Thick Copper Research Articles

Elaboration and study of the fatigue behavior of a multifunctional composite material with embedded copper insert: The effect of thickness and electrical voltage

The behavior of multifunctional composite material with an embedded copper foil strip under cyclic loading was investigated. Materials able to bare charge as well as conduct electricity are crucial in various applications in high-tech industries. The effects of applied stress, voltage levels and the dimensions of the insert on the material response were analyzed. Two types of composites were prepared: one with a 0.1 mm thick copper (GFC0.1) and another with a thickness of 0.05 mm (GFC0.05). Both materials were subjected to tensile and fatigue tests. The results revealed that the dimensions of the insert had an impact on the Maximum Tensile Resistance (MTR). The examination of the fatigue-damaged composite gave important insights about the evolution of the de-bonding area of the interface copper/composite under different loading conditions. Fatigue test results allow the plotting of fatigue curves and establishing the fatigue equation specific to each material under each voltage level (U = 5, 9, and 12 ± 0.3 V). These results also showed that when tested at the same voltage, there is one stress level for which both GFC0.1 and GFC0.05 have the same fatigue resistance; above this stress value, GFC0.1 has a better resistance, and below it, GFC0.05 will be the one resisting better. Epoxy resin was chemically dissolved to restore the damaged copper Nicked-eye inspection along with scanning electron microscope (SEM) observations revealed interesting facts about the metallic insert behaviors, including the nature of the rupture and the effect of the voltage on the fractured surface aspect.

Ultrasonic Welding Parameter Optimization for Electric Component Welding

Industrial requirements to establish metallic joints between dissimilar metals in the electric area. The ultrasonic welding process is an optimal process to joint thin sheets or foils. The goal of the research was to optimize the ultrasonic welding parameters to join thin nickel-coated copper sheets and aluminium sheets. It used a 0.5 mm thick high-purity copper (Cu-OF-R200) sheet coated with a 10 μm pure nickel layer and a 0.5 mm thick aluminium (1050A H24) sheet. The ultrasonic welding is made by a Branson Ultraweld L20 ultrasonic welder equipment. The mechanical properties and exacting geometrical tolerance of the joint were required. The welding parameter optimization is made empirically, with several welding tests. The optimal welding parameters were confirmed by non-destructive and destructive tests of the joints. The non-destructive tests were the visual inspection and geometrical measurements of the joint sizes. The destructive tests were tensile tests and macroscopic and microscopic tests. The completed test results confirmed the process applicability and the quality of the joint.

Influence of heat input on pinless friction stir spot welding of aluminum‑copper dissimilar materials

The composite structures of aluminum/copper dissimilar materials hold significant practical value and potential in advanced technology and industrial applications. This study conducted lap welding experiments on 2 mm thick T2 copper and 1060 pure aluminum rods using the pinless friction stir spot welding process. By varying the dwelling time of the tool, the evolution behavior of the CuAl interface layer and the mechanical properties of the joints were analyzed. At low dwelling times, the heat input was relatively low, resulting in a thinner IMC layer and the best mechanical properties of the joints, with a pull-out force of 2238.2 N and a tensile strength of 28.49 MPa. The fracture modes of the joints under all parameters were brittle fractures. The connection of aluminum/copper dissimilar materials involves two processes: firstly, the diffusion bonding dominated by kinetics at the initial welding stage; and secondly, the solid-liquid instantaneous bonding dominated by thermodynamics. When the welding temperature exceeds the melting point of aluminum, the aluminum/copper interface continuously undergoes transformation-bonding-retransformation processes until the welding process is completed.

Halvorsen chaotic system based microwave absorber modelling for fighter jet stealth technologies

