Current Gain Cutoff Frequency Research Articles

Thin channel Ga2O3 MOSFET with 55 GHz fMAX and >100 V breakdown

This Letter reports a highly scaled 90 nm gate length β-Ga2O3 (Ga2O3) T-gate MOSFET with a power gain cutoff frequency (fMAX) of 55 GHz. The 60 nm thin epitaxial Ga2O3 channel layer was grown by molecular beam epitaxy, while the highly doped (n++) source/drain regions were regrown using metal organic chemical vapor deposition. Maximum on current (IDS,MAX) of 160 mA/mm and trans-conductance (gm) around 36 mS/mm were measured at VDS = 10 V for LSD = 1.5 μm device. Transconductance and on current are limited by high channel sheet resistance (Rsheet). Gate/drain breakdown voltage of 125 V was measured for LGD = 1.2 μm. We extracted 27 GHz current gain cutoff frequency (fT) and 55 GHz fMAX for 20 V drain bias for unpassivated devices. While no current collapse was seen initially for both drain and gate lag measurements for 500 ns pulse, moderate current collapse was observed after DC, RF measurements caused by electrical stressing. We calculated a high fT. VBR product of 3.375 THz V, which is comparable to the state-of-the-art GaN HEMTs. This figure of merit suggests that Ga2O3 could be a potential candidate for X-band application.

N‐polar deep‐recess GaN MISHEMT with enhanced ft·LG by gate dielectric thinning

AbstractThe authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacitance and transconductance was established, resulting in an improved current gain cutoff frequency times gate length (ft·LG) figure of merit compared to standard Schottky‐gate and metal‐insulator‐semiconductor (MIS) HEMTs. The etched gate dielectric MISHEMT demonstrated a maximum ft·LG of 15.0 GHz·µm for an LG of 100 nm.

RF linearity and improved transconductance of ScAlN/GaN HEMT with novel inverse L-shaped gate structure

In this study, we investigate the enhancement of effective transconductance and gain linearity in submicrometer gate AlGaN-barrier-based transistors utilizing ScAlN/GaN coupling-channel structures. A novel asymmetric gate design, incorporating an AlGaN cap on ScAlN/GaN HEMT, is proposed. This configuration demonstrates a flat transconductance profile and significantly reduced transconductance derivative, thereby improving the linearity of GaN-based transistors. For transistors with a gate length of 0.5 μm, both the current gain cut-off frequency and power gain cut-off frequency are measured at 53.52 GHz and 72.98 GHz, respectively. These values represent a more than threefold increase from the corresponding frequencies of conventional devices. Moreover, the theoretical Output Third-Order Intercept value of the proposed structure has increased by 7.5 dBm compared to conventional HEMTs. This superior linear performance can be attributed to the combined effect of AlGaN cap layer and air cavity. Furthermore, the introduction of the ScAlN layer results in a substantial impact, including a decrease in electron concentration from 4.96 × 1019/cm3 to 1.98 × 1019/cm3 and an increase in electron velocity from 4.5 × 107 to 7.6 × 108 cm/s. These findings underscore the potential of the proposed device for high-frequency applications requiring superior linearity.

Enhanced Performance of GaN HEMTs in X‐band Applications Using SixN/Si3N4 Bilayer Passivation Technique

In order to achieve high‐performance gallium nitride (GaN) high‐electron‐mobility‐transistors (HEMTs) capable of operating in the X‐band, a bilayer passivation technique is employed. The technique involves creating a stacked passivation layer consisting of a 20‐nm Si‐rich silicon nitride (SixN) passivation layer and a 100‐nm N‐rich silicon nitride (Si3N4) passivation layer. This effectively reduces radio frequency scattering in GaN HEMTs without compromising the breakdown voltage (BV). On the one hand, the SixN passivation layer effectively suppresses the surface states of devices, resulting in low current collapse. On the other hand, the Si3N4 passivation layer can effectively reduce gate leakage caused by the SixN passivation layer, allowing the device to reliably operate at higher voltages. Consequently, a GaN HEMTs with SixN/Si3N4 bilayer passivation achieve a low current collapse of 5% and a high BV of 157 V. The device features a current gain cutoff frequency (fT) and maximum oscillation frequency (fmax) of 57.9 and 96.8 GHz, respectively. Additionally, it exhibits excellent radio frequency performance in the X‐band, with an output power density (Pout) of 13.7 W mm−1 and power added efficiency of 60.8% at a drain voltage (VD) bias of 50 V.

