of the WAMPA design that differentiates it from other space science instruments are that WAMPA is both a wide area instrument, consisting of a distributed set of sensors, and that each probe is designed to use little, if any, power. It achieves the former by being utilised in large numbers ( > 10 ) , requiring that the individual probes be low mass ( < 100 g ) and low volume ( < 10 cm ) . It is envisaged that the probes would be dispersed by landers or rovers as mission support instruments rather than primary science instruments and would be used in hostile environments and rugged terrains where the lander/rover could not be risked (see Fig. 1).

Introduction to the Special Issue on the IEEE 2004 Custom Integrated Circuits Conference

Introduction to the Special Issue on the IEEE 2004 Custom Integrated Circuits Conference

IEEE Custom Integrated Circuits Conference

IEEE Custom Integrated Circuits Conference