This study focuses on the development and detailed analysis of a broadband microwave absorber utilizing Halvorsen chaotic dynamics, that focuses at enhancing stealth capabilities for fighter jets. The investigation begins by exploring the mathematical formulation of the Halvorsen chaotic system and conducting a parametric sweep of its control parameters to generate distinct two-dimensional and three-dimensional chaotic attractor plots. These plots are then post-processed using Julia set theory to develop intricate fractal patterns, which serve as the foundation for the absorber design. Image processing techniques, including filtering and thresholding, are employed to refine the patterns by removing artifacts and noise, ensuring they are suitable for practical implementation. The refined fractal patterns are then imported into a computational electromagnetic simulation environment where they are patterned onto a 0.035 mm thick copper sheet. Moreover, the Magtrex 555 substrate with a thickness of 1.52 mm, is selected for its high permittivity and low-loss characteristics. A comprehensive series of parametric studies are conducted to evaluate the influence of various design parameters such as side length, unit cell geometry, and substrate thickness on the absorber’s electromagnetic performance. Important parameters include the effects of chaotic control parameter optimization and the electromagnetic boundary conditions applied during the simulations. Extensive simulations are performed across the 2–20 GHz frequency range to evaluate absorption efficiency, focusing on key metrics like absorptivity, surface current distribution, and electric field distribution. The final design achieves over 90 % absorption efficiency within the target frequency band when the chaotic control parameters are optimized. Finally, comparative analysis using different commercially available substrates, including FR-4 and Rogers RO3003, reveals that Magtrex 555 offers superior absorption performance. The study concludes with a detailed presentation of the final absorber design, alongside an indepth discussion of the frequency range, parametric variations, and the impact of chaotic system dynamics on the absorption properties. This research provides crucial insights into the design and optimization of chaotic-system-based microwave absorbers, that advances the development of stealth technology in military applications.

Effects of Cu Coating Addition on Mechanical Properties of Vacuum Brazed Joints

In this study, a copper brazing filler metal coating is fabricated on a 304 stainless steel (304SS) substrate using an electroplating technique. The effect of using electroplated copper brazing filler metal coatings compared to pure copper foil of the same thickness for vacuum brazing of stainless steel joints is investigated. The microstructure and microhardness of the brazed joints are characterized using X‐ray diffraction (XRD), scanning electron microscopy (SEM), and a Vickers hardness tester. The shear strength of the brazed joints is measured using an INSTRON 5869 universal testing machine. The results indicate that the electroplated Cu coating is dense, predominantly with a single cubic phase, with a few copper particles aggregating on the surface. Under electroplating conditions of 20 mA cm−2 for 1 h, the coating thickness was 56 μm. The shear strength of the brazed joint with this coating reached a maximum of 333.7 MPa, which is higher than that of a brazed joint with a 60 μm thick copper foil, which exhibits a shear strength of 303.2 MPa. The shear strength of the brazed joints shows an initial increase followed by a decrease as current density and electroplating time increase. This study provides significant technical support for brazing complex shapes or precision components. It suggests a method to simplify the brazing process, reduce production costs, and enhance the strength of brazed joints.

Prediction of micro/meso scale forming limit for metal foils using a simple criterion

Accurately forecasting the forming limit of metal foils is essential in their micro-forming due to the appearance of necking failure easily. In order to accurately and easily forecast the forming limit of metal foils influenced by size effect, an idea for failure modeling of metal foils using the mechanism that different fracture modes of metal foils are related to shear bands is presented in this work. Based on the idea, a simple ductile failure criterion that considers the maximum shear stress and grain size effect but excludes the stress triaxiality is proposed, motivated by the demand to decrease the complexity of parameter calculation tests in micro-forming failure prediction. The proposed criterion and another criterion called as the μ-DF2022 model are applied to capture the forming limit curves of various thick copper and 304 stainless steel foils with different grain sizes to verify its advantage and performance, and the corresponding mechanisms of their prediction capabilities are also elucidated. Furthermore, the proposed and μ-DF2022 models are applied to forecast the limit drawing ratio of a 304 stainless steel foil to further show its performance and advantage in real micro-forming. The applications show that the proposed failure criterion effectively forecasts the forming limit of metal foils between equi-biaxial tension and uniaxial tension influenced by size effect. Moreover, the prediction accuracies using the proposed model and the μ-DF2022 model are comparable, whereas the proposed model does not require complex micro equi-biaxial tension tests, which are typically unavailable to many engineers and researchers, to calibrate its material parameters. Therefore, it is recommended to utilize the proposed criterion to capture the forming limit of metal foils in micro-forming. This work advances the forming limit modeling method of metal foils and provides insight into the application of uncoupled ductile failure criteria in the micro-forming of metal foils, which contributes to the development of their optimal micro-forming processes.