Characteristics of β-(AlxGa1−x)2O3/Ga2O3 dual-metal gate modulation-doped field-effect transistors simulated by TCAD

β-(AlxGa1−x)2O3/Ga2O3 modulation-doped field-effect transistors (MODFETs) with a dual-metal gate (DMG) architecture are designed, and the electrical characteristics of the DMG device are investigated in comparison with the single-metal gate (SMG) device by the Technology Computer-Aided Design (TCAD) simulation. The results demonstrate that the DMG MODFETs possess a superior transconductance (gm), current gain cut-off frequency (fT), and power gain cut-off frequency (fMAX) than those of SMG transistors, which is attributed to the regulated channel electric field by a DMG structure. With a gate length of 0.1 μm, the peak values of fT/fMAX of the designed DMG MODFET are obtained as 48.6/50.6 GHz, respectively. Moreover, a comprehensive thermal analysis is conducted between the SMG and DMG devices under steady-state and transient conditions. The DMG MODFET exhibits a lower maximum temperature than the SMG counterpart due to the reduced channel electric field, each subjected to the same power dissipation. This finding underscores the potential of the β-(AlxGa1−x)2O3/Ga2O3 MODFET with the DMG architecture as a promising approach for high-power radio frequency operations.

Bias-dependent electron velocity and short-channel effect in scaling sub-100 nm InAlN/GaN HFETs

This work reports on the extraction and simulation of the electron velocity–gate voltages relationship for sub-100 nm InAlN/GaN heterojunction field-effect transistors (HFETs). A peak electron velocity (ve) at an electron density (ns) of 0.41 × 1013 cm−2 was observed at 1.06 × 107 cm/s in an InAlN/GaN HFET with 60 nm gate length (Lg) by delay time analysis. The ve at a high ns of 1.5 × 1013 cm−2 was observed at 0.6 × 107 cm/s. This peak ve behavior is explained by polarization Coulomb field (PCF) scattering and optical phonon scattering based on a Monte Carlo method. As Lg scaled from 350 to 60 nm, the current gain cutoff frequency (fT) and transconductance (gm) were improved. However, the thermal performance was degraded with a bad figure of merit P150 °C. Although a weakening of the control capability of Vgs on ns (Δns/ΔVgs) was observed in the shorter Lg device, which leads to a decrease in device gm, the larger electron velocity by the increased lateral electric field (E) and the larger Δve/ΔVgs by the increased PCF scattering still enhance the peak gm. Results indicate that the enhancement of Δve/ΔVgs is a vital method to strengthen the modulation of the gate on current and to suppress the short channel effect in GaN HFET. Our work supports a deeper understanding and analysis of sub-100 nm InAlN/GaN HFET device performance and physical mechanisms.

Improving RF characteristic and suppress gate leakage in normally-off GaN-HEMTs using negative polarization effect and floating gate for millimeter-wave systems

This article demonstrates the effect of reverse gradient barrier layer and floating gate structure on DC and RF performance of GaN-based HEMTs. In terms of power characteristics, using reverse gradient barrier and floating gate, the GaN-HEMTs with Lg of 240 nm and S-D spacing of 8.4 μm demonstrated the maximum drain current and peak transconductance are increased by 70 % and 15 % respectively, and the linearity of GaN based HEMT is greatly improved. Meanwhile, using the reverse gradient barrier layer, the gate leakage current is significantly reduced by nearly 1 to 5 orders of magnitude, and it is proved that the negative polarization effect has a certain effect on increasing the threshold voltage and breakdown voltage. In terms of RF characteristics, due to the existence of the floating gate, the parasitic capacitance is reduced and the frequency performance is improved. In addition, for both conventional and proposed HEMTs, this article proposes two equivalent capacitance models to optimize RF performance. As a result, the optimal structure offers approximately 10 and 7 times improvement in the current gain cutoff frequency (ft) and unilateral power gain cutoff frequency (fmax) (from 5.3 and 9.8 to 52 and 73.8 GHz, respectively). Additionally, the optimal structure exhibits outstanding scaling factors of 12.48 GHz·μm.

