Conductive Polymer Composites Research Articles

Comprehensive Investigation of the Temperature-Dependent Electromechanical Behaviors of Carbon Nanotube/Polymer Composites.

The performances of flexible piezoresistive sensors based on polymer nanocomposites are significantly affected by the environmental temperature; therefore, comprehensively investigating the temperature-dependent electromechanical response behaviors of conductive polymer nanocomposites is crucial for developing high-precision flexible piezoresistive sensors in a wide-temperature range. Herein, carbon nanotube (CNT)/polydimethylsiloxane (PDMS) composites widely used for flexible piezoresistive sensors were prepared, and then the temperature-dependent electrical, mechanical, and electromechanical properties of the optimized CNT/PDMS composite in the temperature range from -150 to 150 °C were systematically investigated. At a low temperature of -150 °C, the CNT/PDMS composite becomes brittle with a compressive modulus of ∼1.2 MPa and loses its elasticity and reversible sensing capability. At a high temperature (above 90 °C), the CNT/PDMS composite softens, shows a fluid-like mechanical property, and loses its reversible sensing capability. In the temperature range from -60 to 90 °C, the CNT/PDMS composite exhibits good elasticity and reversible sensing behaviors and its modulus, resistivity, and sensing sensitivity decrease with an increasing temperature. At room temperature (30 °C), the CNT/PDMS composite exhibits better mechanical and piezoresistive stability than those at low and high temperatures. Given that environmental temperature changes have significant effects on the sensing performances of conductive polymer composites, the effect of ambient temperature changes must be considered when flexible piezoresistive sensors are designed and fabricated.

Aqueous Conductive Polymer Composites with Good Printability and Conductivity for Flexible Electronics

Aqueous Conductive Polymer Composites with Good Printability and Conductivity for Flexible Electronics

Unravelling the role of poly(methyl methacrylate) (PMMA) molecular weight in poly(vinylidene fluoride) (PVDF)/PMMA/expanded graphite (ExGr) blend nanocomposites: Insights into morphology, thermal behavior, electrical conductivity, and wetting property

Poly(vinylidene fluoride) (PVDF) based conducting polymer composites with carbon nanomaterials can be used for mechanical energy harvesting through piezoelectric or triboelectric effect. This study aims to investigate the influence of PMMA molecular weight on the electrical, thermal, and wetting properties of PVDF/40 wt.% PMMA blend nanocomposites reinforced with expanded graphite (ExGr). The blend nanocomposites with 40 wt.% PMMA have been prepared by solution blending method by using two different molecular weights of PMMA whose melt flow indices are 2 g/10 min and 2.3 g/10 min. The coexistence of the electroactive gamma and non-polar alpha phases of PVDF in the blend nanocomposites has been confirmed by X-ray diffraction, Fourier transform infrared spectroscopy and differential scanning calorimetry analyses. While overall crystallinity (%) of low molecular weight PMMA employed blend nanocomposites is lower than that of high molecular weight PMMA blended nanocomposites, the electroactive gamma phase has been found to increase in the former blend nanocomposites. The dispersion of graphite nanosheets has been observed to be better in high molecular weight PMMA employed blend nanocomposites which results in higher electrical conductivity. Impedance analysis of PVDF-40 wt.% PMMA-2 wt.% ExGr blend nanocomposite with high molecular weight PMMA results in enhanced interjunction capacitance (74.5 pF) in comparison to low molecular weight PMMA mixed blend nanocomposites (68 pF). Water contact angle (WCA) increases with molecular weight of PMMA and ExGr loading level. Thermogravimetric analysis has shown that the char content (above 500°C) is slightly higher for the blend with low molecular weight PMMA than with high molecular weight PMMA.