Variable frequency selective structure (CFRP/Cu/CFRP) micro blind hole laser high-quality drilling method guided by acoustic emission technology

The laminated structure of carbon fiber reinforced plastic (CFRP)-Cu-CFRP is an important structure for aerospace radome. The blind holes manufacturing is core process, but there are technological challenges in achieving the exposure of a 10 μm thick copper foil at the bottom of the blind hole. The exact position of the 10 μm thick copper foil within the material’s internal space is unknown, and the uneven heat accumulation and conduction can easily cause burning and damage to the ultra-thin copper foil. To date, there is no publicly accessible literature that documents the execution of this specific process. In this paper, novel variable inner diameter spiral scanning guided by Cu-CFRP interface accurately extracted using cosine similarity (CS) algorithm is proposed to obtain a blind hole with near-zero ablation damage. The similarity of acoustic emission signals generated by laser interaction with Cu and CFRP, as well as thermal accumulation and conduction behavior under different scanning radius, are described. The high-quality blind holes have been successfully drilled, with a large area copper foil exposed at the bottom, while the surface of the copper foil remaining intact without any damage or heat affected zone. Compared with traditional drilling method, the average exposed copper foil area at the bottom of the blind holes is increased by 238.4 % (from 0.464 mm2 to 1.570 mm2). And the average taper of blind hole is reduced by 41.7 % (from 0.470 to 0.274). This method can effectively increase the area of exposed copper foil and reduces the taper of blind holes, improve the welding strength and conductivity of wires in aerospace radomes, thereby enhancing the stealth performance and operational reliability of fighter jets.

New Method to Recover Activation Energy: Application to Copper Oxidation

The calculation of the activation energy helps to understand and to identify the underlying phenomenon of oxidation. We propose a new method without any a priori hypothesis on the oxidation law, to retrieve the activation energy of partially and totally oxidized samples subject to successive annealing. The method handles the uncertainties on the measurement of metal and oxide thicknesses, at the beginning and at the end of the annealing process. The possible change in oxidation law during annealing is included in the model. By using an adapted Particle Swarm Optimization method to solve the inverse problem, we also calculate the time of final oxidation during the last annealing. We apply the method to successive annealings of three samples with initial nanometric layers of copper, at ambient pressure, in the open air. One, two and three successive laws are recovered from experimental data. We found activation energy values about 105–108 kJ mol−1 at the beginning of the oxidation, 76–87 kJ mol−1 at the second step, and finally 47–59 kJ mol−1 in a third step. We also show that the time evolution of copper and oxide thicknesses can also be retrieved with their uncertainties.

Fabrication of through alumina vias (TAV) by ultrasonic micromachining for advanced packaging applications

This article presents the fabrication of a high aspect ratio through alumina-vias (TAV) by combining ultrasonic micromachining (USM), electroless plating, and copper electrodeposition. Various horn designs, i.e., tapered, stepped, exponential, and hybrid horns, were analyzed to achieve a uniform longitudinal vibration in a 6 × 6 multi-tip tool assembly. The modal analysis determined the horn length, and harmonic analysis provided the stress distribution and vibrational amplitude. The tapered horn design was selected for its superior vibration amplification and reduced stresses. Finite element modeling predicted the geometric profiles of the microvias at various USM parameters. Experimental validation showed less than 5 % error in the depths of the microvias. Using the optimized USM parameters, a 6 × 6 array of blind and through-holes was created in a 3 mm thick alumina substrate with an average feed rate of 180 μm/min. The average tool wear was observed to be 0.5 mm when drilling through 3 mm thick alumina. Electroless deposition created a ∼100 nm seed layer on the alumina substrate and achieved good adhesion with via sidewalls. The through-holes were partially filled with a 60 μm thick copper layer by electrodeposition to create through-alumina vias (TAV) that can be used as 3D interconnects in the packaging of high-power electronics.

Metal-Free Polymer-Based Current Collector for High Energy Density Lithium-Metal Batteries.

The energy density of lithium-metal batteries (LMBs) relies substantially on the thickness of the lithium-metal anode. However, a bare, thin lithium foil electrode is vulnerable to fragmentation due to the inhomogeneity of the lithium stripping/plating process, disrupting the electron conduction pathway along the electrode. Accordingly, the current collector is an integral part to prevent the resulting loss of electronic conductivity. However, the common use of a heavy and lithiophobic Cu current collector results in a great anode mass increase and unsatisfactory lithium plating behavior, limiting both the achievable specific energy and the cycle life of LMBs. Herein, a metal-free polymer-based current collector is reported that allows for a substantial mass reduction, while simultaneously extending the cycle life of the lithium-metal anode. The specific mass of the ultra-light, 10µm thick polymer-based current collector is only 1.03mg cm-2, which is ≈11% of a 10 µm thick copper foil (8.96mg cm-2). As a result, LMB cells employing this novel current collector provide a specific energy of 448Wh kg-1, which is almost 18% higher than that of LMBs using the copper current collector (378Wh kg-1), and a greatly enhanced cycle life owing to a more homogeneous lithium deposition.

