Kinetic studies on the oxide whisker growth and the oxide film formation on the surface of copper metal powder (1.7 xt average diameter) by oxidation at 250-650°C were carried out by means of a microtopological and thermogravimetric analyses, and were compared with the case of iron powder described in our previous paper.Amounts of the oxide whisker grown inncreased exponentially with temperature and attained maximum at 430°C. Above this temperature they decreased abruptly, and could not be detected at 600°C. Size and amounts of whiskers varied in the following ranges, average diameter: 120 nm, average length: /2, surface density: 108-109cm-2, total volumetric amounts: 10-6-10-7 cm3/cm2. The elongation rate of the whisker obeyed a logarithmic rate law after passing the incubation period of 1.3 min, and the growth stopped after 1.52 hr.The amount of 0, absorbed by the powder (4w) increased gently with a monotonous elapse over more than 1.5-2 hours obeying a logarithmic law (Elovich equation), d(ziw)/dt=k exp {(4w)}, after a rapid increase within first several minutes. The activation energy of the initial absorbing rate, k, increased from 10.7 kcal/mol to 20.6kcal/mol with increasing temperature upto 4 30°C. This acceleration l of the oxide film formation rate at the higher temperature region corresponds to the deceleration of the copper ion supplied to the nucleation sites of the whisker growth.The similar behavior of copper in the whisker growth and the oxide film formation to iron suggests the root growth mechanism of the oxide whisker of copper as well as iron, in which the exposed parts of dislocations in metal are considered as nucleation sites, as described in our previous paper.