The push‐out effect in silicon has been investigated by comparing the effect of similar phosphorus emitter diffusions on previously diffused boron and gallium base diffusions, using junction depth and electrical measurements. The closely similar behavior of the two base dopants suggests that both diffuse by the same mechanism in silicon, despite their different covalent radii. For both dopants the amount of push‐out increases with emitter diffusion time for constant base diffusion and emitter surface concentration, and decreases as base depth increases for constant emitter diffusion and base surface concentration, and it is concluded that push‐out occurs during the emitter diffusion rather than during cooling. The results are discussed with reference to an approximate theory, and agreement between experiment and this theory strongly suggests that push‐out is due to a uniform enhancement of the base diffusivity throughout the emitter diffusion period. This study, using junction depth and electrical profiling techniques only, is the first part of this investigation, the second of which will report results of a radiotracer study of push‐out.
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