Exploring joining techniques for diamond chips on metallized substrates: Micro- and nano-scale mechanical testing approach

This paper aims to comprehensively evaluate the shear strength of various junctions between diamond chips and double copper bonded ceramic substrates. The study involves several stages, beginning with the deposition of Ti/Ni/Ag metallization system on diamond chips using a chemical vapor deposition (CVD) process. These metallization systems are selected to determine their suitability as ohmic contacts on diamond. In parallel, Ni/Au and Ni/Ag layers are electroplated onto the thick copper metallization of the ceramic substrate. Following these depositions, junctions are created for both Cu/Cu and C/Cu assemblies using different techniques: reflow process for AuGe solder joints, reflow-diffusion process for Ag-In joints, and a thermomechanical process for Ag nanoparticle joints. To assess the effectiveness of these techniques, the shear strength of the junctions is measured using a micro-shear test, which is analogous to a classical micro-scratching test. Additionally, the mechanical behaviors of the layers adjacent to the assemblies are analyzed through nano-indentation tests. Finally, the fracture surfaces are examined using scanning electron microscopy (SEM) and energy-dispersive X-ray (EDX) spectrometry to identify the microstructure and damage modes. The work described in the paper exhibits several innovative aspects. It introduces the novel combination of Ti/Ni/Ag metallization system on diamond chips, evaluated for its suitability as ohmic contacts, potentially leading to improved electrical and thermal performance in diamond substrate applications. The study employs diverse junction creation techniques, such as reflow for AuGe solder joints, reflow-diffusion for Ag-In joints, and a thermomechanical process for Ag nanoparticle joints, allowing for a thorough comparison and identification of the most effective method for different scenarios. We have also introduced an integrated testing methodology, which combines micro-shear tests and nano-indentation tests and provides a robust framework for assessing both the shear strength and mechanical properties of the junctions and adjacent layers, enhancing the reliability and depth of the evaluation. The specific focus on metallization system and junctions suitable for diamond, known for its exceptional thermal and electrical properties, positions this work as highly relevant for advanced electronic and thermal management applications.

Influence of structure parameters on the tribological properties of MoB/Cu laminated composites

Strong-bonding MoB/Cu laminated (MCL) composites are fabricated by the hot-press method at 1030 °C for 1 h under 20 MPa pressure. The microstructure, tribological properties, and elemental microanalysis are systematically investigated. The structure parameters of laminated composites play a key role in the properties of friction and wear resistance. The average friction coefficient is below 0.3 and the wear rate is almost one order of magnitude lower when the measured ratio of copper thickness to MoB thickness is below 4, compared with the sample whose λ equals 13. The primary phases of MCL are Al2O3, Cu(Al), and MoB. They helped the lubricating film to form on the worn surface during the wear process. These tribo-films effectively moderate the wear while safeguarding the metal matrix.

Evaluation and Analysis of a 10 T-Class Small Coil Using REBCO Coated Conductors Laminated With Thick Copper Tapes

Evaluation and Analysis of a 10 T-Class Small Coil Using REBCO Coated Conductors Laminated With Thick Copper Tapes

Condition Monitoring System: A Flexible Hybrid Electronics Approach for Sealed Container Applications

A comparative study is presented between two advanced flexible hybrid electronics (FHE) systems designed for monitoring temperature within storage containers across various industries, including food, pharmaceuticals, agriculture, automotive, and defense. The first system, a copper-flex system (CFS), employs an 88.9 µm polyimide substrate with 35 µm thick copper traces, coated with a 12.5 µm polyimide solder mask. The second system, a printed-flex system (PFS), utilizes a 127 µm polyimide substrate with high-temperature resistance and tensile strength. Conductive silver ink was screen-printed on the PFS substrate, and electronic components including a temperature sensor were attached. Functional and reliability tests were performed to check the accuracy and durability of the temperature sensor. Further, environmental and mechanical characterizations including moisture and insulation resistance, corrosion, elongation, bending, and terminal bond strength tests were performed based on ASTM and IPC-TM650 standards. Moisture and insulation resistance test on the PFS test coupons without a coating layer indicated stable resistance of approximately 18 MΩ, while permanent color change indicated oxidation of copper on uncoated CFS test coupons. After 72 hours of corrosion test, both the CFS and PFS “meander line” test coupons covered with polyimide showed negligible change in weight and resistance, approximately 0.35%. A Young’s modulus of 7.17 GPa and 2.6 GPa was calculated from the elongation test for the CFS and PFS, respectively. Bending tests on PFS revealed negligible average resistance change (0.1%) during 180° bending cycles, while no impact was recorded on the CFS. During the terminal bond strength test, soldered wires detached from the CFS test coupons at an average force of 43 N, while it was 3.8 N on the PFS test coupons. Both systems with polyimide coating layer demonstrate robustness and reliability for diverse applications in various industries.