Effects of high-dose gamma-ray irradiation on an In0.53Ga0.47As high electron mobility transistor

We investigate the effects of gamma-ray (γ-ray) irradiation on an In0.53Ga0.47As high electron mobility transistor (HEMT). After γ-ray radiation, the irradiated HEMT shows degradation of the maximum transconductance (g m,max ), the unity current gain cutoff frequency (f T ), and the maximum oscillation frequency (f max)—about 12.8%, 18.0%, and 16.9%, respectively—because of an increase in on-resistance (Ron) in In0.53Ga0.47As HEMTs exposed to high-dose γ-ray radiation. Moreover, we obtain a minimum noise figure (NFmin) of about 1 dB from 8 to 40 GHz for the irradiated HEMT, which is a lower value compared to a non-irradiated HEMT; this is because the gate leakage current is reduced after γ-ray irradiation.

11.2 W/mm power density AlGaN/GaN high electron-mobility transistors on a GaN substrate

In this letter, high power density AlGaN/GaN high electron-mobility transistors (HEMTs) on a freestanding GaN substrate are reported. An asymmetric Γ-shaped 500-nm gate with a field plate of 650 nm is introduced to improve microwave power performance. The breakdown voltage (BV) is increased to more than 200 V for the fabricated device with gate-to-source and gate-to-drain distances of 1.08 and 2.92 μm. A record continuous-wave power density of 11.2 W/mm@10 GHz is realized with a drain bias of 70 V. The maximum oscillation frequency (f max) and unity current gain cut-off frequency (f t) of the AlGaN/GaN HEMTs exceed 30 and 20 GHz, respectively. The results demonstrate the potential of AlGaN/GaN HEMTs on free-standing GaN substrates for microwave power applications.

Novel T-Shaped Gate Structure of AlGaN/GaN HEMTs on Si for RF Application

Due to the high electron saturation velocity and breakdown electric field, GaN-based high electron mobility transistors (HEMTs) have been widely used in high frequency and power application, such as telecommunication, satellite communication, and radar system [1]. Since first demonstration of AlGaN/GaN HEMTs in 1993 [2], the RF performance of these device has continuously improved by the progress on epitaxy and device scaling technology [3].The current gain cut-off frequency (fT) and the maximum oscillation frequency (fmax) from the small-signal equivalent circuit of the HEMT are derived by the following equations [4].From these equations, it can be concluded that in order to achieve high frequency operation, HEMTs should be designed with a T-shaped gate structure that simultaneously achieves low gate resistance (Rg) and low parasitic capacitance (Cgs and Cgd). However, there are complex fabrication processes to form the T-shaped gate. Typically, the T-shaped gate structure is implemented through electron beam lithography process using a tri-layer resist such as PMMA/PMGI/PMMA, which requires multiple exposures or developments. Multiple exposures can cause overlay errors that can significantly affect the T-shaped gate with smaller gate lengths [5]. Also, it is difficult to obtain an undercut structure that enables a good lift-off and guarantees a high yield due to the need for precise dose control. In addition, since the T-shaped gate has an unstable structure in which a narrow foot supports the weight of a wide head, the gate may collapse during a subsequent process.In this work, we fabricated a novel T-shaped gate using the negative e-beam resist HSQ, which offers a simple T-shaped gate fabrication process. The HSQ that was exposed to e-beam is located underneath the gate head and on both sides of the gate foot in our novel T-shaped gate design, providing a robust structure. The HSQ-assisted gate HEMTs exhibit comparable DC/RF performance compared to conventional T-shaped gate HEMTs. Acknowledgement This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MIST) (No. NRF-2021M3C13097672).

