Summary To improve breakdown voltage for silicon high voltage thyristors, a slanted circular groove with precision form accuracy is required on a silicon element. Considering various forming processes, grinding has been selected as the best process to obtain a precision slanted groove. This paper presents a new grinding process concept. An original structure grinding machine, which is to assure an inclined infeed into the rotating work-piece, has been developed. Grinding wheels have been newly designed, composed of two wheels with different diameters and shapes forced together into a composite grinding wheel. By developing a grinding machine and the paired grinding wheels, all necessary precision slanted grooves have been ground with 60° inclined angle, 7.7 to 44.8 mm radius, 0.2 to 0.5 mm depth and 0.2 to 0.8 mm width. By establishing a high level form accuracy, efficiency and yield, this grinding process has been put to excellent use in a thyristor production line.