Preparation of Highly Thermally Conductive Hexagonal Boron Nitride‐Polyvinyl Alcohol/Polydimethylsiloxane Composite Using Combined Freeze‐Drying and Spatial Confining Forced Network Assembly Method

With the rapid advancement of electronic products, an increasing number of electronic components are being integrated onto chips, leading to a higher power consumption per unit area. Consequently, effective heat dissipation has become increasingly important. To address this heat dissipation challenge, this article introduces and prepares a highly thermally conductive polymer composite based on freeze‐drying, coupled with the spatial confining forced network assembly (SCFNA) method. The freeze‐drying process is used to create a three‐dimensional thermal conductive network. This network provides a well‐defined heat path. The SCFNA method enhances the regularity of the thermal conductive network within the matrix. Ultimately, this results in the significant thermal conductivity enhancement of the polymer composite. After freeze‐drying, when the mass ratio of hexagonal boron nitride to polyvinyl alcohol is 4:1, the sample prepared by SCFNA presents 72.6% higher thermal conductivity than the one obtained through direct infiltration. This achievement holds significant value for the advancement of polymer composites with high‐thermal conductivity and excellent mechanical properties. It can improve the low‐dissipation performance of polymer thermal conductive composite systems, meet the needs of high‐performance and low‐dissipation use of thermal management materials, and reduce the working temperature of electronic chips.

Piezoelectric Layered Structure with Conductive Polymer Composites as a Waveguide Layer: Swelling Monitoring Based on the Propagation of Love-Type Wave

Piezoelectric Layered Structure with Conductive Polymer Composites as a Waveguide Layer: Swelling Monitoring Based on the Propagation of Love-Type Wave

Unleashing the Potential of Boron Nitride Spheres for High‐Performance Thermal Management

AbstractHighly integrated and miniaturized electronic devices require advanced thermal management techniques to improve reliability and performance. Thanks to their high thermal conductivity and electrical insulation, boron nitride nanosheets (BNNSs) are commomly used as fillers to construct thermally conductive polymer composites for heat dissipation. However, the BNNS reinforced composites exhibit anisotropic thermal conductivity due to the anisotropic structure of BNNSs. Micro‐sized boron nitride spheres (BNSs) with isotropic thermal conductivity are considered one of the best solutions. Nevertheless, precisely measuring the thermal conductivity of BNSs remains a challenge, limiting the understanding of the thermal transport mechanism. Herein, we have successfully estimated the thermal conductivity of BNSs using the laser flash method. Factors influencing BNSs’ thermal conductivity, including precursor, polymer binder and sintering temperature, are also investigated. Under optimized conditions, BNSs exhibit high, isotropic thermal conductivity of 37.2±2.5 W/(m ⋅ K), and the BNS pellet outperforms its h‐BN counterpart in heat dissipation for an LED light. This superiority is attributed to outstanding heat transfer performance in the cross‐plane direction, in addition to high in‐plane thermal conductivity. This study provides a feasible method to estimate the thermal conductivity of spherical materials and highlights promising boron nitride materials with isotropic thermal conductivity for heat dissipation in advanced electronics.

Epoxy resin reinforced high-performance conductive composite foam with ultra-wide pressure sensing range

Flexible piezoresistive sensors based on conductive polymer composites (CPCs) have shown great potential and application in smart wearable devices, sports and health monitoring. Nevertheless, the practical use of many CPCs pressure sensors is often limited by their narrow monitoring range and low sensitivity. Here, a thermoplastic urethane/ epoxy resin/ carbon nanotubes/ polydopamine/ Ti3C2TX MXene (TPU/EP/CNT/PDA/MXene) composite foam was prepared using the commonly used freeze-drying and impregnation methods. Due to the high strength of the EP/TPU foam matrix and CNT@MXene's internal and external synergistic conductive network, the TECPMF has outstanding mechanical and conductive properties. As a result, the foam pressure sensor has an extremely wide monitoring range (0∼300 kPa) and a sensitivity of 2.42 kPa−1 (0∼5 kPa). Furthermore, the superior performance of the foam provides fast response (100 ms) and outstanding durability of more than 8000 cycles. The piezoresistive TECPMF sensor can be used for real-time monitoring of human movement, as well as the magnitude and position of various pressures and air pressures. These promise to enable a wide range of smart wearable and engineering applications. This work opens up a new avenue for the design of more advanced piezoresistive sensors.

