College Of Nanoscale Science And Engineering Research Articles

The College of Nanoscale Science and Engineering: a 21st century paradigm for nanotechnology-enabled education, innovation, and economic development

AbstractThis report summarizes the pioneering educational curricula, world-class technological capabilities, and unmatched economic impact of the College of Nanoscale Science and Engineering (CNSE) of the University at Albany-State University of New York. The combination of advanced 300-mm lithography, 3Di, and fully integrated processing capabilities, combined with a strong academic background in materials characterization and metrology, allows the NanoCollege to offer a unique test bed for advanced device and circuit concepts.

13nm gate Intentional Defect Array (IDA) wafer patterning by e-beam lithography for defect metrology evaluation

Fabricating and inspecting wafers with defects intentionally created at known locations enables a quantitative and repeatable methodology to assess the performance of in-line defect metrology tools with regard to ITRS requirements. With each successive design node, in-line defect inspection technology becomes more challenging and there are significant concerns about the capability to support 2× and 1× technology nodes. In this paper we report progress at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York, to print and process advanced defect metrology test structures intended to represent a 13nm gate length. The ISMI 13nm gate Intentional Defect Array (IDA) has lithographic defects in known locations with sizes varying from 25% to 400% of the corresponding 32nm node, resulting in defect sizes ranging from 8 to 128nm. The film stack consists of 30nm TEOS hard mask, 60nm polysilicon, 35nm TiN and 2nm HfO2 on top of silicon. The patterns are first printed (at 1×) on a 300mm wafer using a Vistec VB300 electron beam lithography tool with a high resolution HSQ resist (commercially known as Dow Corning XR-1541). The features are subsequently etched to transfer the pat- tern from the resist onto the wafer stack. The resulting IDA wafers are intended to help ISMI engineers investigate next generation metrology techniques and identify solutions for future technology nodes.

Nanotechnology’s triple helix: a case study of the University at Albany’s College of Nanoscale Science and Engineering

In 2001, New York State teamed with IBM to create a research center for nanoelectronics at the University at Albany. Since then, the College of Nanoscale Science and Engineering (CNSE) has been expanded with over $6 billion in investment, attracted over 250 industrial collaborators, and awarded 72 graduate degrees. This paper discusses the formation of the triple helix center in Albany, NY. It then examines the impact of the CNSE on the regional economy and compares it with three other nanotechnology triple helix centers. The analysis finds that the CNSE is more successful at generating nanoknowledge as measured by publications and patents. Much of the research conducted at CNSE has been collaborative effort between university and industrial partners and often resulted in patents assigned to industrial partners. Since 2001, there has been qualitative and quantitative evidence of the emergence of a nanotechnology cluster in the Capital Region of NY. Upstate NY has become home to multiple nanotechnology firms and experienced growth in the employment in nanotechnology related industries. Potential explanations for the success of the CNSE are explored including the anchor tenant hypothesis and the entrepreneurial university.

Implementation of a Curriculum Leading to a Baccalaureate Degree in Nanoscale Science

AbstractThe College of Nanoscale Science and Engineering (CNSE) at the University at Albany has developed an academic curriculum leading to the degree of Bachelor of Science in Nanoscale Science. This curriculum represents a 132-credit program designed for completion in eight academic semesters and is consistent with the SUNY General Education Program requirements as implemented at the University at Albany. This curriculum comprises a cutting-edge, inherently interdisciplinary, academic program centered on scholarly excellence, educational quality, and technical and pedagogical innovation. The blueprint for this curriculum is comprised of four basic components: a “Foundational Principles”’ component, a “Core Competency” component, a “Concentration” component and a “Capstone Research/Design” component. The first two components are designed to integrate the dissemination of fundamental, cross-disciplinary, nanoscale science and engineering principles with the cultivation of the critical skill set necessary for advanced undergraduate coursework and interdisciplinary research. The remaining two components expand on these foundational skills to develop the topical expertise, technical depth, and independent research abilities that are essential to a well-rounded undergraduate educational experience. The combination of these instructional tools ensures a customizable and coherent undergraduate degree program that trains the student's intellect how to explore, discover, and innovate, while ensuring its proficiency in a specific nanoscale discipline. The outcome is a unique undergraduate experience that taps into CNSE's global academic leadership in nanoscale science and engineering to attract and educate a diverse and talented pool of qualified scientists and engineers at the baccalaureate level.

Low-power MOEMS components for active optical systems

The eventual widespread insertion of microoptoelectromechanical systems (MOEMS) into the marketplace rests fundamentally on the ability to produce viable components that maximize optical performance while minimizing power consumption and size. Active control of surface topology allows for one component to perform multiple functions, thus reducing cost and complexity. Based on the patented MEMS compound grating (MCG), extension of the research at the College of Nanoscale Science and Engineering (CNSE) at the University of Albany, New York, to novel designs, materials, and fabrication methods yielded low-power, high-performance prototypes. The main focus of this work is on the development of a polymer version (including a sacrificial layer, in some designs) of the MCG, which allows for ease of fabrication and a reduced electrostatic actuation voltage. Following a system design effort, several generations of the component are fabricated to optimize the process flow. Component metrology, electromechanical characterization, and initial results of optical tests are reported. A second example presented is the design and prototype fabrication of a spring micrograting using a customized SOI process. This highly flexible component builds on the MCG concept and yields an order of magnitude reduction in actuation voltage.