Corrosion Behavior Of Cu Research Articles

Effect of Nano-sized Cu-Rich Phase on Microbiological Corrosion Behavior of Cu and Ni-Added Steel for Oil Country Tubular Goods

Effect of Nano-sized Cu-Rich Phase on Microbiological Corrosion Behavior of Cu and Ni-Added Steel for Oil Country Tubular Goods

Chromium partitioning induced evolution of texture, grain boundary constitution, and corrosion behavior of Cu[sbnd]Cr coatings electrodeposited at different temperatures

The corrosion behavior of CuCr coating electrodeposited at three different temperatures (15 °C, 30 °C, 45 °C) was examined. Cr is partitioned in the grain boundaries and as a solute in the Cu matrix. The formation of Cr-oxide at the grain boundaries enhanced the corrosion resistance of the coatings, whereas the presence of Cr as solute significantly altered the matrix micro-texture. The 15 °C deposited coating exhibited the lowest corrosion rate due to higher Cr solute, smaller grain size, (111) surface texture, and a higher fraction of coincidence site lattices. The 45 °C deposited coating exhibited the highest corrosion rate due to lower Cr solute, higher energy (110) surface texture, and higher fraction of high energy grain boundaries.

Effect of cold spray processing parameters on the microstructure, wear, and corrosion behavior of Cu and Cu–Al2O3 coatings deposited on AZ31 alloy substrate

Cold spray coatings represent a newly emerging and recently implemented approach to enhance the poor wear and corrosion resistance of AZ31 magnesium alloy. In this study, the authors applied pure Cu and Cu-50 wt% Al2O3 composite coatings on an AZ31B substrate using the cold spray deposition method and investigated the effects of gas pressure (1, 2, and 3 MPa) and stand-off distance (1, 2, and 3 cm) on their microstructure characteristics. An increase in gas pressure from 1 MPa to 3 MPa resulted in a decrease in porosity, ranging from 33 % to 38 %, across varying stand-off distances. Increasing the stand-off distance from 1 to 3 cm resulted in a nearly four-fold rise in porosity for 2 and 3 MPa pressures and about 1.5 times for 1 MPa. The porosity increased with higher pressure due to the fragmentation of Al2O3 particles but decreased with greater spraying distance due to reduced Al2O3 retention. Additionally, the incorporation of Al2O3 particles into Cu coatings led to a significant improvement in sliding wear resistance, by up to 50 %, compared to the bare substrate. Abrasive wear and delamination were identified as the dominant wear mechanisms for the composite coatings based on friction coefficient values and micromorphology of wear tracks. Electrochemical results indicated a significant increase in the corrosion resistance of the Cu coating compared to both the bare Mg substrate and Cu–Al2O3 coating, attributed to improved resistance to galvanic corrosion.

Photoelectrochemical effect of Cu2O on the corrosion behavior of Cu in sodium sulfate solution

The electrochemical associated with photoelectrochemical behaviors of Cu electrodeposited with Cu2O layer were investigated in this work. The corrosion of Cu was promoted due to the enhanced anodic and cathodic processes under AM 1.5illumination compared with that in the darkness, especially for the anodic process. The photoinduced corrosion of Cu by Cu2O was detected by Scanning Vibrating Electro Technique (SVET). The effect of Cu2O on the promotion of Cu corrosion under illumination can be ascribed to the narrowed depletion layer in Cu2O under illumination, which facilitates the separation of hole-electron pairs. The resultant holes give rise to the oxidation of the Cu matrix and lead to a promoted corrosion consequently. Besides, a method for in-situ determining the photoinduced current of a semiconductor material is proposed.

Effect of Cr addition on corrosion behavior of cupronickel alloy in 3.5 wt% NaCl solution

Cupronickel alloys have a variety of applications in marine engineering due to their good mechanical and corrosion properties. In this work, the effect of Cr on the corrosion behavior of Cu–10Ni–1.6Fe–0.5Mn alloy in 3.5 wt% NaCl solution was investigated through electrochemical and surface characterization. The results indicate that Cu–10Ni–1.6Fe–0.5Mn–0.3Cr alloy has better corrosion resistance performance compared to Cu–10Ni–1.6Fe–0.5Mn alloy in NaCl solution. The addition of Cr reduces the corrosion current density of cupronickel alloys from 7.82 μA/cm2 to 7.10 μA/cm2. The better corrosion resistance performance of the Cu–10Ni–1.6Fe–0.5Mn–0.3Cr alloy could be mainly attributed to the incorporation of Cr3+ ions in Cu2O lattice during corrosion. The corrosion product film of Cu–10Ni–1.6Fe–0.5Mn–0.3Cr alloy mainly contains the compounds including Cu2O, NiO, γ-FeOOH, Cr2O3, and Cu2(OH)3Cl. The formation of Cr2O3 can further enhance the stability of corrosion film and improve the corrosion properties of the alloy.