The applicability of high-frequency ultrasonic testing for the inspection of the bonded interface between a divertor's mono-block and screw pipe

This study investigated the applicability of high-frequency ultrasonic testing to inspect the tungsten-copper bonded interface between a divertor's mono-block and a cooling pipe called the “screw pipe.” Mock-up samples simulating the interface were fabricated by diffusion bonding of a 2.5 mm thick oxygen-free copper plate to a 12 mm thick tungsten block that satisfied the ITER material specifications. After making the bond, grooves were machined on the oxygen-free copper side of the samples. High-frequency ultrasonic tests were performed before and after machining the grooves using an ultrasonic scanner with a 30 MHz probe in the immersion pulse-echo setting. The testing results showed that the original screw pipe has a low capability for inspection with high-frequency ultrasonic testing. The visibility of a defect at the interface decreased because of the reflection of ultrasonic waves from the slope of the grooves and interference by the echoes from the interface and the grooves’ surfaces. These issues were addressed by proposing geometrical modifications for the grooves and testing with high-frequency ultrasonic testing. The proposed modifications considerably increased the visibility of a defect at the interface and improved detectability by high-frequency ultrasonic tests.

Copper metallization of carbon fiber-reinforced epoxy polymer composites by surface activation and electrodeposition

The application of polymer metallization in lightweight and high-strength materials for the sporting goods, automotive, aerospace and construction sectors has attracted considerable attention. The present study aims to deposit a thin, uniform copper (Cu) layer on an epoxy‑carbon fiber (epoxy-Cf) composite material for lightweight, high-frequency radio reflector applications (Ka-Band and higher frequencies) required in space missions. In this work, a surface-activated electroplating technique in which the surface of the substrate is activated with a Sn/Ag system, followed by conventional electroplating is studied. Surface activation deposits layers of conducting metal ions on the surface of the epoxy-Cf composite, which significantly improves the electrical conductivity of the composite surface. The subsequent electrodeposition takes place from a CuSO4 solution with a pH value of 4 at three different current density values of 0.05 A/dm2, 0.5 A/dm2 and 1 A/dm2. The presence and abundance of metallic Cu over epoxy-Cf composite were confirmed by X-ray diffraction and X-ray photoelectron spectroscopy. The morphology and elemental composition of the coating were characterized by scanning electron microscopy equipped with energy dispersive spectroscopy. With current density and coating thickness, morphology of the deposit changed from cauliflower-like to spherical along with grain refinement. Microhardness test shows a hardness of 330 HV and the pull-off adhesion test gave a bond strength of 1.69 MPa for 27.56 μm thick copper deposit. A major challenge encountered during the deposition of Cu is the oxidation of the metal followed by immediate tarnishing. This issue has been effectively addressed by employing benzotriazole solution as a protective agent.

Measurements of Sensitivity and Figure of Merit for Noble Metals (Au, Ag, Cu) Thin Film Biosensor Based on SPR Simulation Characterizations

In this paper, we investigate the influence of varying the thickness of noble metals, namely gold (Au), silver (Ag) and copper (Cu), and the incident light wavelength on the surface plasmon resonance (SPR) properties for biosensor applications. Our analysis employs the Fresnel equations to examine the absorption characteristics of these metals when the refractive index shifts by (0.03,0.06). We explore metal layer thicknesses ranging from [Formula: see text][Formula: see text]nm and incident light wavelengths of [Formula: see text] and 600[Formula: see text]nm, with incident angles ([Formula: see text]) ranging from 0° to 90°. Utilizing simulation analysis in MATLAB, we simulate the SPR responses of these metals when deposited on BK-7 glass prisms, with air as the surrounding medium. Our calculations reveal the absorption properties of Au, Ag and Cu, as indicated by the angle of incidence ([Formula: see text]SPR). Our findings demonstrate that the highest absorption occurs with copper (Cu) at [Formula: see text] (a.u.) for [Formula: see text][Formula: see text]nm and [Formula: see text][Formula: see text]nm. When [Formula: see text] is adjusted to 600[Formula: see text]nm, gold (Au) exhibits the highest absorption (A) at 0.997 (a.u.) with a thickness of [Formula: see text][Formula: see text]nm. Additionally, we calculate sensitivity values for all three metals, with copper (Cu) yielding the highest sensitivity of 101.6 Reflected Index Units (RIU-1) for both [Formula: see text] and 600[Formula: see text]nm. Furthermore, we compute the Figure Of Merit (FOM), with silver (Ag) achieving the highest FOM of 443 at [Formula: see text][Formula: see text]nm and 451 at [Formula: see text][Formula: see text]nm. These results provide important signs about noble metals’ SPR properties in biosensing, and serve as guides for optimizing the biosensors.

