Lightweight boron carbon nitride foams which are a hybrid of graphene and hexagonal boron nitride (hBN), are produced using the nickel template method and remain freestanding after the etching of nickel without the stabilization of a polymer during etching. Chemical vapor deposition (CVD) precursors with varying carbon content were utilized, but only a 10% range of carbon atomic percentage variation is observed in the resulting boron carbon nitride foams due to the high carbon solubility of nickel. However, the cooling rate during the CVD process has a much more significant effect on the carbon content. Moreover, a 6.5-fold increase in resistivity is observed for our foams compared to a graphene foam with an overall trend of decreasing resistance with increasing carbon content. Furthermore, when the foam is infiltrated with epoxy to form a composite at 0.3% volumetric percentage concentration, there is a 27% increase in the thermal conductivity over hBN foam composites. These foams are suitable to use as a substitute for graphene foams when a lower electrical conductivity is desired and could potentially be used as a thermal interface material if a higher pore density nickel template is utilized.