Impact of Parasitic Gate Capacitance on RF Performance in GaN-Based HEMTs for X-Band Applications

GaN-based high-electron-mobility transistors (HEMTs) are intensively researched for high-power radio frequency (RF), low noise, and aerospace applications, thanks to their high breakdown electric field, high carrier mobility and density at the hetero-interface, and wide bandgap [1-2]. For the improvement of RF performance, various approaches have been reported, including T-gate structure [3-4], surface passivation [5], n+-regrown source and drain contact [6], thin barrier structure [7], and graded-channel [8]. Among them, the T-gate structure has been extensively employed for the reduction of the gate resistance (Rg ) and thereby improvement of the RF performance. However, the usage of the wide T-gate structure enlarges parasitic gate capacitance components, which deteriorates the RF performance. As a result, one should pay careful attention to the dimension of the wide T-gate structure to reduce Rg as much as possible, not to enlarge the parasitic gate capacitance components. This motivates us to explore the optimum dimension of the wide T-gate structure in GaN-based HEMTs for X-band RF applications.To investigate the detailed impact of the gate resistance and parasitic gate capacitance components, we fabricated LG = 0.15 μm GaN-based HEMTs with various dimensions of the T-gate head from 0.5 to 0.8 μm during an e-beam lithography process step. The unit gate width (WG ) and number of gate finger (NF ) were 100 μm and 2, respectively.For comparison of the device characteristics with respect to the dimension of the gate head, DC and RF measurements were conducted for the fabricated GaN-based HEMTs with various dimensions of T-gate head. The DC characteristics in terms of the threshold voltage (VTH ), the maximum transconductance (gm,max ), and the saturation drain current (Id,sat ) were almost identical, regardless of the dimension of the T-gate head. On the contrary, the current-gain cut-off frequency (fT ) and maximum oscillation frequency (fMAX ) were improved by 26.5% and 21.0%, respectively, when the T-gate head size was reduced from 0.8 to 0.5 μm.In an effort of explore the origin of the dependence of the T-gate head on the RF performance, we have carried out small-signal modeling to extract the parasitic gate capacitance and gate resistance components from the measured RF data. As the T-gate head size was reduced from 0.8 to 0.5 μm, the gate-source parasitic capacitance component (Cgs_par ) was reduced by 19%, while the gate resistance component was increased by 32%. In our device design and fabrication, it turned out that the reduction of Cgs_par was more beneficial than the increase of Rg , leading to the improved RF performance with the gate head size decrease.In this work, our systematic research revealed that, unlike earlier reports [3-4], the reduction of the parasitic gate capacitance was essential for the improvement of the RF performance as opposed to the reduction of the gate resistance in LG = 0.15 μm GaN-based HEMTs for X-band RF applications. Acknowledgement This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MIST) (No. NRF-2021M3C1C3097672).

Linearity improvement in graded channel AlGaN/GaN HEMTs for high-speed applications

AlGaN HEMTs are popular devices for high-frequency applications. At higher frequencies, nonlinearity effects are major concerns and need serious attention. In this work, we have attempted to improve the linearity performance of graded channel Al x Ga1−x N/GaN HEMTs in comparison with abrupt channel GaN HEMTs through Technology Computer Aided (TCAD) simulation. In graded channel HEMTs, linearly grading of Al composition in the AlGaN layer, reduces the local carrier densities and provides improvement in the carrier saturation velocity. This provides an avenue to improve the overall linearity performance. A complete set of figures of merits (FOMs) such as and for both devices are presented. The simulation results have been calibrated with reported experimental results available in the literature. The graded devices are observed to have better transconductance (g m ) and drain current for gate voltages greater than −2 V. The drop in g m is reduced by nearly 50% at the higher gate-to-source voltages. Moreover, the RF figure of merits such as the current gain cutoff frequency (f T) and a maximum frequency of oscillation (f max) have been calculated for both devices. Due to the graded channel f T increases by 20% and f max becomes twice which makes it a better choice for high-voltage and high-power applications. The impact of interface trap and leakage current performance on the graded channel device are also reported. The cutoff frequency reduces by 25% with an increase in trap charge concentration from 9e17 cm−2 to 1e19 cm−2. Also, it has been found that the graded channel device shows better linearity and lower intermodulation distortion in comparison to the abrupt device which has been calculated from the linearity parameters. The high gate leakage current in the case of the graded channel device can be reduced by adding a thin GaN cap layer on the AlGaN channel which can be a future prospect of improving the performance of the graded GaN device.