MXene bridging graphite nanoplatelets for electrically and thermally conductive nanofiber composites with high breathability

Electrically and thermally conductive polymer composites (CPCs) have promising applications in flexible and wearable electronics, and it remains difficult for the trade-off between the electrical and thermal properties and the breathability. We propose a “MXene bridging graphite nanoplatelets (GNPs)” strategy to prepare conductive membranes with high conductivity and excellent breathability. Rigid GNPs are randomly distributed inside polyurethane nanofibers and expand the network. MXene nanosheets are decorated onto the nanofibers and bridge GNPs to reduce the thermal and electrical contact resistance. The synergy of MXene and GNPs improves electrical and thermal conductivity without sacrificing their breathability. The electrical and thermal conductivity of the composites can reach 64.4 S/m and 4.9 W (m K)−1, respectively. In addition, the nanofiber composites with strong interfacial interactions and thus superior durability show outstanding photothermal conversion and heat dissipation capability. This study can provide inspiration for designing multi-functional, breathable CPCs with potential applications in wearable electronics.

Production and properties of electrically conductive polymer composites reinforced with cotton threads

AbstractThe problem of strength loss in electrically conductive composites made with dispersed fillers in the polymer binder is solved by spraying an aerosol of graphite on a textile material with a 3D weave of threads, or on knitwear of fibers with various structure and chemical composition. The loose microstructure of cotton fibers and the developed surface of elastic filaments made of synthetic polymers retain colloidal graphite particles in a layered composite during cyclic deformation. The electrical conductivity of knitwear with graphite changes during stretching due to the reversible displacement of graphite particles, first during straightening and then during stretching of elastic threads. The 130 ± 5 strain sensitivity GF and 12,000 ± 95 кPa−1 stress sensitivity QF of the composites presented in this paper exceed the corresponding parameters of known electrically conductive composites. The combination of a significant change in electrical conductivity with the elasticity of the developed knitwear‐based composite is important for the use in load cells, smart clothes, medical devices, and robotics.

Mechanically and Thermally Guided, Honeycomb-like Nanocomposites with Strain-Insensitive High Thermal Conductivity for Stretchable Electronics.

Thermal management materials have become increasingly crucial for stretchable electronic devices and systems. Drastically different from conventional thermally conductive materials, which are applied at static conditions, thermal management materials for stretchable electronics additionally require strain-insensitive thermal conductivity, as they generally undergo cyclic deformation. However, realizing such a property remains challenging mainly because conventional thermally conductive polymer composites generally lack a mechanically guided design. Here, we report a honeycomb-like nanocomposite with a three-dimensional (3D) thermally conductive network fabricated by an arrayed ice-templating technique followed by elastomer infiltration. The hexagonal honeycomb-like structure with thin, compact walls (≈ 40 μm) endows our composite with a high through-plane thermal conductivity (≈ 1.54 W m-1 K-1) at an ultralow boron nitride nanosheet (BNNS) loading (≈ 0.85 vol %), with an enhancement factor of thermal conductivity up to 820% and thermal-insensitive strain up to 200%, which are 2.7 and 2 times higher than those reported in the literature. We report an intelligent strategy for the development of advanced thermal management materials for high-performance stretchable electronics.

Self-healing thermally conductive polymer composites based on polyvinyl alcohol with dynamic borate ester and hydrogen bonds

Traditional thermally conductive polymer materials exhibit a propensity for damage when applied in dynamic environments, which leads to shortened service life and suboptimal utilization of resources. Herein, polyvinyl alcohol (PVA)-based thermally conductive composites with a self-healing capability are prepared based on dynamic borate ester bonds and hydrogen bonds. Poly(dopamine) functionalized graphene oxide (denoted as PGO) is used as a thermally conductive filler to achieve a high thermal conductivity (TC) of 0.79 W/(m·K) for the PGO/PVA composites, which is 527% of pure PVA (0.15 W/(m·K)). The improved TC of PGO/PVA composites is mainly attributed to the reduction in interface thermal resistance and the construction of heat conduction channels. Additionally, the PGO/PVA composites display a self-healing efficiency higher than 60% at room temperature without external simulation. Furthermore, the as-prepared PGO/PVA composites exhibit excellent mechanical properties, with a tensile strength of 409 kPa and an elongation at break of 479%, respectively. This work provides a promising strategy for fabricating thermally conductive polymer composites, which can be deployed as thermal interface materials for long-term applications.