Investigation on Wear and Corrosion Behavior of Cu, Zn, and Ni Coated Corten Steel

Corten steel is a low-carbon alloy steel. It is widely used in architecture, the transport sector, and industrial applications, where the steel is exposed to harsh environments. It is very much sought after due to its auto protection from corrosive environments through the formation of patina (rust). The specialty of patina formed on the corten steel is that it can self-heal itself and stop the spreading of corrosion. Generally, steels are given protective coatings to enhance resistance to corrosion, wear, abrasion, etc. One of the popular protective coating techniques is electroplating. In this study, the effect of electroplating of copper (Cu), zinc (Zn), and nickel (Ni) on the wear and corrosion behavior of Corten ASTM A242 grade steel is investigated. It was observed that the Cu coating yielded poor corrosion and wear protection performance. The Zn coating exhibited a moderate improvement. The Ni electroplating produced excellent results and, the wear and corrosion resistance was improved in the corten steel. Thus, when compared with Cu, Zn, and Ni coatings, the Ni-coated corten steel is an ideal candidate in applications where there is a need for good resistance to wear, abrasion, and corrosion.

Corrosion Behavior of Cu in Accelerated Hydrogen Peroxide-Based Disinfectants

Cu ion release due to corrosion plays a critical role in the antimicrobial efficacy of Cu. There are, however, concerns regarding surface passivation, and thus, decreased Cu ion release after routine cleaning with hospital-grade disinfectants. In this study, immersion corrosion rate measurements up to 7 d coupled with SEM and XPS were employed to evaluate the corrosion behavior of pure Cu in 0.5% H2O2 and two commercially available hospital-grade H2O2-based disinfectants. Results show considerably higher corrosion rates in the commercially-available cleansers compared to H2O2 alone, meaning that Cu ion release occurs readily during routine disinfection with these products.

Impact of HVOF-Sprayed Ni–Cr and (Co,Ni)O Coatings on the Corrosion Behavior of Cu–Ni–Fe Anodes for Green Aluminum Production

Impact of HVOF-Sprayed Ni–Cr and (Co,Ni)O Coatings on the Corrosion Behavior of Cu–Ni–Fe Anodes for Green Aluminum Production

Study of synergy of monoethanolamine and urea on copper corrosion inhibition in alkaline solution

• Cu corrosion in TMAH-containing solution is investigated. • MEA and urea are used as corrosion inhibitors to retard the Cu corrosion. • The synergy of MEA and urea on Cu corrosion inhibition is concentration ratio dependent. • Cu corrosion becomes more serious at low concentration ratio of MEA to urea. • Cu corrosion is effectively retarded at high concentration ratio of MEA to urea. Tetramethylammonium hydroxide (TMAH) is an important constituent used in the post cleaning process of chemical mechanical planarization and lithography; however, its corrosive property causes damage to the Cu metallization. Addition of corrosion inhibitor in the cleaning solution is a promising method to protect Cu. In this study, two corrosion inhibitors, monoethanolamine (MEA) and urea, are used to investigate their synergy on the Cu corrosion protection. Electrochemical and four-point probe methods are adopted to analyze the corrosion behaviors of Cu. Microstructural characterizations of Cu are performed using scanning electron microscopy, transmission electron microscopy, and atomic force microscopy. X-ray photoelectron spectroscopy is used to realize the adsorption behaviors of inhibitors on the Cu surface. The results of corrosion current ( I corr ) and charge transfer resistance ( R ct ) indicate that addition of MEA and urea at an identical concentration does not produce a typical synergistic effect on the Cu corrosion protection due to mutual interference of two inhibitors. An increase of the MEA concentration overcomes the mutual interference, giving rise to a reduction of I corr and an increase of R ct . The effective retardation of the Cu corrosion is attributed to the sufficiency of inhibitors which can construct a dense protection layer on the Cu surface.

Corrosion of Cu in Antifreeze Solutions with Triazine- or Triazole-Type Corrosion Inhibitors for 3 Weeks

The corrosion behavior of Cu in antifreeze solutions containing 2,4,6-Tris(5-carboxypentylamino)1,3,5-triazine, 2,4,6-Tris(11-carboxyundecylamino)1,3,5-triazine, 1-Aminomethyl(N′,N′-di(2-hydroxyethyl)tolutriazole, or 1-Aminomethyl(N′,N′-di(2-hydroxyethyl)benzotriazole as corrosion inhibitors were examined by immersion test for 3 weeks as well as potentiodynamic polarization tests before and after immersion test. The corrosion rate of Cu was as relatively high as 10−5 A/cm2 in antifreeze solution with the inhibitor (2,4,6-Tris(11-carboxyundecylamino)1,3,5-triazine) with a high molecular weight of 713 for a short time duration compared with antifreeze solutions using the other three types of inhibitors. However, the corrosion inhibition effect of this large molecule became prominent after 2 weeks, reducing the corrosion rate by about four orders of magnitude. Corrosion of Cu in the solution with inhibitors of high molecular weight of 440 or higher decreased gradually with time, while that in the solution with small molecules slightly increased over 3 weeks.