Influence of Gate Geometry on the Characteristics of AlGaN/GaN Nanochannel HEMTs for High-Linearity Applications.

In this study, AlGaN/GaN nanochannel high-electron-mobility transistors (HEMTs) with tri-gate (TGN-devices) and dual-gate (DGN-devices) structures were fabricated and investigated. It was found that the peak value of the transconductance (Gm), current gain cut-off frequency (fT) and power gain cut-off frequency (fmax) of the TGN-devices were larger than that of the DGN-devices because of the enhanced gate control from the top gate. Although the TGN-devices and DGN-devices demonstrated flattened transconductance, fT and fmax profiles, the first and second transconductance derivatives of the DGN-devices were lower than those of the TGN-devices, implying an improvement in linearity. With the nanochannel width decreased, the peak value of the transconductance and the first and second transconductance derivatives increased, implying the predominant influence of sidewall gate capacitance on the transconductance and linearity. The comparison of gate capacitance for the TGN-devices and DGN-devices revealed that the gate capacitance of the tri-gate structure was not simply a linear superposition of the top planar gate capacitance and sidewall gate capacitance of the dual-gate structure, which could be attributed to the difference in the depletion region shape for tri-gate and dual-gate structures.

The effect of the barrier thickness on DC and RF performances of AlGaN/GaN HEMTs on silicon

In this study, the effect of barrier thickness on the DC and RF performances of AlGaN/GaN high-electron mobility transistors (HEMTs) on silicon for millimeter wave applications is experimentally investigated. GaN HEMT devices with different barrier thicknesses were fabricated and characterized. While the device with the thinnest barrier exhibited the highest extrinsic transconductance (gm) resulting from the shortest gate-to-channel distance, such configuration suffered from the lowest unit current-gain cut-off frequency (fT) due to the increase of the total gate capacitance. Moreover, degradation in the output power was observed for devices with thinner barriers. Such degradation was related to the severe knee walkout as evidenced from drain-lag characterization.

Advances in GaN Devices and Circuits at Higher mm-Wave Frequencies

In this paper, we outline the current state of the art and trends for future development in millimeter-wave (mmw) amplifiers based on gallium nitride (GaN) semiconductors. To that end, we give an overview of recent technological results of currently operational GaN foundries and classify them with respect to their maximum frequency of operation and the current-gain cutoff frequency. Furthermore, focusing on frequencies above 80 GHz, we develop a comprehensive survey of GaN high-power amplifiers (HPAs) and provide a comparison to competing technologies such as indium phosphide (InP) and silicon germanium (SiGe). We also introduce a newly developed 6-stage GaN amplifier that is targeted towards the upper D-band. It provides an output power of up to 22.0 dBm, which sets a new record for GaN HPAs in this band. From our survey, we find that while GaN exhibits an impressive power density, its gain and efficiency characteristics particularly beyond 120 GHz still warrant improvement. Therefore, we describe several areas of future improvement such as the gate module scaling, mitigation of trapping phenomena and recent trends in processing of ohmic contacts and alternative epitaxial stacks. With these further developments, more widespread adoption of GaN-based technologies at even higher frequencies seems feasible in the coming years.

9 mV/V ultra-low DIBL of suppressing SCEs in InAlN/GaN HEMT with lattice-matched InxAlyGa(1-x-y)N back-barrier for RF device

An innovative T-gate In0.17Al0.83N/GaN HEMT with the lattice-matched In0.15Al0.69GaN back-barrier is planned. Analyze and compare the DC and RF characteristics of the proposed device. A lattice-matched quaternary compound back-barrier to overcome the SCEs by modulating the energy level of the channel. The proposed HEMT exhibits excellent with the drain induced barrier lower(DIBL) of 9 mV/V, the subthreshold swing(SS) of 64 mV/dec, the off-state breakdown voltage of 55 V, the peak current density(Idmax) of 3.17 A/mm, the transconductance(gm) of 828 mS/mm, the current gain cut-off frequency(fT)/power gain cut-off frequency(fMAX) of 196/259 GHz and the JFOM figure of merit(JFOM) of 10.78 THz. The attractive DC performance, ultra-high cut-off frequency, and high RF quality factors of the device proposed in this article indicate that it has great application potential in future millimeter-wave applications.

