The reliability of solder joints on Ag metallization electrodes is one of important factors that affect the service lifetime of crystalline silicon photovoltaic (PV) modules. In this article we show the effect of glass phase in Ag pastes on solder joint reliability. With peeling test of soldered samples after heat storage at 150 °C for various durations, we observed that with the increase of aging time, the fracture of peeled PV ribbons gradually extended inwards to Ag/Si interface, and there was remarkable distinction in the thermal endurance of solder joints as different glass frits were used in Ag metallization process. This indicates that the erosion of glass phase by solder is primary cause of the aging of solder joints, and this erosion mechanism depends on the glass phase composition. In terms of Bi containing glass that is generally adopted in the most commercial Ag pastes, we found that the Sn/Pb alloy solder can easily reduce Bi cations so as to destroy the glass network structure, making the Ag/Si interconnection to fail.
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