Photocorrosion behavior of Cu2O nanowires during photoelectrochemical CO2 reduction

• The corrosion behavior of Cu 2 O nanowires during PEC CO 2 reduction is unraveled. • Self-reduction of Cu 2 O by photoelectrons is the dominant photocorrosion pathway. • The photocorrosion modes is alleviated by tailoring the conditions of electrolyte. Cuprous oxide (Cu 2 O) is a promising photocathode candidate for photoelectrochemical (PEC) CO 2 reduction reaction (CO 2 RR) due to its narrow band gap and suitable band alignment. However, it suffers from severe photocorrosion, and the real reason is confused. In this work, Cu 2 O nanowires film was used as a model photocathode to explore the corrosion behavior during PEC CO 2 RR. The evolution of Cu 2 O photoelectrodes was monitored by microscopy techniques (scanning electron microscope, transmission electron microscope) and compositional analyses (X-ray diffraction,X-ray photoelectron spectroscopy), more content of Cu was detected after testing under illumination than that in the dark. Polarization curves also show a much higher corrosion current of Cu 2 O under illumination. Assisted with the measurement in the existence of electron and hole scavengers, the self-reduction of Cu 2 O by the accumulation of photoelectrons is considered as the primary corrosion pathway for Cu 2 O photocathode in aqueous solution.

Tailored copper oxidation in alkaline aqueous solution after helium cation implantation

Manipulating Cu oxidation is important for Cu anti-oxidation techniques and Cu oxide fabrication. In this study, Cu oxidation behavior after He+ implantation was observed after exposure to 0.1 M aqueous NaOH, and the underlying microstructural evolution and mechanism were investigated. He+ implantation and some C concomitantly introduced into the Cu surface accelerated formation of a thin oxide layer during the initial oxidation period, resulting in faster initial generation and more rapid growth of CuO during the subsequent oxidation. Furthermore, He+ implantation homogenized the distribution of CuO on the Cu substrate. Our findings will increase researchers’ understanding of the oxidation and corrosion behavior of Cu in aqueous alkaline conditions, and provide new insights into designing and growing Cu oxide nanostructures by ion implantation.

Analyzing the Corrosion Behaviour of Cu doped ZnO Nanomaterials on Mild Steel in NaCl Solution

Analyzing the Corrosion Behaviour of Cu doped ZnO Nanomaterials on Mild Steel in NaCl Solution

Pitting corrosion behavior of Cu–P–RE weathering steels

The weathering steels are prone to pitting corrosion in an environment containing chloride ions. The pitting behavior of Cu–P–RE weathering steels and its effect on the corrosion resistance of steels were investigated by multifarious analytical techniques, such as field emission-scanning electron microscopy (FE-SEM), electron probe microanalysis (EPMA), scanning Kelvin probe force microscopy (SKPFM), electrochemical workstation and a series of immersion tests. The results show that the original strip-shaped MnS inclusions and Al2O3 inclusions with sharp angles are modified into the fine spherical rare earth (RE) inclusions with small average size, which are mainly RE oxysulfides after adding appropriate amount of mischmetal (48.9 wt%Ce–42 wt%La–5 wt%Nd–Fe) into the Cu–P weathering steel. In the environment containing Cl–, the pitting corrosion in RE weathering steel is induced by the preferential dissolution of RE inclusions in that the RE inclusions have a more negative potential than steel matrix at the initial corrosion stage. With the increase of corrosion time, the driving force of pitting expansion is weakened as a result of the continuous dissolution of RE inclusions, which makes the pitting tend to propagate horizontally around the RE inclusions. Once the RE inclusions completely dissolve, the open corrosion pits with shallow depth are formed in steel. The dispersed pitting pits with small size and shallow depth induced by RE inclusions are conducive to the formation of uniform and dense corrosion products layer on the steel surface, which reveals that the addition of RE can improve the corrosion resistance of weathering steels.