RF characteristics of 150‐nm AlGaN/GaN high electron mobility transistors fabricated using i‐line stepper lithography

AbstractThis article reports radio frequency characteristics of 150‐nm gate aluminum gallium nitride (AlGaN)/gallium nitride (GaN) high electron mobility transistors (HEMTs) fabricated using i‐line stepper lithography and a thermal reflow technique. The authors have developed two different gate structures that were a field‐plated gate using the lift‐off process and a Y‐shaped gate using the ion‐milling process. Fabricated HEMTs using these different gate structures exhibited nearly equivalent DC characteristics. The field‐plated gate device showed a unity current gain cutoff frequency (fT) of 35 GHz and a maximum oscillation frequency (fmax) of 106 GHz, while the Y‐shaped gate device showed fT of 36 GHz and fmax of 115 GHz. The equivalent circuit analysis indicated a decrease in the gate‐drain capacitance and the drain conductance is responsible for the improved fmax in the Y‐shaped gate device.

Performance improvement with non-alloyed ohmic contacts technology on AlGaN/GaN High Electron Mobility Transistors on 6H-SiC substrate

In this paper, non-alloyed ohmic contacts regrown by molecular beam epitaxy (MBE) are fabricated on AlGaN/GaN high-electron-mobility transistors on 6H-SiC substrate. Low ohmic contact resistance of 0.13 Ω.mm is obtained. This paper demonstrates the high frequency and high power performance improvements thanks to this technology regarding conventional technology based on alloyed ohmic contacts. The fabricated device with a 75-nm-T-shaped gate demonstrates a maximum drain current density of 1.1 A/mm at VGS = 1 V and a peak transconductance gm of 464 mS/mm. A current gain cut-off frequency fT of 110 GHz and a maximum oscillation frequency fMAX of 150 GHz are achieved. At VDS = 25 V, continuous-wave output power density of 3.8 W/mm is achieved at 40 GHz associated with 42.8% power-added efficiency and a linear power gain of 6 dB. A maximum power-added efficiency of 55% is also obtained at VDS = 20 V.

Inversion-Mode In0.53Ga0.47 As MOSFET with f T = 275 GHz and high V eff

In this work, we present an inversion-mode In0.53Ga0.47As planar MOSFETs with current gain cutoff frequency (f T) = 275 GHz and maximum oscillation frequency (f max) = 75 GHz. To the best of our knowledge, this is the highest f T value among all the reported inversion-mode InGaAs MOSFETs. Meanwhile, peak transconductance (g m) shows 1035 (μS/μm). These extraordinary properties are attributed to the N2 remote plasma treatment which results in excellent high-k/III-V interface quality. With the assistance of delay-time analysis, effective electron velocity (V eff) of 2.88 × 107(cm s–1) is extracted for a possible explanation of the observed record f T performance.

Investigation on Fe-Doped AlGaN/GaN HEMT at 148 GHz Using E-FPL Technology for High-Frequency Communication Systems

In this research work, design of the Extended Field Plate Length (E-FPL) T-gate with Fe doped AlGaN buffer structure on the graded Aluminum Gallium nitride (AlGaN)/ Gallium nitride (GaN) high electron mobility transistor (HEMT) is proposed. The gate length of 60 nm with an ExFPL up to 50 nm towards the drain shows remarkable improvement in breakdown voltage. Meanwhile, the drain current (IDS) and transconductance (GM) is further improved by the Fe doped AlGaN Buffer design. In radio frequency (RF) small signal analysis this device exhibits a peak current-gain cutoff frequency fT of 148 GHz. This device has improved transconductance of 24% with high frequency has compared with conventional GaN HEMT device. It is highly compatible with military applications such as Radio Frequency (RF) upstream transmitters, ship and aircraft communication transmitters and High-frequency Radars (HFRs).