For aviation binders at the moment there is no necessary methodological base on the basis of which it is possible to control the conditions of their curing by viscosity, reaction rate and glass transition temperature in real time. The paper presents a method of control of thermosetting binder parameters directly during the molding process. The epoxy binder VSE-59 was studied. A mathematical model of the relationship between the frequency maximum parameter of the imaginary component of the electrical impedance and the degree of curing is given, the results of dielectric analysis are compared with laboratory methods (differential scanning calorimetry and rheometry). It is shown that the convergence of the values of the degree of conversion is high. Rheological and dielectric analyses revealed a direct correlation between electrical and rheological properties in the range of injection temperatures. Equations were determined and coefficients were experimentally selected to describe the correlation between viscosity and glass transition temperature and dielectric parameters, which provides the possibility of their control in real time. The obtained results can be used to create a hardware and software base, which makes it possible to control the state of the binder at each moment of the process of forming products from polymer composite materials, as well as to carry out optimization to eliminate the emergence of conditions of uneven polymerization. Realization of the detailed control of the binder state in different parts of the product will allow to carry out verification of calculations, to predict and avoid the occurrence of warping and, accordingly, to increase the quality of composite products.