Corrosion behavior of tin‐phosphor bronze strips in environments containing Cl− and HCO3−

AbstractThe corrosion behaviors of Cu–7.42Sn–0.156P and Cu–5.78Sn–0.162P alloys in different solutions were investigated. The results show that the Cu–Sn–P alloy with higher Sn content exhibits better corrosion resistance. In the NaCl, NaHCO3, and NaCl+NaHCO3 solutions, compared with Cu–5.78Sn–0.162P alloy, the corrosion current densities of Cu–7.42Sn–0.156P alloy are reduced by 25.2%, 36.9%, and 34.5%, and the polarization resistances are increased by 32.0%, 25.4%, and 29.9%. The Cu–Sn–P alloys have the best corrosion resistance in the NaHCO3 solution, followed by the NaCl solution and the worst in the NaCl + NaHCO3 solution. The increase of Sn is helpful to improve the density and spalling resistance of the corrosion film. There is a double‐layer structure for the corrosion film of Cu–Sn–P alloy. For the alloys immersed in the NaCl solution and the NaCl+NaHCO3 solutions, the corrosion films consisted of Cu2O, CuO, and SnO2. For the alloys immersed in the NaHCO3 solution, the corrosion films are composed of Cu2O, CuO, SnO, and SnO2. The increase of Sn content in the alloy can increase the contents of Cu2O and SnO in the corrosion films.

Synergistic Effects of MWCNTs and High-Pressure Torsion-Induced Grain Refinement on Microhardness, Tribological Properties, and Corrosion Behavior of Cu and Cu/MWCNT Nanocomposites

Synergistic Effects of MWCNTs and High-Pressure Torsion-Induced Grain Refinement on Microhardness, Tribological Properties, and Corrosion Behavior of Cu and Cu/MWCNT Nanocomposites

Corrosion behavior and mechanism of Cu/Ti3AlC2 composites under arc discharge in different atmospheres

The high-voltage arc corrosion behavior of Cu/ 30 vol% Ti3AlC2 composites in air, carbon dioxide, nitrogen, and sulfur hexafluoride was studied, and their corrosion mechanism was systematically discussed. Arc energy and electromagnetic force in different atmospheres lead to the different corrosion characteristics in corrosion area. Ti3AlC2 was oxidized and decomposed in air and carbon dioxide, while it maintained a good structure in nitrogen and sulfur hexafluoride. The characteristics of the arc were clearly observed by a high-speed camera. This study lays a foundation for the composition design, performance optimization and failure analysis of Cu-MAX composites in the high voltage electrical appliance.

Comparative study on corrosion behavior of Cu and Sn under UV light illumination in chloride-containing borate buffer solution

Corrosion behaviors of copper and tin in chloride-containing borate buffer solutions (pH 8.4) were investigated through electrochemical and spectroscopic techniques in the presence and absence of UV illumination. Concerning effects of UV light on the corrosion processes, in a borate buffer solution containing 0.025 M NaCl, photo-enhanced pitting corrosion was observed on copper while photo-induced passivation was found on tin. The effect of UV illumination on corrosion was dependent on the interaction between the photo-generated carriers and the metal oxides, as well as the photostability of the oxide film. Chloride anions can decrease the photostability of the oxide film.

Corrosion behavior of Cu−Al−Mn−Zn−Zr shape memory alloy in NaCl solution

Abstract The corrosion behavior of a copper-based shape memory alloy (Cu−Al−Mn−Zn−Zr) in 3.5 wt.% NaCl solution was investigated by means of potentiodynamic polarization measurements, electrochemical impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS). At the beginning of corrosion, oxidation products formed on the surface of the shape memory alloy and constantly covered the reaction surface, resulting in the decrease of corrosion rate. After 4 d of immersion in NaCl solution, the corrosion product layer became thick and porous, leading to the increase of corrosion rate, and the corrosion reaction mechanism changed from polarization control to diffusion control. The diffusion impedance increased with increasing thickness of the oxide layer for the samples immersed in NaCl solution for 6−15 d. During the whole corrosion process, the reaction mechanism of the alloy changed and the corrosion resistance was improved continuously. The corrosion products mainly contained CuO, ZnO, Al2O3, MnO/Mn2O3, MnO2 and Al(OH)3. Transition of the corrosion products from Cu2O to CuO and Al2O3 to Al(OH)3 occurred during corrosion.

Corrosion behaviour of Cu–2Ti and Cu–2Zr (wt%) alloys in neutral aerated sodium chloride solution

AbstractThe corrosion behaviour of Cu–2Ti and Cu–2Zr (wt%) alloys has been assessed by open‐circuit potential and electrochemical impedance spectroscopy measurements carried out in 3.5 wt% NaCl solution, at approximately neutral pH, without stirring and in contact with the air. For comparison, the electrochemical tests have also been carried out on unalloyed Cu. Electrochemical impedance results showed that Ti and Zr alloying additions significantly increased the corrosion resistance of copper, the best behaviour being observed for the Cu–2Zr alloy. This improvement may be ascribed to the formation of Ti‐ or Zr‐enriched passive layer, which exhibits higher protective effectiveness compared with that of unalloyed Cu.