Thermally Conductive Polymer Composites with Hexagonal Boron Nitride for Medical Device Thermal Management

Polymer composites with hexagonal boron nitride (hBN) have the potential to meet the heat dissipation and electrical insulation requirements of electronic and medical devices. In this study, hBN/polymer composites were fabricated with thermoplastic polyurethane (TPU) and epoxy as matrix materials. Three hBN powder types (BN1, BN2, BN3) with different platelet sizes and degrees of agglomeration were used. BN1 (with average size of 1 μm) and BN2 (with average size of 12 μm) mainly contained hBN platelets, while BN3 (with average size of 20 μm) contained both platelets and agglomerates of platelets. BN2 gave the highest thermal conductivity, while BN1 gave the lowest thermal conductivity. Thermal simulations were performed for a medical device with a limit for the maximum surface temperature. For the encapsulation of this device, several material combinations were simulated, using anisotropic thermal conductivity data. This included encapsulations with inner layers of commercial thermally and electrically conductive materials and an outer layer of the best thermally conductive (and electrically insulating) hBN/TPU composite fabricated by the authors.

Regulated orientation and exfoliation of flaky fillers by close packing structures in polymer composites for excellent thermal conduction and EMI shielding

Efficient heat dissipation and electromagnetic interference (EMI) shielding are essential demands on packaging intensively integrated circuits in advanced electronics. Multicompetent polymer composites with thermal conduction and EMI shielding capacity have attracted tremendous interest in the material science community. Herein, we report the preparation of thermally conductive polymer composites with superior EMI shielding effectiveness (SE) by building a 3D interconnected conductive network under close-packing circumstances. The build of the 3D network relies on the coordinated stacking of flaky and spherical fillers, where the asymmetric graphite flakes (FG) are confined in the interstitial regions of the close-packing structures of hollow glass microspheres (HGμS). The “rigid” close-packing structure of HGμS inhibits the in-plane orientation of FG along the flow direction during melt processing and facilitates the exfoliation of FG under external forces producing a conductive network with enhanced interconnectedness. The model system comprised of thermoplastic polyurethane (TPU), FG and HGμS has attained in-plane and through-plane thermal conductivity of 20.54 W m−1 K−1 and 6.55 W m−1 K−1 with 30 vol% FG (while maintaining a low mass density of 1.15 g cm−3, identical to neat TPU). Meanwhile, a high EMI SE of 69 dB has been achieved at a thickness of 1 mm.

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

AbstractThermally conductive polymeric composites with low dielectric constant are highly promising for the packaging materials in the field of modern communication. Therefore, the synergistic improvement of low dielectric constant and high thermal conductivity has become a current research hotspot. In this work, we propose a one‐step alkylation of boron nitride nanosheet (BNNS) with ultrasonic stratification using 1‐hexanol, and then hot press the films to make Alkyl‐BNNSs orient in the fluorinated polyimide (f‐PI). The resulting Alkyl‐BNNS/f‐PI composite successfully realizes the synergistic improvement of thermal property and dielectric properties, exhibiting a high heat conductivity coefficient of 2.36 Wm−1 K−1 with a filler content of 4.99 wt.%. Moreover, the permittivity and dielectric loss of the film are as low as 1.76 and 0.0065 at 1 MHz, respectively. This work provides a facile strategy for breaking the bottleneck of making polyimide composites simultaneously with high thermal conduction and low dielectric performance.Highlights The composite exhibits a high heat‐conducting coefficient of 2.36 Wm−1 K−1. Ultra‐low dielectric constant of 1.76 was achieved by the modification of film. Excellent breakdown resistance and flexibility were endowed with the composites.

Effect of microcarbon particle size and dispersion on the electrical conductivity of LLDPE-carbon composite

This experimental research aimed to develop a conductive polymer composite (CPC) material for electromechanical devices. The composite was made by incorporating conductive micro carbon derived from rice husks into a Linear Low-Density Polyethylene (LLDPE) polymer matrix using hot compaction. Variations of filler composition were used, with carbon loading of 50%, 45%, and 40%, and mesh sizes of #150, #200, and #250. The experimental results showed that particle size variations did not significantly affect composite density, but higher mesh selection improved filler dispersion within the matrix, resulting in higher electrical conductivity values. The optimal conductivity value of 9.43E-04 S/cm was achieved with a micro-carbon composition of 50% loading. However, decreasing micro carbon loading had a more significant impact on reducing electrical conductivity values.

Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites

Herein, the coupling relationship between molecule structure and ion conductivity in silica filled silicone gel are established. Based on the broadband dielectric spectrum, the concentration of ion charges and ions diffusion coefficients, two key roles for ion conductivity, are calculated. The concentration of ion charges is increased by about four orders of magnitude after the addition of silica. Because of the more short-length chains conformations and more amorphous regions at interfaces, the chains at interfaces are easier to rearrange with higher relaxation frequency, which enhances the ions diffusion process and contributes to negative decoupling exponents between the interface molecule relaxations and ion diffusion coefficients in silicone gel composites. With the increase of fumed silica loading, the ionic conductivity increases first and decreases owing to percolation phenomenon about silica dispersion. Meanwhile, decoupling exponents of the interface molecules are closer to 0. Our findings deepen the understanding how the interface structures act on ions conductivity in insulating polymer composites, which is critical to rationally design interface structures for manipulating the insulation performances.

Advances in Monte Carlo Method for Simulating the Electrical Percolation Behavior of Conductive Polymer Composites with a Carbon-Based Filling.

Conductive polymer composites (CPCs) filled with carbon-based materials are widely used in the fields of antistatic, electromagnetic interference shielding, and wearable electronic devices. The conductivity of CPCs with a carbon-based filling is reflected by their electrical percolation behavior and is the focus of research in this field. Compared to experimental methods, Monte Carlo simulations can predict the conductivity and analyze the factors affecting the conductivity from a microscopic perspective, which greatly reduces the number of experiments and provides a basis for structural design of conductive polymers. This review focuses on Monte Carlo models of CPCs with a carbon-based filling. First, the theoretical basis of the model's construction is introduced, and a Monte Carlo simulation of the electrical percolation behaviors of spherical-, rod-, disk-, and hybridfilled polymers and the analysis of the factors influencing the electrical percolation behavior from a microscopic point of view are summarized. In addition, the paper summarizes the progress of polymer piezoresistive models and polymer foaming structure models that are more relevant to practical applications; finally, we discuss the shortcomings and future research trends of existing Monte Carlo models of CPCs with carbon-based fillings.

Synthesis, characterization and analysis of conducting polymer composites toward dye adsorption

The present effort reports on the synthesis of novel and recyclable polymer-based adsorbents based on polypyrrole (PPy) and polyethyleneimine (PEI) for the removal of cationic crystal violet (CV) dye from aqueous solutions. The characterization of the composites was determined by FTIR, XRD, FESEM, and XPS techniques. The effects of different variables on the adsorption of crystal violet dye were studied, including the pH, adsorbent doses, and contact time. The research findings show that the different oxidants used to prepare polypyrrole in PPy-PEI adsorbents play a vital role in CV dye adsorption. The PPy-PEI composite prepared by using the ammonium persulfate oxidant was found to exhibit the highest adsorption of 70.9% among the three different oxidants, namely, anhydrous ferric chloride, ferric chloride hexahydrate, and ammonium persulfate. The ideal adsorption conditions for the removal of CV dye were discovered using an adsorbent dosage of 0.3 g at pH 11, with a contact time of 180 min. Kinetic regression analysis indicated that the adsorption processes followed the pseudo-second order kinetic model and fit well with the Langmuir isotherm, with a maximum monolayer sorption capacity of 142.86 mg/g at a temperature of 27 °C. In addition, the regeneration of the PPy-PEI composite was accomplished with dye adsorption efficiency decreasing from 70.9% to 64.4% after three adsorption-desorption cycles. The present work suggests that the PPy-PEI composite is a promising adsorbent for removing cationic CV dye in aqueous solutions.

Synthesis of polysaccharide/polyaniline composites by sol–gel method

ABSTRACT In this study, we report a novel synthesis technique for polysaccharides and conducting polymer composites. A series of polysaccharide/polyaniline composites were prepared via double-step polymerization by a sol–gel method developed herein. The chemical structure and the electronic properties of the composites were analyzed through Fourier transform infrared, ultraviolet–visible, and electron spin resonance spectroscopies. Composites with long effective conjugation lengths were obtained because the gelatinized polysaccharide acted as a template and host for the composite.

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges.

With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.