Chemically activated Ag-embedded bridged-layer for copper pattern addition on PET film

This article describes a chemically activated method for copper addition on polyethylene terephthalate (PET) films with robust reliability and easy process. Thereof, a bridging layer produced by compatible composite of inorganic AgNO3 and organic epoxy resin (ER) in propylene glycol methyl ether (PM) solvent, was coated on the PET. It was chemically activated when immersed in acetone reagent and sodium borohydride solution, and accordingly the AgNO3 was reduced into Ag monomers as copper catalysts in the next chemical deposition procedure. The as-catalyzed Ag dot is embedded in the bridging layer and thus weaken the interface incompatibility between organic bridging layer and the next deposited metal copper layer. In the chemical plating process, a copper thickness of about 1.5 μm was achieved after 45 min’s plating. Reliability tests that the plated samples were bended by 5000 times at 5-mm and 2-mm radius, were carried out. The results showed the copper layer's resistivity was 0.5 and 0.65 times increasing respectively, in comparison with its originated property and it therefore exhibits excellent fatigue resistance.

Effects of Copper Foam Wall/Obstacles on the Deflagration-to-Detonation Transition

To investigate the process of deflagration-to-detonation transition (DDT) of the copper foam wall in the pulse detonation engine, detonation combustion experiments were carried out using ethylene and oxygen-enriched air (oxygen concentration: 40%) as fuel and oxidant. The effects of copper foam pore size, thickness, installation length, and structure on the flame acceleration were studied experimentally, as were the effects of blockage ratio and mixture equivalence ratio. The results show that among the four pore sizes selected, the 10 PPI case produces the fastest flame development on the porous flat wall. For conditions with successful detonation, the 10 PPI case reduces the DDT distance and time by 34.97 and 42.57%, respectively, compared with the 40 PPI case. Regarding the installation length of copper foam, it is found that copper foam with a large pore size (10 PPI) and a short installation length achieves stable detonation. The general structure of copper foam was also analyzed, including the porous flat wall, porous obstacle, and solid obstacle with the same installation length. These three structures effectively accelerate the initiation of detonation. Particularly, porous obstacles show more pronounced effects on flame acceleration than the commonly used solid obstacles. These results are instructive for optimizing the short-distance ignition ability of pulsed detonation engines.

Weldability and Mechanical Properties of Pure Copper Foils Welded by Blue Diode Laser.

The need to manufacture components out of copper is significantly increasing, particularly in the solar technology, semiconductor, and electric vehicle sectors. In the past few decades, infrared laser (IR) and green laser (GL) have been the primary technologies used to address this demand, especially for small or thin components. However, with the increased demand for energy saving, alternative joint techniques such as blue diode laser (BDL) are being actively explored. In this paper, bead-on-plate welding experiments on 0.2 mm thick pure copper samples employing a BDL are presented. Two sets of parameters were carefully selected in this investigation, namely Cu-1: Power (P) = 200 W; Speed (s) = 1 mm/s; and angle = 0°, and Cu-2: P = 200 W; s = 5 mm/s; and angle = 10°. The results from both sets of parameters produced defect-free full penetration welds. Hardness test results indicated relatively softer weld zones compared with the base metal. Tensile test samples fractured in the weld zones. Overall, the samples welded with Cu-1 parameters showed better mechanical properties, such as strength and elongation, than those welded with the Cu-2 parameters. The tensile strength and elongation obtained from Cu-1 were marginally lower than those of the unwelded pure copper. The outcomes from this research provide an alternative welding technique that is able to produce reliable, strong, and precise joints, particularly for small and thin components, which can be very challenging to produce.