Abstract
This article describes a chemically activated method for copper addition on polyethylene terephthalate (PET) films with robust reliability and easy process. Thereof, a bridging layer produced by compatible composite of inorganic AgNO3 and organic epoxy resin (ER) in propylene glycol methyl ether (PM) solvent, was coated on the PET. It was chemically activated when immersed in acetone reagent and sodium borohydride solution, and accordingly the AgNO3 was reduced into Ag monomers as copper catalysts in the next chemical deposition procedure. The as-catalyzed Ag dot is embedded in the bridging layer and thus weaken the interface incompatibility between organic bridging layer and the next deposited metal copper layer. In the chemical plating process, a copper thickness of about 1.5 μm was achieved after 45 min’s plating. Reliability tests that the plated samples were bended by 5000 times at 5-mm and 2-mm radius, were carried out. The results showed the copper layer's resistivity was 0.5 and 0.65 times increasing respectively, in comparison with its originated property and it therefore exhibits excellent fatigue resistance.
Published Version
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